COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES HAVING EMI SHIELDING PROPERTIES
First Claim
1. An EMI shielding, thermally-conductive interface assembly comprising a sheet of shielding material sandwiched between first and second layers of thermal interface material and configured to restrict transmission of electromagnetic interference through the EMI shielding, thermally-conductive interface assembly.
1 Assignment
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Accused Products
Abstract
According to various aspects of the present disclosure, exemplary embodiments are disclosed of EMI shielding, thermally-conductive interface assemblies. In various exemplary embodiments, an EMI shielding, thermally-conductive interface assembly includes a thermal interface material and a sheet of shielding material, such as an electrically-conductive fabric, mesh, foil, etc. The sheet of shielding material may be embedded within the thermal interface material and/or be sandwiched between first and second layers of thermal interface material.
47 Citations
26 Claims
- 1. An EMI shielding, thermally-conductive interface assembly comprising a sheet of shielding material sandwiched between first and second layers of thermal interface material and configured to restrict transmission of electromagnetic interference through the EMI shielding, thermally-conductive interface assembly.
- 13. An EMI shielding, thermally-conductive interface assembly comprising a thermal interface material and a sheet of shielding material embedded within the thermal interface material.
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25. A method relating to heat dissipation from and EMI shielding for at least one generating component of a circuit board, the method comprising positioning an assembly, which comprises a sheet of shielding material embedded in a thermal interface material, such that a thermally-conductive heat path is defined from the at least one heat generating component through the thermal interface material and the sheet of shielding material, and such that transmission of EMI to and/or from the heat generating component is restricted.
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26. A method for making an EMI shielding, thermally-conductive interface assembly having an upper surface and a lower surface, the method comprising applying thermal interface material to an electrically-conductive fabric having a plurality of interstices such that the electrically-conductive fabric is embedded in the thermal interface material and such that at least a portion of the thermal interface material is disposed within at least one of the plurality of interstices to provide a thermally-conductive path between the upper surface and the lower surface and restrict transmission of EMI through the thermally-conductive interface assembly.
Specification