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COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES HAVING EMI SHIELDING PROPERTIES

  • US 20120061135A1
  • Filed: 09/14/2010
  • Published: 03/15/2012
  • Est. Priority Date: 09/14/2010
  • Status: Abandoned Application
First Claim
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1. An EMI shielding, thermally-conductive interface assembly comprising a sheet of shielding material sandwiched between first and second layers of thermal interface material and configured to restrict transmission of electromagnetic interference through the EMI shielding, thermally-conductive interface assembly.

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