INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
First Claim
1. A method of manufacture of an integrated circuit packaging system comprising:
- providing a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side;
mounting an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side;
connecting stack connectors to the substrate top side;
applying a multi-layer film over the substrate top side, the integrated circuit, and the stack connectors, the multi-layer film having a base film layer, a penetrable film layer, and a penetrable adhesive;
removing the base film layer and the penetrable film layer to expose the penetrable adhesive and exposed portions of the stack connectors; and
forming an adhesive film layer by hardening the penetrable adhesive.
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Accused Products
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side; mounting an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side; connecting stack connectors to the substrate top side; applying a multi-layer film over the substrate top side, the integrated circuit, and the stack connectors, the multi-layer film having a base film layer, a penetrable film layer, and a penetrable adhesive; removing the base film layer and the penetrable film layer to expose the penetrable adhesive and exposed portions of the stack connectors; and forming an adhesive film layer by hardening the penetrable adhesive.
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Citations
20 Claims
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1. A method of manufacture of an integrated circuit packaging system comprising:
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providing a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side; mounting an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side; connecting stack connectors to the substrate top side; applying a multi-layer film over the substrate top side, the integrated circuit, and the stack connectors, the multi-layer film having a base film layer, a penetrable film layer, and a penetrable adhesive; removing the base film layer and the penetrable film layer to expose the penetrable adhesive and exposed portions of the stack connectors; and forming an adhesive film layer by hardening the penetrable adhesive. - View Dependent Claims (2, 3, 4, 5)
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6. A method of manufacture of an integrated circuit packaging system comprising:
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providing a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side; mounting an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side; connecting device connectors to the substrate top side and the active side; connecting stack connectors to the substrate top side; applying a multi-layer film over the substrate top side, the integrated circuit, and the stack connectors, the multi-layer film having a base film layer, a penetrable film layer, and a penetrable adhesive; removing the base film layer and the penetrable film layer to expose the penetrable adhesive and exposed portions of the stack connectors; and forming an adhesive film layer by hardening the penetrable adhesive. - View Dependent Claims (7, 8, 9, 10)
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11. An integrated circuit packaging system comprising:
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a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side; an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side; stack connectors connected to the substrate top side; an adhesive film layer over the substrate top side covering the integrated circuit and portions of the stack connectors; and exposed portions of the stack connectors with a portion of the adhesive film layer adhered to the stack connectors above a film top surface of the adhesive film layer characteristic of a penetrable adhesive penetrated by the stack connectors. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification