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SEMICONDUCTOR PACKAGE INTEGRATED WITH CONFORMAL SHIELD AND ANTENNA

  • US 20120062439A1
  • Filed: 08/08/2011
  • Published: 03/15/2012
  • Est. Priority Date: 09/09/2010
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a semiconductor die, the semiconductor die having an integrated circuit portion and a substrate portion, the integrated circuit portion having an active surface and the substrate portion having an inactive surface;

    a via extending from the inactive surface and electrically connected to the integrated circuit portion;

    an electromagnetic interference shield disposed on the inactive surface and electrically connected to the via;

    a package body encapsulating portions of the die and the electromagnetic interference shield, the package body having an upper surface;

    a feeding element extending from the upper surface and electrically connected to the integrated circuit portion; and

    an antenna disposed on the upper surface and electrically connected to the feeding element.

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