SEMICONDUCTOR PACKAGE INTEGRATED WITH CONFORMAL SHIELD AND ANTENNA
First Claim
1. A semiconductor package, comprising:
- a semiconductor die, the semiconductor die having an integrated circuit portion and a substrate portion, the integrated circuit portion having an active surface and the substrate portion having an inactive surface;
a via extending from the inactive surface and electrically connected to the integrated circuit portion;
an electromagnetic interference shield disposed on the inactive surface and electrically connected to the via;
a package body encapsulating portions of the die and the electromagnetic interference shield, the package body having an upper surface;
a feeding element extending from the upper surface and electrically connected to the integrated circuit portion; and
an antenna disposed on the upper surface and electrically connected to the feeding element.
1 Assignment
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Accused Products
Abstract
A semiconductor package integrated with conformal shield and antenna is provided. The semiconductor package includes a semiconductor element, an electromagnetic interference shielding element, a dielectric structure, an antenna element and an antenna signal feeding element. The electromagnetic interference shielding element includes an electromagnetic interference shielding film and a grounding element, wherein the electromagnetic interference shielding film covers the semiconductor element and the grounding element is electrically connected to the electromagnetic interference shielding layer and a grounding segment of the semiconductor element. The dielectric structure covers a part of the electromagnetic interference shielding element and has an upper surface. The antenna element is formed adjacent to the upper surface of the dielectric structure. The antenna signal feeding element passing through the dielectric structure electrically connects the antenna element and the semiconductor element.
130 Citations
20 Claims
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1. A semiconductor package, comprising:
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a semiconductor die, the semiconductor die having an integrated circuit portion and a substrate portion, the integrated circuit portion having an active surface and the substrate portion having an inactive surface; a via extending from the inactive surface and electrically connected to the integrated circuit portion; an electromagnetic interference shield disposed on the inactive surface and electrically connected to the via; a package body encapsulating portions of the die and the electromagnetic interference shield, the package body having an upper surface; a feeding element extending from the upper surface and electrically connected to the integrated circuit portion; and an antenna disposed on the upper surface and electrically connected to the feeding element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor package, comprising:
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a semiconductor die, the semiconductor die having an integrated circuit portion and a substrate portion, the integrated circuit portion having an active surface and the substrate portion having an inactive surface; a via extending from the inactive surface and electrically connected to the integrated circuit portion; an electromagnetic interference shield disposed on the inactive surface and electrically connected to the via; a dielectric layer disposed over the electromagnetic interference shield, the dielectric layer having an upper surface; a feeding element extending from the upper surface and electrically connected to the integrated circuit portion; and an antenna disposed on the upper surface and electrically connected to the feeding element. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A method of making a semiconductor package, comprising:
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forming, in an integrated circuit of a semiconductor die, a grounding segment; forming a conductive via in the semiconductor die useable as a grounding element; disposing an electromagnetic interference shield above an upper surface of a silicon substrate of the semiconductor die; and connecting the electromagnetic interference shield to the grounding segment using the conductive via as the grounding element. - View Dependent Claims (19, 20)
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Specification