COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME

• US 20120063090A1
• Filed: 09/09/2010
• Published: 03/15/2012
• Est. Priority Date: 09/09/2010
• Status: Abandoned Application

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: HSIAO, Yi-Li, YU, Chen-Hua, SHIH, Da-Yuan, TUNG, Chih-Hang, YU, Chun Hui
• Application Number:
  US12/878,319
• Publication Number:
  US 20120063090A1
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H01L 2224/14181 On opposite sides of the body
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 2225/06565 the devices having the same size and there being no auxiliary carrier between the devices
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/44 the complete device being wholly immersed in a fluid other than air H01L23/427 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/14 of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1431 : Logic devices
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1434 : Memory
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/157 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

Abstract

An apparatus for cooling a stacked die package comprises a substrate, a first die above the substrate, a second die above the first die, and a housing containing the first and second dies. The housing seals the first and second dies from the environment. The apparatus further includes a cooling fluid in fluid communication with the first die and the second die to transfer the heat from the dies to the housing.

Claims

1. An apparatus for cooling a stacked die package, comprising:

a substrate;

a first die above the substrate;

a second die above the first die;

a housing containing the first and second dies, the housing sealing the first and second dies from the environment; and

a cooling fluid in fluid communication with the first die and the second die.

2. The apparatus of claim 1, wherein an outside surface of the housing comprises a plurality of fins for heat dissipation.

3. The apparatus of claim 1, wherein the housing is made from a material selected from the group consisting of aluminum, copper, silver, silicon, steel, and silicon carbide.

4. The apparatus of claim 1, wherein the cooling fluid is a liquid.

5. The apparatus of claim 1, wherein the cooling fluid is a fluid selected from the group consisting of oil, dielectric oil, water, a mixture of water and an anti-freezing agent, freon, potassium formate, and a perfluorinate coolant.

6. The apparatus of claim 1, wherein the cooling fluid is a two-phase state liquid.

7. The apparatus of claim 1, wherein the housing further includes a first opening and a second opening, the first and second openings being vertically displaced from one another, the apparatus further comprising a conduit having one end connected to the first opening and the other end connected to the second opening, the conduit for circulating the cooling liquid from the first opening to the second opening.

8. The apparatus of claim 7, further comprising a pump coupled to the conduit for pumping the cooling fluid from the first opening to the second opening.

9. The apparatus of claim 8, wherein the pump pumps the cooling fluid from a bottom region of the housing containing the first die to an upper region of the housing.

10. The apparatus of claim 7, further comprising a heat sink thermally coupled to the conduit for cooling the cooling fluid.

11. The apparatus of claim 1, further comprising an apparatus for deionizing ions in the cooling fluid.

12. The apparatus of claim 1, further comprising a pressure release apparatus for releasing pressure built-up in the housing.

13. An apparatus for cooling a multi-chip package system, comprising:

a multi-chip package having two or more dies;

a housing containing the multi-chip package, the housing sealing the multi-chip package from the environment; and

a cooling fluid in fluid communication with the two or more dies.

14. The apparatus of claim 13, wherein the multi-chip package includes a stacked die package.

15. The apparatus of claim 13, wherein an outside surface of the housing includes a plurality of fins for heat dissipation.

16. The apparatus of claim 13, wherein the cooling fluid is a fluid selected from the group consisting of oil, dielectric oil, water, a mixture of water and an anti-freezing agent, freon, potassium formate, and a perfluorinate coolant.

17. The apparatus of claim 13, wherein the cooling fluid comprises a liquid or a two-phase state liquid.

18. The apparatus of claim 13, wherein the housing further includes a first opening and a second opening, the first and second openings being vertically displaced from one another, the apparatus further comprising a conduit having one end connected to the first opening and the other end connected to the second opening, the conduit for circulating the cooling liquid from the first opening to the second opening.

19. The apparatus of claim 18, further comprising a pump coupled to the conduit for pumping the cooling fluid from the first opening to the second opening.

20. The apparatus of claim 13, further comprising an apparatus for deionizing ions in the cooling fluid.

21. The apparatus of claim 13, further comprising a pressure release apparatus for releasing pressure built-up in the housing.

22. A stacked die package comprising:

a substrate;

a first die above the substrate;

a second die above the first die;

a housing containing the first and second dies, the housing sealing the first die and the second die from the environment; and

a cooling fluid in fluid communication with the first die and the second die.

23. The stacked die package of claim 22, wherein an outside surface of the housing comprises a plurality of fins for heat dissipation.

24. The stacked die package of claim 22, wherein the cooling fluid comprises a liquid or a two-phase state liquid.

25. The stacked die package of claim 22, wherein the housing further includes a first opening and a second opening, the first and second openings being vertically displaced from one another, the apparatus further comprising a conduit having one end connected to the first opening and the other end connected to the second opening, the conduit for circulating the cooling liquid from the first opening to the second opening.

26. The stacked die package of claim 25, further comprising a pump coupled to the conduit for pumping the cooling fluid from the first opening to the second opening.

27. The stacked die package of claim 22, further comprising an apparatus for deionizing ions in the cooling fluid.

28. The stacked die package of claim 22, further comprising a pressure release apparatus for releasing pressure built-up in the housing.

29. A method of manufacturing a stacked die package, comprising:

providing a substrate;

placing a first die over the substrate;

bonding the first die to the substrate;

placing a second die over the first die;

bonding the second die to the first die;

placing a housing over the first die and the second die, the housing sealing the first die and the second die from the environment; and

adding a cooling fluid in fluid communication with the first die and the second die.

30. The method of claim 29, wherein the housing further includes a first opening and a second opening, the first and second openings being vertically displaced from one another, the apparatus further comprising a conduit having one end connected to the first opening and the other end connected to the second opening, the conduit for circulating the cooling liquid from the first opening to the second opening.

31. The method of claim 29, further comprising a pump coupled to the conduit for pumping the cooling fluid from the first opening to the second opening.

32. A method of manufacturing a stacked die package, comprising:

bonding a first die to a second die;

placing the first die bonded to the second die over the substrate;

placing a housing over the first die and the second die, the housing sealing the first die and the second die from the environment; and

adding a cooling fluid in fluid communication with the first die and the second die.