COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME
First Claim
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1. An apparatus for cooling a stacked die package, comprising:
- a substrate;
a first die above the substrate;
a second die above the first die;
a housing containing the first and second dies, the housing sealing the first and second dies from the environment; and
a cooling fluid in fluid communication with the first die and the second die.
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Abstract
An apparatus for cooling a stacked die package comprises a substrate, a first die above the substrate, a second die above the first die, and a housing containing the first and second dies. The housing seals the first and second dies from the environment. The apparatus further includes a cooling fluid in fluid communication with the first die and the second die to transfer the heat from the dies to the housing.
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Citations
32 Claims
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1. An apparatus for cooling a stacked die package, comprising:
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a substrate; a first die above the substrate; a second die above the first die; a housing containing the first and second dies, the housing sealing the first and second dies from the environment; and a cooling fluid in fluid communication with the first die and the second die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An apparatus for cooling a multi-chip package system, comprising:
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a multi-chip package having two or more dies; a housing containing the multi-chip package, the housing sealing the multi-chip package from the environment; and a cooling fluid in fluid communication with the two or more dies. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A stacked die package comprising:
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a substrate; a first die above the substrate; a second die above the first die; a housing containing the first and second dies, the housing sealing the first die and the second die from the environment; and a cooling fluid in fluid communication with the first die and the second die. - View Dependent Claims (23, 24, 25, 26, 27, 28)
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29. A method of manufacturing a stacked die package, comprising:
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providing a substrate; placing a first die over the substrate; bonding the first die to the substrate; placing a second die over the first die; bonding the second die to the first die; placing a housing over the first die and the second die, the housing sealing the first die and the second die from the environment; and adding a cooling fluid in fluid communication with the first die and the second die. - View Dependent Claims (30, 31)
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32. A method of manufacturing a stacked die package, comprising:
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bonding a first die to a second die; placing the first die bonded to the second die over the substrate; placing a housing over the first die and the second die, the housing sealing the first die and the second die from the environment; and adding a cooling fluid in fluid communication with the first die and the second die.
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Specification