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COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME

  • US 20120063090A1
  • Filed: 09/09/2010
  • Published: 03/15/2012
  • Est. Priority Date: 09/09/2010
  • Status: Abandoned Application
First Claim
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1. An apparatus for cooling a stacked die package, comprising:

  • a substrate;

    a first die above the substrate;

    a second die above the first die;

    a housing containing the first and second dies, the housing sealing the first and second dies from the environment; and

    a cooling fluid in fluid communication with the first die and the second die.

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