×

ALD SYSTEMS AND METHODS

  • US 20120064245A1
  • Filed: 02/26/2010
  • Published: 03/15/2012
  • Est. Priority Date: 02/27/2009
  • Status: Active Grant
First Claim
Patent Images

1. A reaction chamber assembly (3000, 8100) for depositing thin film layers onto one or more substrates comprising:

  • an outer wall assembly for enclosing a hollow chamber comprising substantially opposing top and bottom outer walls (3010, 3020) attached to substantially opposing left and right outer side walls (3030, 3040) and substantially opposing front and back outer walls (3042, 3044);

    a gas supply module for delivering one or more gas and vapor phase materials into the hollow chamber;

    a vacuum pump for removing gas and vapor phase materials from the hollow chamber;

    characterized in that the reaction chamber assembly further comprises;

    an input rectangular aperture (3140) extending through one of the left and right outer side walls (3030), (3040);

    an output rectangular aperture (3130) extending through the other of the left and right outer side walls (3040) wherein the input rectangular aperture and the output rectangular aperture are opposing with substantially identical aperture dimensions;

    an input plenum (3150) disposed external to the outer wall assembly and in fluid communication with the gas supply module for delivering the one or more gas and vapor phase materials into the hollow chamber through the input rectangular aperture; and

    ,an output plenum (3250) disposed external to the outer wall assembly and in fluid communication with the vacuum pump for removing gas and vapor phase materials from the hollow chamber through the output rectangular aperture.

View all claims
  • 9 Assignments
Timeline View
Assignment View
    ×
    ×