ALD SYSTEMS AND METHODS
First Claim
1. A reaction chamber assembly (3000, 8100) for depositing thin film layers onto one or more substrates comprising:
- an outer wall assembly for enclosing a hollow chamber comprising substantially opposing top and bottom outer walls (3010, 3020) attached to substantially opposing left and right outer side walls (3030, 3040) and substantially opposing front and back outer walls (3042, 3044);
a gas supply module for delivering one or more gas and vapor phase materials into the hollow chamber;
a vacuum pump for removing gas and vapor phase materials from the hollow chamber;
characterized in that the reaction chamber assembly further comprises;
an input rectangular aperture (3140) extending through one of the left and right outer side walls (3030), (3040);
an output rectangular aperture (3130) extending through the other of the left and right outer side walls (3040) wherein the input rectangular aperture and the output rectangular aperture are opposing with substantially identical aperture dimensions;
an input plenum (3150) disposed external to the outer wall assembly and in fluid communication with the gas supply module for delivering the one or more gas and vapor phase materials into the hollow chamber through the input rectangular aperture; and
,an output plenum (3250) disposed external to the outer wall assembly and in fluid communication with the vacuum pump for removing gas and vapor phase materials from the hollow chamber through the output rectangular aperture.
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Accused Products
Abstract
A gas deposition system (1000) configured as a dual-chamber “tower” includes a frame (1140) for supporting two reaction chamber assemblies (3000), one vertically above the other. Each chamber assembly (3000) includes an outer wall assembly surrounding a hollow chamber (3070) sized to receive a single generation 4.5 (GEN 4.5) glass plate substrate through a load port. The substrate is disposed horizontally inside the hollow chamber (3070) and the chamber assembly (3000) includes removable and cleanable triangular shaped input (3150) and output (3250) plenums disposed external to the hollow chamber (3070) and configured to produce substantially horizontally directed laminar gas flow over a top surface of the substrate. Each chamber includes a cleanable and removable chamber liner assembly (6000) disposed inside the hollow chamber (3070) to contain precursor gases therein thereby preventing contamination of chamber outer walls (3010, 3020, 3030, 3040).
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Citations
26 Claims
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1. A reaction chamber assembly (3000, 8100) for depositing thin film layers onto one or more substrates comprising:
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an outer wall assembly for enclosing a hollow chamber comprising substantially opposing top and bottom outer walls (3010, 3020) attached to substantially opposing left and right outer side walls (3030, 3040) and substantially opposing front and back outer walls (3042, 3044); a gas supply module for delivering one or more gas and vapor phase materials into the hollow chamber; a vacuum pump for removing gas and vapor phase materials from the hollow chamber; characterized in that the reaction chamber assembly further comprises; an input rectangular aperture (3140) extending through one of the left and right outer side walls (3030), (3040); an output rectangular aperture (3130) extending through the other of the left and right outer side walls (3040) wherein the input rectangular aperture and the output rectangular aperture are opposing with substantially identical aperture dimensions; an input plenum (3150) disposed external to the outer wall assembly and in fluid communication with the gas supply module for delivering the one or more gas and vapor phase materials into the hollow chamber through the input rectangular aperture; and
,an output plenum (3250) disposed external to the outer wall assembly and in fluid communication with the vacuum pump for removing gas and vapor phase materials from the hollow chamber through the output rectangular aperture. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method for depositing thin film layers onto rectangular substrates that have a substrate longitudinal length and a substrate transverse width wherein at least one substrate is supported in a hollow rectangular chamber enclosed by an outer wall assembly comprising the steps of:
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delivering one or more gas and vapor phase materials into an input plenum disposed external to the outer wall assembly between the hollow rectangular chamber and a gas supply module; expanding the volume of the one or more gas and vapor phase materials inside the input plenum; and
,delivering the one or more gas and vapor phase materials into the hollow rectangular chamber through a rectangular input aperture passing through a first side wall of the outside wall assembly, wherein the rectangular input aperture has a longitudinal aperture dimension that is centered with respect to and equal to or greater than one of the substrate longitudinal length and the substrate transverse width. - View Dependent Claims (24, 25, 26)
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Specification