METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A SUBSTRATE USING GRINDING
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Abstract
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate, then flowing the adhesive between the post and the substrate in the aperture, solidifying the adhesive, then grinding the post and the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.
9 Citations
50 Claims
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1-25. -25. (canceled)
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26. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, an adhesive and a substrate, wherein the substrate includes a conductive layer and a dielectric layer, the post is adjacent to and integral with the base, extends above the base in an upward direction, extends through an opening in the adhesive and extends into an aperture in the substrate, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the adhesive is mounted on and extends above the base, is sandwiched between the base and the substrate and is non-solidified, the substrate is mounted on and extends above the adhesive, and the conductive layer extends above the dielectric layer, and a gap is located in the aperture between the post and the substrate;
thenflowing the adhesive into and upward in the gap and above the post and onto a top surface of the post; solidifying the adhesive;
thengrinding the post and the adhesive, thereby removing the adhesive from the top surface of the post;
thenmounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post, a conductive trace includes a pad, a terminal and a selected portion of the conductive layer and the pad is electrically connected to the terminal; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing an adhesive, wherein an opening extends through the adhesive; providing a substrate that includes a conductive layer and a dielectric layer, wherein an aperture extends through the conductive layer and the dielectric layer; mounting the adhesive on the base, including inserting the post through the opening, wherein the adhesive extends above the base and the post extends through the opening; mounting the substrate on the adhesive, including inserting the post into the aperture, wherein the substrate extends above the adhesive, the conductive layer extends above the dielectric layer, the post extends through the opening into the aperture, the adhesive is sandwiched between the base and the substrate and is non-solidified, and a gap is located in the aperture between the post and the substrate;
thenapplying heat to melt the adhesive; moving the base and the substrate towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the substrate, wherein the pressure forces the molten adhesive to flow into and upward in the gap and flow above the post and onto a top surface of the post and the post extends above the dielectric layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the substrate;
thengrinding the post and the adhesive, thereby removing the adhesive from the top surface of the post;
thenproviding a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, wherein the pad is electrically connected to the terminal;
thenmounting a semiconductor device on a heat spreader that includes the post and the base, wherein the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50)
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Specification