METHOD FOR PACKAGING CIRCUITS
First Claim
1. A method comprising:
- curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice on the first substrate with second saw streets separating a plurality of second dice on the second substrate;
cutting a kerf through the first substrate in the first saw streets;
removing exposed adhesive between at least some of the plurality of first dice;
lazing the second saw street to form through holes;
forming electrical connections from the first dice on the first substrate to the second dice on the second substrate through the through holes; and
singulating aligned first and second dice from a remainder of the fixed first and second substrates.
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Accused Products
Abstract
A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.
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Citations
20 Claims
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1. A method comprising:
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curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice on the first substrate with second saw streets separating a plurality of second dice on the second substrate; cutting a kerf through the first substrate in the first saw streets; removing exposed adhesive between at least some of the plurality of first dice; lazing the second saw street to form through holes; forming electrical connections from the first dice on the first substrate to the second dice on the second substrate through the through holes; and singulating aligned first and second dice from a remainder of the fixed first and second substrates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice on the first substrate with second saw streets separating a plurality of second dice on the second substrate; cutting through the first substrate along the first saw streets of the first substrate; removing exposed adhesive between at least some of the plurality of first dice; cutting through the second saw street to form through holes; forming electrical connections from the first dice on the first substrate to the second dice on the second substrate through the through holes; and singulating aligned first and second dice from a remainder of the fixed first and second substrates. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method comprising:
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curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice on the first substrate with second saw streets separating a plurality of second dice on the second substrate; cutting a kerf in the first saw streets of the first substrate through the first substrate; removing exposed adhesive between at least some of the plurality of first dice; lazing the second saw street to form through holes; forming electrical connections from the first dice on the first substrate to the second dice on the second substrate through the through holes, wherein forming the electrical connections includes filling at least some of the through holes with a conductive material; and singulating aligned first and second dice from a remainder of the fixed first and second substrates, forming the electrical connections to be substantially flush with smooth sides of the singulated aligned first and second dice. - View Dependent Claims (18, 19, 20)
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Specification