CONNECTION METHOD, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE

• US 20120067619A1
• Filed: 05/18/2010
• Published: 03/22/2012
• Est. Priority Date: 06/01/2009
• Status: Abandoned Application

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation), Sumitomo Electric Printed Circuits, Inc.
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation), Sumitomo Electric Printed Circuits, Inc.
• Inventors: Yamamoto, Masamichi, Nakatsugi, Kyouichirou, Yamaguchi, Takashi, Kawakami, Shigeki, Kimura, Michihiro
• Application Number:
  US13/375,670
• Publication Number:
  US 20120067619A1
• Time in Patent Office: Days
• US Class Current: 174/126.1
• CPC Class Codes: C23F 11/149 Heterocyclic compounds containing nitrogen as hetero atom
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2201/0248 Needles or elongated particles; Elongated cluster of chemically bonded particles microfibers H05K2201/0251; stacked conductors H05K2201/0379
• CPC Class Codes: H05K 2201/0373 Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool providing micro- or nanometer scale roughness on a metal surface H05K2203/0307
• CPC Class Codes: H05K 2201/094 Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads using different types of conductors H05K2201/0391
• CPC Class Codes: H05K 2201/10977 Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 2201/10992 Using different connection materials, e.g. different solders, for the same connection
• CPC Class Codes: H05K 2203/308 Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
• CPC Class Codes: H05K 3/282 for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/3431 Leadless components
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

[Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.

[Solution] A connection method according to the present invention includes a step (a1) of preparing base materials 10 and 21 each including an electrode for connection using an adhesive, a step (b1) of covering electrodes 12 and 22 for connection using an adhesive with organic films 15 configured to prevent oxidation, the electrodes 12 and 22 being located on the base materials, a step (c1) of removing or thinning the organic films, and after the step (c1), a step (d1) of bonding the electrodes for connection using an adhesive to each other with an adhesive 30 mainly containing a thermosetting resin to establish electrical connection.

Claims

1. A connection method comprising:

a step (a1) of preparing a base material including an electrode for connection using an adhesive;

a step (b1) of covering the electrode for connection using an adhesive with an organic film configured to prevent oxidation, the electrode being arranged on the base material;

a step (c1) of removing or thinning the organic film; and

after the step (c1), a step (d1) of bonding the electrode for connection using an adhesive to a connection conductor with an adhesive mainly containing a thermosetting resin to establish electrical connection.

2. The connection method according to claim 1,

wherein in the step (c1), the organic film is brought into contact with an acidic solution or its vapor.

3. The connection method according to claim 1,

wherein in the step (a1), a base material including a conductor for connection using solder is prepared as the base material, and the method further comprises:

after the step (b1) and before the step (c1), a step (e1) of joining the conductor for connection using solder to a connection conductor using solder by solder reflow treatment in a non-oxidizing atmosphere.

12. The connection method according to claim 1,

wherein an anisotropic conductive adhesive containing electrically conductive particles is used as the adhesive.

13. The connection method according to claim 12,

wherein the adhesive contains electrically conductive particles formed of needle-shaped metal powder particles or a metal powder having a form in which a plurality of metal particles are connected in the form of a chain.

14. The connection method according to claim 13,

wherein each of the electrically conductive particles has an aspect ratio of 5 or more.

15. The connection method according claim 1,

wherein the adhesive has a film-like shape.

16. The connection method according to claim 15,

wherein the adhesive contains electrically conductive particles whose major axes are oriented in the thickness direction of the adhesive having a film-like shape.

17. The connection method according to claim 1,

wherein a flexible printed wiring board is prepared as the base material.

18. A connection structure formed by the connection method according to claim 1.

20. An electronic device assembled by the connection method according to claim 1.

4. A connection method comprising:

a step (a2) of preparing a base material including an electrode for connection using an adhesive and an electrode for connection using solder;

a step (b2) of covering only the electrode for connection using solder with an organic film formed by OSP treatment or a noble metal plating film, the electrode for connection using solder being arranged on the base material;

a step (c2) of joining the electrode for connection using solder to a connection conductor using solder by solder reflow treatment in a non-oxidizing atmosphere; and

after the step (c2), a step (d2) of bonding the electrode for connection using an adhesive to a connection conductor with an adhesive mainly containing a thermosetting resin to establish electrical connection.

5. The connection method according to claim 4,

wherein after the step (b2) and before the step (c2), a detachable protective film configured to cover the electrode for connection using an adhesive is formed,

the step (c2) is performed at a temperature at which the protective film remains, and

before the step (d2), the protective film is removed.

6. The connection method according to claim 4,

wherein after the step (c2) and before the step (d2), an oxide film on a surface of the electrode for connection using an adhesive is removed.

7. The connection method according to claim 4,

wherein the step (c2) is performed in the non-oxidizing atmosphere having an oxygen concentration of 1% or less.

21. The connection method according to claim 4,

wherein an anisotropic conductive adhesive containing electrically conductive particles is used as the adhesive.

23. The connection method according to claim 21,

wherein the adhesive contains electrically conductive particles formed of needle-shaped metal powder particles or a metal powder having a form in which a plurality of metal particles are connected in the form of a chain.

25. The connection method according to claim 23,

wherein each of the electrically conductive particles has an aspect ratio of 5 or more.

27. The connection method according claim 4,

wherein the adhesive has a film-like shape.

29. The connection method according to claim 27,

wherein the adhesive contains electrically conductive particles whose major axes are oriented in the thickness direction of the adhesive having a film-like shape.

31. The connection method according to claim 4,

wherein a flexible printed wiring board is prepared as the base material.

33. A connection structure formed by the connection method according to claim 4.

35. An electronic device assembled by the connection method according to claim 4.

8. A connection method comprising:

a step (a3) of preparing a base material including an electrode for connection using an adhesive and an electrode for connection using solder;

a step (b3) of covering the electrode for connection using an adhesive and the electrode for connection using solder with oxidation preventing films, the electrode for connection using an adhesive and the electrode for connection using solder being arranged on the base material;

after the step (b3), a step (c3) of bonding the electrode for connection using an adhesive to a connection conductor with an adhesive mainly containing a thermosetting resin to establish electrical connection; and

after the step (c3), a step (d3) of joining the electrode for connection using solder to a connection conductor using solder by solder reflow treatment in a non-oxidizing atmosphere,

wherein an increase in connection resistance between the electrode for connection using an adhesive and the connection conductor before and after the step (d3) is within a predetermined range.

9. The connection method according to claim 8,

wherein after the step (c3) and before the step (d3), upon letting the connection resistance between the electrode for connection using an adhesive and the connection conductor be R₁, and upon letting the adhesion strength of the adhesive be F₁, and

after the step (d3), upon letting the connection resistance between the electrode for connection using an adhesive and the connection conductor be R₂, and upon letting the adhesion strength of the adhesive be F₂,

relational expressions (1) and (2) hold:

R₂<

1.2×

R₁ 

 

(1)

F₂>

0.8×

F₁ 

 

(2)

10. The connection method according to claim 8,

wherein a resin material having a glass transition temperature of 100°

C. or higher after curing is used as a resin composition in the adhesive.

11. The connection method according to claim 8,

wherein in the step (c3), organic films are formed as the oxidation preventing films.

22. The connection method according to claim 8,

wherein an anisotropic conductive adhesive containing electrically conductive particles is used as the adhesive.

24. The connection method according to claim 22,

wherein the adhesive contains electrically conductive particles formed of needle-shaped metal powder particles or a metal powder having a form in which a plurality of metal particles are connected in the form of a chain.

26. The connection method according to claim 24,

wherein each of the electrically conductive particles has an aspect ratio of 5 or more.

28. The connection method according claim 8,

wherein the adhesive has a film-like shape.

30. The connection method according to claim 28,

wherein the adhesive contains electrically conductive particles whose major axes are oriented in the thickness direction of the adhesive having a film-like shape.

32. The connection method according to claim 8,

wherein a flexible printed wiring board is prepared as the base material.

34. A connection structure formed by the connection method according to claim 8.

36. An electronic device assembled by the connection method according to claim 8.

19. A connection structure between a first conductor on a first member and a second conductor on a second member, the first conductor and the second conductor being bonded to each other with an adhesive mainly containing a thermosetting resin to establish electrical connection,

wherein a portion of the first conductor and a portion of the second conductor are conductive with each other, and

a surface, excluding the portion, of at least one of the first conductor and the second conductor is covered with an organic film having a thickness of 0.05 μ

m or less and being configured to prevent oxidation, or is exposed to the adhesive without being covered with an organic film.