Device Package and Methods for the Fabrication Thereof

• US 20120067871A1
• Filed: 09/20/2011
• Published: 03/22/2012
• Est. Priority Date: 09/20/2010
• Status: Active Grant

• Current Assignee: Cubic Corporation
• Original Assignee: Nuvotronics, Inc (Cubic Corporation)
• Inventors: Sherrer, David William, MacDonald, James
• Granted Patent: US 8,969,132 B2
• Time in Patent Office: Days
• US Class Current: 219/678
• CPC Class Codes: B05D 1/005 Spin coating
• CPC Class Codes: B05D 3/007 After-treatment
• CPC Class Codes: B05D 3/0272 with ovens
• CPC Class Codes: B05D 5/08 to obtain an anti-friction or anti-adhesive surface rendering particulate materials free-flowing in general, e.g. making them hydrophobic B01J2/30
• CPC Class Codes: C23C 14/14 Metallic material, boron or silicon
• CPC Class Codes: C23C 16/0227 by cleaning or etching
• CPC Class Codes: C23C 16/0272 Deposition of sub-layers, e.g. to promote the adhesion of the main coating
• CPC Class Codes: C23C 16/06 characterised by the deposition of metallic material
• CPC Class Codes: C23C 16/45555 applied in non-semiconductor technology
• CPC Class Codes: C23C 18/38 Coating with copper
• CPC Class Codes: C23C 18/42 Coating with noble metals
• CPC Class Codes: C23C 24/082 without intermediate formation of a liquid in the layer
• CPC Class Codes: C23C 28/042 including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
• CPC Class Codes: C23C 28/42 characterized by the composition of the alternating layers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 23/047 the other leads being parallel to the base
• CPC Class Codes: H01L 23/06 characterised by the material of the container or its electrical properties
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/564 : Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01Q 17/00 : Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H05K 9/0024 : Shield cases mounted on a PCB, e.g. cans or caps or conformal shields

Abstract

Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an absorbing layer, an EMI blocking layer, a layer comprising conductive material or a metal cover.

Claims

1. A method of forming a microwave assembly, comprising:

a. providing a microwave circuit comprising at least one microwave transmission line.

b. forming a dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the circuit;

c. forming an ionic barrier layer comprising a silicone over the dielectric layer;

d. forming an electromagnetic interference blocking layer over the ionic barrier layer; and

e. forming a second ionic barrier layer comprising a silicone over said electromagnetic interference blocking layer.

2. A method of forming a microwave assembly comprising:

a. providing a microwave circuit comprising at least one microwave transmission line;

b. forming at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the circuit;

c. forming a least one electromagnetic interference blocking layer over the at least one dielectric layer; and

d. forming at least one ionic barrier layer over the at least one electromagnetic interference blocking layer or the at least one dielectric layer.

3. The method claim 2, further comprising a rework in which at least one of the dielectric coating, the conductive coating or the encapsulating coating is removed and replaced.

4. The method according to claim 2, wherein the at least one electromagnetic interference blocking layer comprises a conductive coating, a metal coating, a metallized plastic, a metal lid or combinations thereof.

5. The method according to claim 2, wherein the at least one electromagnetic interference blocking layer is a conductive coating comprising gold, silver, copper, palladium, or platinum.

6. A method of forming a microwave assembly, comprising:

a. providing a microwave circuit comprising at least one microwave transmission line;

b. forming at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the microwave circuit; and

c. forming at least one ionic barrier layer over the at least one dielectric layer.

7. The method according to claim 6, wherein the thickness of the dielectric layer is at least 25 microns.

8. The method according to claim 6, further comprising forming at least one electromagnetic interference blocking layer over the at least one dielectric layer.

9. The method according to claim 6, further comprising forming an electromagnetic interference absorbing layer.

10. The method according to claim 6, wherein the electromagnetic interference absorbing layer comprises at least one of one or more electrically lossy materials, one or more magnetically lossy materials, or a combination thereof.

11. The method according to claim 6, wherein the at least one dielectric coating comprises at least one of a syntactic foam, an expanded foam, an aerogel, or a highly porous material formed from a composite comprising a porogen.

12. The method according to claim 6, wherein the at least one ionic barrier layer comprises at least one of a silicone, a parylene, a polyimide, or a curable BCB resin.

13. The method according to claim 6, wherein the at least one ionic barrier comprises an electronics grade silicone.

14. The method according claim 6, further comprising forming a dielectric layer on the microwave circuit by aerosol, atomic layer deposition, or vapor deposition.

15. A non-hermetic package for protecting a microwave assembly comprising:

a. a microwave circuit comprising at least one microwave transmission line;

b. at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the microwave circuit;

c. at least one electromagnetic interference blocking layer over the at least one dielectric layer; and

d. at least one ionic barrier layer over the at least one electromagnetic interference blocking layer or the at least one dielectric layer.

16. The non-hermetic package of claim 15, wherein the at least one electromagnetic interference layer absorbs microwave radiation.

17. The non-hermetic package of claim 15, wherein the at least one electromagnetic interference blocking layer comprises a conductive coating, a metal coating, a metallized plastic, a metal lid or combinations thereof.

18. The non-hermetic package of claim 15, wherein the at least one electromagnetic interference blocking layer comprises a conductive coating comprising at least one metal chosen from gold, silver, copper, palladium, platinum or combinations thereof.

19. A non-hermetic package for protecting a microwave assembly comprising:

a. a microwave circuit comprising at least one microwave transmission line;

b. at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the microwave circuit; and

c. at least one ionic barrier layer over the at least one dielectric layer.

20. The non-hermetic package of claim 19, wherein the thickness of the dielectric layer is at least 25 microns.

21. The non-hermetic package of claim 19, further comprising at least one electromagnetic interference blocking layer over the at least one dielectric layer.

22. The non-hermetic package of claim 19, further comprising an electromagnetic interference absorbing layer.

23. The non-hermetic package of claim 19, wherein the at least one electromagnetic interference absorbing layer comprises at least one of one or more electrically lossy materials, one or more magnetically lossy materials, or a combination thereof.

24. The non-hermetic package of claim 19, wherein the at least one dielectric coating comprises at least one of a syntactic foam, an expanded foam, an aerogel, or a highly porous material formed from a composite comprising a porogen.

25. The non-hermetic package of claim 19, wherein the at least ionic barrier layer comprises at least one of a silicone, a parylene, a polyimide, or a curable BCB resin.

26. The non-hermetic package of claim 19, wherein the at least one ionic barrier layer comprises an electronics grade silicone.

27. The non-hermetic package for protecting a microwave assembly according claim 19 further comprising a dielectric layer on the microwave circuit by aerosol, atomic layer deposition, or vapor deposition.