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Device Package and Methods for the Fabrication Thereof

  • US 20120067871A1
  • Filed: 09/20/2011
  • Published: 03/22/2012
  • Est. Priority Date: 09/20/2010
  • Status: Active Grant
First Claim
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1. A method of forming a microwave assembly, comprising:

  • a. providing a microwave circuit comprising at least one microwave transmission line.b. forming a dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the circuit;

    c. forming an ionic barrier layer comprising a silicone over the dielectric layer;

    d. forming an electromagnetic interference blocking layer over the ionic barrier layer; and

    e. forming a second ionic barrier layer comprising a silicone over said electromagnetic interference blocking layer.

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