ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS

• US 20120068326A1
• Filed: 09/17/2010
• Published: 03/22/2012
• Est. Priority Date: 09/17/2010
• Status: Active Grant

• Current Assignee: I3 ELECTRONICS, INC.
• Original Assignee: Endicott Interconnect Technologies Incorporated
• Inventors: Das, Rabindra N., Markovich, Voya R., McNamara, James J. Jr., Poliks, Mark D.
• Granted Patent: US 8,288,857 B2
• Time in Patent Office: Days
• US Class Current: 257/687
• CPC Class Codes: H01L 2224/13101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/29 of an individual layer connector
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29344 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/29369 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/29387 Ceramics, e.g. crystalline carbides, nitrides or oxides glass ceramics H01L2224/29388
• CPC Class Codes: H01L 2224/29393 with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/573 using passive means
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling.

Claims

1. A tamper-resistant microprocessor chip package comprising:

a microprocessor chip;

a fluid containment layer having at least one cavity; and

a fluid, wherein said cavity is at least partially filled with said fluid and said fluid is capable of damaging said microprocessor chip.

2. The chip package of claim 1, further comprising a lid, wherein said fluid containment layer is positioned between said lid and said microprocessor chip.

3. The chip package of claim 2, wherein said microprocessor chip contains silicon components and said fluid is capable of etching said silicon components.

4. The chip package of claim 3, wherein said fluid is chosen from the group:

potassium hydroxide, tetramethylammonium hydroxide, and hydrofluoric acid.

5. The chip package of claim 2, wherein said microprocessor contains copper components and said fluid is capable of etching said copper components.

6. The chip package of claim 5, wherein said fluid comprises ferric chloride.

7. The chip package of claim 2, wherein said fluid comprises a nanofluid.

8. The chip package of claim 7, wherein said nanofluid comprises a plurality of electrically conductive nanoparticles and a volatile aqueous or organic base fluid.

9. The chip package of claim 8, wherein said nanofluid has a higher thermal conductivity than said base fluid.

10. The chip package of claim 9, wherein said plurality of nanoparticle is selected from the group consisting of gold, silver, platinum, zinc oxide, silicon carbide, carbon, nanotubes, and graphite.

11. The chip package of claim 2, further comprising a plurality of thermal interface materials in thermal communication with said microprocessor chip and said lid.

12. The chip package of claim 1, wherein said microprocessor chip has a top side and a bottom side, and further comprising a plurality of through-vias extending from said top side to said bottom side.

13. The chip package of claim 1, further comprising a passivation layer having a top side and a bottom side, and a plurality of micro vias extending from said top side to said bottom side.

14. The chip package of claim 1, wherein said fluid containment layer comprises a plurality of cavities and a plurality of fluids, each of said plurality of cavities at least partially filled with at least one of said plurality of fluids, and at least one of said plurality of fluids being stable and inactive but, upon mixing with at least one other of said plurality of fluids, forms a fluid mixture capable of damaging said microprocessor chip.

15. The chip package of claim 14, wherein said fluid containment layer is an underfill layer.

16. The chip package of claim 14, wherein said microprocessor chip contains silicon components and said fluid mixture is capable of etching said silicon components.

17. The chip package of claim 16, wherein said plurality of fluids comprise at least one of the group:

nitric acid, ammonium fluoride, ethylenediamine, hydroquinone, hydrofluoric acid, ammonium fluoride, and water.

18. The chip package of claim 14, wherein said microprocessor chip contains gold components and said fluid mixture is capable of etching said gold components

19. The chip package of claim 18, wherein said plurality of fluids comprises at least one of the group:

hydrochloric acid, nitric acid, and chromium trioxide.

20. The chip package of claim 14, wherein mixing at least two of said plurality of fluids will initiate an exothermic chemical reaction sufficient to thermally damage said microprocessor chip.

21. The chip package of claim 20, wherein said plurality of fluids comprise an acid and a base.

22. The chip package of claim 20, wherein at least one of said plurality of fluids is also capable of etching circuitry.

23. The chip package of claim 22, wherein said plurality of fluids comprises at least one of the group:

nitric acid, triethanolamine, perchloric acid, and potassium hydroxide.

24. The chip package of claim 14, wherein at least one of said plurality of fluids is a nanofluid.

25. The chip package of claim 24, wherein said nanofluid comprises a plurality of electrically conductive nanoparticles and a volatile aqueous or organic base fluid.

26. The chip package of claim 25, wherein said nanofluid comprises a plurality of nanoparticles and an aqueous or organic base fluid, and whereby said nanofluid has a higher thermal conductivity than said base fluid.

27. The chip package of claim 26, wherein said plurality of nanoparticles is selected from the group consisting of gold, silver, platinum, zinc oxide, silicon carbide, carbon, nanotubes, and graphite.

28. A tamper-resistant microprocessor chip package comprising:

a microprocessor chip;

a plurality of fluid containment layers each having at least one cavity; and

a fluid, wherein each of said cavities are at least partially filled with said fluid and said fluid is capable of damaging said microprocessor chip.

29. The chip package of claim 28, further comprising a lid and an underfill layer, wherein one of said plurality of fluid containment layers is positioned between said lid and said microprocessor chip, and one of said plurality of fluid containment layers is said underfill layer.

30. The chip package of claim 28, further comprising a plurality of fluids, each of said cavities at least partially filled with at least one of said plurality of fluids, and at least one of said plurality of fluids being stable and inactive but upon mixing with at least one other of said plurality of fluids, forming a fluid mixture capable of damaging said microprocessor chip.