PHASED ARRAY ANTENNA AND METHOD FOR PRODUCING THEREOF

• US 20120068906A1
• Filed: 10/04/2011
• Published: 03/22/2012
• Est. Priority Date: 04/05/2009
• Status: Abandoned Application

• Current Assignee: ELTA Systems Limited (Government of Israel)
• Original Assignee: ELTA Systems Limited (Government of Israel)
• Inventors: ASHER, Menachem, TURGEMAN, Meir
• Application Number:
  US13/252,655
• Publication Number:
  US 20120068906A1
• Time in Patent Office: Days
• US Class Current: 343/853
• CPC Class Codes: H01Q 21/0025 Modular arrays
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A vertically stacked array antenna structure is described. The structure comprises a radiating layer, a passive layer disposed under said radiating layer, an active layer disposed under said passive layer, and an interface assembly. The radiating layer comprises an array of radiating elements. The passive layer has only passive components. At least a part of the passive components includes an array of RF duplexers corresponding to the array of radiating elements. The active layer comprises RF amplifiers. The interface assembly comprises at least one metallic frame which is in direct thermal coupling with the RF amplifiers. The interface assembly is configured for providing thermal communication of the active layer with a heat exchanger.

Claims

1-37. -37. (canceled)

38. A vertically stacked array antenna structure comprising:

a radiating layer comprising an array of radiating elements;

a passive layer disposed under said radiating layer and having only passive components, wherein at least a part of said passive components includes an array of RF duplexers corresponding to the array of radiating elements;

an active layer disposed under said passive layer and comprising RF amplifiers; and

an interface assembly comprising at least one metallic frame being in direct thermal, coupling with said RF amplifiers, and configured for providing thermal communication of said active layer with a heat exchanger.

39. The vertically stacked array antenna structure of claim 38, further comprising the heat exchanger thermally communicating with said interface assembly.

40. The vertically stacked array antenna structure of claim 38, wherein said plurality of RF amplifiers is in direct thermal coupling with said metallic frame.

41. The vertically stacked array antenna structure of claim 38, wherein said plurality of RF amplifiers are integrated into RF amplifier modules, each RF amplifier module including at least two RF amplifiers.

42. The vertically stacked array antenna structure of claim 41, wherein at least one said RF amplifier module comprises four pairs of RF amplifiers, each pair of the RF amplifiers comprises one transmission RF amplifier and one reception RF amplifier, and said each pair of the RF amplifiers corresponds to one corresponding duplexer.

43. The vertically stacked array antenna structure of claim 38, wherein said interface assembly includes a first metallic frame and a second metallic frame, both metallic frames disposed under said passive layer, and wherein said active layer is encompassed between the first metallic frame and the second metallic frame.

44. The vertically stacked array antenna structure of claim 43, wherein said first metallic frame and said second metallic frame are in direct thermal coupling with each other.

45. The vertically stacked array antenna structure of claim 44, wherein at least one frame selected from said first metallic frame and said second metallic frame has a compartment structure comprising at least one compartment, each compartment defining a cavity in which said RF amplifiers are located substantially thereinside.

46. The vertically stacked array antenna structure of claim 38, further comprising an antenna frame disposed under said radiating layer, said antenna frame having holes passing through the antenna frame for RF interconnections.

47. The vertically stacked array antenna structure of claim 46, wherein the antenna frame has a compartment structure comprising at least one compartment, each compartment defining a cavity in which RF duplexers are located substantially thereinside.

48. The vertically stacked array antenna structure of claim 38, further comprising a distribution network comprising electric connectors configured to establish electric connection between said vertically stacked array antenna structure and external devices, said distribution network configured for distribution of electric signals selected from DC supply signal, control signals, transmission RF signals and Reception RF signals.

49. The vertically stacked array antenna structure of claim 48 wherein said distribution network is arranged within the active layer.

50. The vertically stacked array antenna structure of claim 48 wherein said distribution network is arranged within the interface assembly.

51. The vertically stacked array antenna structure of claim 48 wherein said distribution network is arranged between the active layer and the interface assembly.

52. The vertically stacked array antenna structure of claim 48 wherein said distribution network is arranged under the interface assembly.

53. The vertically stacked array antenna structure of claim 48, wherein said distribution network is implemented on a primary distribution board arranged within said active layer and on a secondary distribution board arranged within the interface assembly, wherein said primary distribution board comprises fuzz buttons for connecting said primary distribution board to said secondary distribution board, and said secondary distribution board comprises electric connectors passing through the heat exchanger, and configured for connecting to external devices.

54. The vertically stacked array antenna structure of claim 43 further comprising a distribution network wherein said distribution network is implemented on a primary distribution board arranged within said active layer and on a secondary distribution board arranged under the second metallic frame, said secondary distribution board further comprises electric connectors passing through the heat exchanger, and configured for connecting to external devices.

55. The vertically stacked array antenna structure of claim 38 wherein said passive layer is interconnected directly to said radiating layer by a first set of RF connectors.

56. The vertically stacked array antenna structure of claim 38 wherein said passive layer is interconnected directly to said active layer by a second set of RF connectors.

57. A method for production of a vertically stacked array antenna structure comprising:

providing a radiating layer comprising an array of radiating elements;

providing a passive layer consisting of passive components, wherein at least a part of said passive components includes an array of RF duplexers corresponding to the array of radiating elements;

disposing said passive layer under said radiating layer;

providing an active layer comprising RF amplifiers;

disposing the active layer under said passive layer;

providing an interface assembly comprising at least one metallic frame;

establishing direct thermal coupling of said metallic frame with said RF amplifiers; and

configuring said interface assembly for providing thermal communication of the active layer with a heat exchanger.