TOUCH PAD WITH FLEXIBLE SUBSTRATE
First Claim
1. A touch sensor device, comprising:
- a flexible circuit substrate dimensionally stable up to a first temperature, wherein the first temperature allows thermal bonding to the flexible substrate without significant thermally induced degradation;
a first at least one conductive pad disposed on the flexible circuit substrate;
a sensor substrate that is dimensionally stable up to a second temperature that is lower than the first temperature but is not dimensionally stable at the first temperature;
at least one conductive sensing element disposed on the sensor substrate; and
a second at least one conductive pad disposed on the sensor substrate, wherein the second at least one conductive pad is coupled to the first at least one conductive pad, and wherein the second at least one conductive pad is coupled to the at least one conductive sensing element.
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Accused Products
Abstract
A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.
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Citations
20 Claims
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1. A touch sensor device, comprising:
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a flexible circuit substrate dimensionally stable up to a first temperature, wherein the first temperature allows thermal bonding to the flexible substrate without significant thermally induced degradation; a first at least one conductive pad disposed on the flexible circuit substrate; a sensor substrate that is dimensionally stable up to a second temperature that is lower than the first temperature but is not dimensionally stable at the first temperature; at least one conductive sensing element disposed on the sensor substrate; and a second at least one conductive pad disposed on the sensor substrate, wherein the second at least one conductive pad is coupled to the first at least one conductive pad, and wherein the second at least one conductive pad is coupled to the at least one conductive sensing element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A touch screen device, comprising:
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a flexible circuit substrate dimensionally stable up to a first temperature, wherein the first temperature allows thermal bonding to the flexible substrate without significant thermally induced degradation; a first at least one conductive pad disposed on the flexible circuit substrate; a sensor substrate that is dimensionally stable up to a second temperature that is lower than the first temperature but is not dimensionally stable at the first temperature, wherein the sensor substrate is substantially transparent; at least one conductive sensing element disposed on the sensor substrate, wherein the at least one conductive sensing element is substantially transparent; and a second at least one conductive pad disposed on the sensor substrate, wherein the second at least one conductive pad is coupled to the first at least one conductive pad, and wherein the second at least one conductive pad is coupled to the at least one conductive sensing element. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method of providing a touch sensor device, comprising:
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providing a flexible circuit substrate that is dimensionally stable up to a first temperate that allows thermal bonding to the flexible substrate without significant thermally induced degradation to the flexible circuit substrate, wherein a first plurality of conductive pads are disposed on the flexible circuit; and providing a sensor substrate that is dimensionally stable up to a second temperature that is lower than the first temperature but is not dimensionally stable at the first temperature, wherein a plurality of conductive sensing elements are disposed on the sensor substrate, wherein a second plurality of conductive pads are disposed on the sensor substrate, and wherein the second plurality of conductive pads couple the first plurality of conductive pads with the plurality of conductive sensing elements. - View Dependent Claims (17, 18, 19, 20)
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Specification