MULTI-CHIP LED DEVICES
First Claim
1. An LED device comprising:
- a plurality of interconnected LED chips; and
an optical element disposed to affect light from the LED chips;
wherein the optical element is less than 5 mm in diameter while maintaining a clearance between any of the LED chips and an edge of the optical element such that the clearance is from approximately 0.2 to 0.8 the width of the plurality of interconnected LED chips.
3 Assignments
0 Petitions
Accused Products
Abstract
Multi-chip LED devices are described. Embodiments of the present invention provide multi-chip LED devices with relatively high efficiency and good color rendering. The LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The optical element may be molded from silicone. The LED chips may be connected in parallel. In some embodiments, the LED device includes a submount, which may be made of a ceramic material such as alumina or aluminum nitride. Wire bonds can be connected to the LED chips so that all the wire bonds tend the outside of a group of LED chips. Various sizes and types of LED chips may be used, including vertical LED chips and sideview LED chips.
26 Citations
35 Claims
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1. An LED device comprising:
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a plurality of interconnected LED chips; and an optical element disposed to affect light from the LED chips; wherein the optical element is less than 5 mm in diameter while maintaining a clearance between any of the LED chips and an edge of the optical element such that the clearance is from approximately 0.2 to 0.8 the width of the plurality of interconnected LED chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An LED device comprising:
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a submount; a plurality of LED chips fixed to the submount; a plurality of wire bonds, each connected between an LED chip and the submount, the plurality of wire bonds arranged so that all the wire bonds tend to the outside of the plurality of LED chips; and an optical element disposed to affect light from the plurality of LED chips. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. An LED device comprising:
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a ceramic submount; a plurality of LED chips fixed to the submount, wherein the plurality of LED chips is selected to maximize a color rendering index (CRI) of the LED device; and a silicone lens disposed to affect light from the plurality LED chips. - View Dependent Claims (23, 24, 25, 26, 27, 28)
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29. A method of assembling an LED device, the method comprising:
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selecting a plurality of LED chips to maximize a color rendering index (CRI) of the LED device. fixing the plurality of LED chips to a ceramic submount; interconnecting the plurality of LED chips; and attaching a silicone lens to the ceramic submount to affect light from the LED chips. - View Dependent Claims (30, 31, 32, 33, 34, 35)
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Specification