PRESSURE-SENSITIVE ADHESIVE TAPE

• US 20120070658A1
• Filed: 09/14/2011
• Published: 03/22/2012
• Est. Priority Date: 09/16/2010
• Status: Abandoned Application

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: IKISHIMA, Shinsuke, HABU, Takashi, ASAI, Fumiteru, OOYAMA, Kooki, TAKAHASHI, Tomokazu, TORII, Tadao, KAMEI, Katsutoshi, KATOU, Yuuki
• Application Number:
  US13/232,716
• Publication Number:
  US 20120070658A1
• Time in Patent Office: Days
• US Class Current: 428/354
• CPC Class Codes: B32B 2250/24 All layers being polymeric
• CPC Class Codes: B32B 2250/246 All polymers belonging to those covered by groups B32B27/32 and B32B27/30
• CPC Class Codes: B32B 2405/00 Adhesive articles, e.g. adhesive tapes
• CPC Class Codes: B32B 2457/14 Semiconductor wafers
• CPC Class Codes: B32B 27/306 comprising vinyl acetate or vinyl alcohol (co)polymers
• CPC Class Codes: B32B 27/327 comprising polyolefins obtained by a metallocene or single-site catalyst
• CPC Class Codes: C09J 2203/326 for bonding electronic components such as wafers, chips or semiconductors
• CPC Class Codes: C09J 2301/162 the carrier being a laminate constituted by plastic layers only
• CPC Class Codes: C09J 2301/312 parameters being the characterizing feature
• CPC Class Codes: C09J 2423/106 in the substrate
• CPC Class Codes: C09J 7/29 Laminated material metallised plastics C09J7/22
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/6834 used to protect an active side of a device or wafer
• CPC Class Codes: H01L 2221/68386 Separation by peeling
• CPC Class Codes: Y10T 428/2848 Three or more layers

Abstract

A pressure-sensitive adhesive tape according to an embodiment of the present invention includes,

• • a heat-resistant layer;
  • a base layer; and
  • a pressure-sensitive adhesive layer in this order, wherein:
  • the pressure-sensitive adhesive tape has an elastic modulus, i.e., Young'"'"'s modulus at 25° C. of 150 MPa or less; and
  • the heat-resistant layer contains a polypropylene-based resin polymerized by using a metallocene catalyst, the polypropylene-based resin having a melting point of 110° C. to 200° C. and a molecular weight distribution “Mw/Mn” of 3 or less.

Claims

1. A pressure-sensitive adhesive tape, comprising:

a heat-resistant layer;

a base layer; and

a pressure-sensitive adhesive layer in this order, wherein;

the pressure-sensitive adhesive tape has an elastic modulus, i.e., Young'"'"'s modulus at 25°

C. of 150 MPa or less; and

the heat-resistant layer contains a polypropylene-based resin polymerized by using a metallocene catalyst, the polypropylene-based resin having a melting point of 110°

C. to 200°

C. and a molecular weight distribution “

Mw/Mn”

of 3 or less.

2. A pressure-sensitive adhesive tape according to claim 1, further comprising a second heat-resistant layer between the base layer and the pressure-sensitive adhesive layer.

3. A pressure-sensitive adhesive tape according to claim 1, wherein the heat-resistant layer is substantially free of F⁻

, Cl⁻

, Br⁻

, NO₂⁻

, NO₃⁻

, SO₄²⁻

, Li⁺, Na⁺, K⁺, Mg²⁺, Ca²⁺, and NH₄⁺.

4. A pressure-sensitive adhesive tape according to claim 2, wherein the heat-resistant layer is substantially free of F⁻

, Cl⁻

, Br⁻

, NO₂⁻

, NO₃⁻

, SO₄²⁻

, Li⁺, Na⁺, K⁺, Mg²⁺, Ca²⁺, and NH₄⁺.

5. A pressure-sensitive adhesive tape according to claim 1, which is obtained by coextrusion molding of a heat-resistant layer-forming material, a base layer-forming material, and a pressure-sensitive adhesive layer-forming material.

6. A pressure-sensitive adhesive tape according to claim 2, which is obtained by coextrusion molding of a heat-resistant layer-forming material, a base layer-forming material, and a pressure-sensitive adhesive layer-forming material.

7. A pressure-sensitive adhesive tape according to claim 1, wherein the pressure-sensitive adhesive tape is used for processing a semiconductor wafer.