CURABLE SILICONE RESIN COMPOSITION

• US 20120071604A1
• Filed: 06/08/2010
• Published: 03/22/2012
• Est. Priority Date: 06/19/2009
• Status: Active Grant

• Current Assignee: Yokohama Rubber Company Limited
• Original Assignee: Yokohama Rubber Company Limited
• Inventors: Takei, Yoshihito, Ishikawa, Kazunori, Saiki, Takeaki
• Granted Patent: US 8,304,489 B2
• Time in Patent Office: Days
• US Class Current: 524/588
• CPC Class Codes: C08F 299/08 from polysiloxanes
• CPC Class Codes: C08G 77/16 to hydroxyl groups
• CPC Class Codes: C08G 77/20 containing silicon bound to unsaturated aliphatic groups C08G77/045 takes precedence
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: C08L 83/06 containing silicon bound to oxygen-containing groups C08L83/12 takes precedence

Abstract

A curable silicone resin composition has excellent closed-system curability, adhesiveness, heat-resistant coloration stability, and balance between transparency and adhesive strength. The curable silicone resin composition is a curable silicone resin composition comprising 100 parts by mass of a silicone A, the weight-average molecular weight of which is 20,000 to 200,000, and which has 2 or more (meth)acryloyl groups per molecule; 10 parts by mass or more of a silicone B, the weight-average molecular weight of which is 1,000 or greater but less than 20,000, and which has 2 or more (meth)acryloyl groups per molecule; 2 parts by mass or more of a silicone C, the weight-average molecular weight of which is 300 or more but less than 1,000, the (meth)acrylic equivalent of which is less than 450 g/mol, and which has 2 or more (meth)acryloyl groups per molecule; and a radical initiator.

Claims

1. A curable silicone resin composition comprising:

100 parts by mass of a silicone A, the weight-average molecular weight of which is 20,000 to 200,000, and which has 2 or more (meth)acryloyl groups per molecule;

10 parts by mass or more of a silicone B, the weight-average molecular weight of which is 1,000 or greater but less than 20,000, and which has 2 or more (meth)acryloyl groups per molecule;

2 parts by mass or more of a silicone C, the weight-average molecular weight of which is 300 or more but less than 1,000, the (meth)acrylic equivalent of which is less than 450 g/mol, and which has 2 or more (meth)acryloyl groups per molecule; and

a radical initiator.

2. The curable silicone resin composition according to claim 1, wherein at least one species selected from the group comprising said silicone A, said silicone B, and said silicone C has one or more silyl groups which include a hydrolyzable group per molecule and/or silanol groups.

3. The curable silicone resin composition according to claim 1, wherein said silicone A is indicated by Formula (A1) below, and said silicone B is indicated by Formula (B1) below:

4. The curable silicone resin composition according to claim 1, wherein said silicone C is at least one species selected from the group comprising compounds indicated by Formula (3) below, Formula (4) below, and Formula (5) below:

5. The curable silicone resin composition according to claim 1, further comprising a condensation catalyst.

6. The curable silicone resin composition according to claim 5, wherein the amount of said condensation catalyst is 0.01 to 10 parts by mass with respect to a total of 100 parts by mass of said silicone A, said silicone B, and said silicone C.

7. The curable silicone resin composition according to claim 1, further comprising a bis(alkoxysilyl)alkane.

8. The curable silicone resin composition according to claim 7, wherein said bis(alkoxysilyl)alkane is at least one species selected from the group comprising bis-(3-trimethoxysilylpropyl)amine, 1,2-bis(triethoxysilyl)ethane, 1,6-bis(trimethoxysilyl)hexane, 1,7-bis(trimethoxysilyl)heptane, 1,8-bis(trimethoxysilyl)octane, 1,9-bis(trimethoxysilyl)nonane, and 1,10-bis(trimethoxysilyl)decane.

9. The curable silicone resin composition according to claim 7, wherein the amount of said bis(alkoxysilyl)alkane is 0.01 to 10 parts by mass with respect to 100 parts by mass of said silicone A.

10. The curable silicone resin composition according to claim 2, wherein said silicone A is indicated by Formula (A1) below, and said silicone B is indicated by Formula (B1) below:

11. The curable silicone resin composition according to claim 2, wherein said silicone C is at least one species selected from the group comprising compounds indicated by Formula (3) below, Formula (4) below, and Formula (5) below:

12. The curable silicone resin composition according to claim 3, wherein said silicone C is at least one species selected from the group comprising compounds indicated by Formula (3) below, Formula (4) below, and Formula (5) below:

13. The curable silicone resin composition according to claim 2, further comprising a condensation catalyst.

14. The curable silicone resin composition according to claim 3, further comprising a condensation catalyst.

15. The curable silicone resin composition according to claim 4, further comprising a condensation catalyst.

16. The curable silicone resin composition according to claim 2, further comprising a bis(alkoxysilyl)alkane.

17. The curable silicone resin composition according to claim 3, further comprising a bis(alkoxysilyl)alkane.

18. The curable silicone resin composition according to claim 4, further comprising a bis(alkoxysilyl)alkane.

19. The curable silicone resin composition according to claim 5, further comprising a bis(alkoxysilyl)alkane.

20. The curable silicone resin composition according to claim 6, further comprising a bis(alkoxysilyl)alkane.