WAFER BOND CMUT ARRAY WITH CONDUCTIVE VIAS
First Claim
1. A wafer-bonded CMUT array comprising a plurality of CMUT elements distributed across a substrate, each element comprising a cavity and a signal electrode formed in the substrate, and a conductive membrane closing the cavity and forming a ground electrode, wherein the membranes of the individual elements form an unbroken ground plane across the surface of the array and wherein electrical connection to the signal electrodes is provided by means of a conductive vias depending therefrom through the substrate from the signal electrode to the rear of the substrate.
2 Assignments
0 Petitions
Accused Products
Abstract
A wafer bonded CMUT array comprising a plurality of CMUT elements distributed across a substrates, each element comprising a cavity and a signal electrode formed in the substrate, and a conductive membrane closing the cavity and forming a ground electrode, wherein the membranes of the individual elements form an unbroken ground plane across the surface of the array and wherein electrical connection to the signal electrodes is provided by means of a conductive vias depending therefrom through the substrate from the signal electrode to the rear of the substrate.
-
Citations
30 Claims
- 1. A wafer-bonded CMUT array comprising a plurality of CMUT elements distributed across a substrate, each element comprising a cavity and a signal electrode formed in the substrate, and a conductive membrane closing the cavity and forming a ground electrode, wherein the membranes of the individual elements form an unbroken ground plane across the surface of the array and wherein electrical connection to the signal electrodes is provided by means of a conductive vias depending therefrom through the substrate from the signal electrode to the rear of the substrate.
-
6. (canceled)
-
8. (canceled)
-
12. (canceled)
-
17. A method of fabricating a CMUT array having a plurality of CMUT elements distributed across a substrate, the method comprising:
-
in the silicon substrate, forming a cavity and a signal electrode for each element and conductive vias providing electrical connection to the electrodes, the conductive vias being arranged to depend from the elements; and providing a conductive membrane to close each cavity and form a ground electrode, whereby an unbroken ground plane is formed across the surface of the CMUT array; wherein the conductive membrane is formed from a silicon wafer that is bonded to the substrate. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
-
-
30-57. -57. (canceled)
Specification