Multi-chip Semiconductor Packages and Assembly Thereof
First Claim
1. A semiconductor package comprising:
- a substrate comprising a first and a second die attach pad;
a first die disposed over the first die attach pad;
a second die disposed over the second die attach pad;
a third die disposed between the first and the second die, a first portion of the third die disposed above a first portion of the first die, a second portion of the third die disposed above a first portion of the second die, and a third portion of the third die disposed above a first area between the first die and the second die.
1 Assignment
0 Petitions
Accused Products
Abstract
Semiconductor packages and method of fabricating them are described. In one embodiment, the semiconductor package includes a substrate having a first and a second die attach pad. A first die is disposed over the first die attach pad. A second die is disposed over the second die attach pad. A third die is disposed between the first and the second die. The third die having a first, a second, and a third portion such that the first portion is disposed above a portion of the first die, the second portion is disposed above a portion of the second die, and the third portion is disposed above an area between the first die and the second die.
73 Citations
26 Claims
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1. A semiconductor package comprising:
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a substrate comprising a first and a second die attach pad; a first die disposed over the first die attach pad; a second die disposed over the second die attach pad; a third die disposed between the first and the second die, a first portion of the third die disposed above a first portion of the first die, a second portion of the third die disposed above a first portion of the second die, and a third portion of the third die disposed above a first area between the first die and the second die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A semiconductor package comprising:
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a substrate comprising a first and a second die attach pad; a first die disposed over the first die attach pad; a second die disposed over the second die attach pad; a third die disposed between the first and the second die, a first portion of the third die disposed above a first portion of the first die, a second portion of the third die disposed above a first portion of the second die, and a third portion of the third die disposed above a first area between the first die and the second die; a fourth die disposed over the first die attach pad, the fourth die disposed adjacent the first die, wherein a fourth portion of the third die is disposed above a portion of the fourth die; and a fifth die disposed over the second die attach pad, the fifth die disposed adjacent the second die, wherein a fifth portion of the third die is disposed above a portion of the fifth die, and wherein a sixth portion of the third die is disposed above a first area between the fourth die and the fifth die. - View Dependent Claims (18, 19, 20, 21, 22)
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23. A method of making a semiconductor package, the method comprising:
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attaching a first die over a first die attach pad of a substrate; attaching a second die over a second die attach pad of the substrate; and attaching a third die to the first and the second die, wherein a first portion of the third die is attached to a first portion of the first die, wherein a second portion of the third die is attached to a first portion of the second die, and wherein a third portion of the third die is attached to a first area between the first die and the second die. - View Dependent Claims (24, 25, 26)
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Specification