SENSOR SELF-DIAGNOSTICS USING MULTIPLE SIGNAL PATHS
First Claim
1. A monolithic integrated circuit sensor system comprising:
- a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and
a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path,wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
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Accused Products
Abstract
Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
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Citations
25 Claims
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1. A monolithic integrated circuit sensor system comprising:
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a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of providing a self-test in a monolithic integrated circuit sensor system comprising:
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implementing, on a single semiconductor chip, a main signal path comprising a main sensor; implementing, on the single semiconductor chip, a secondary sensor and a secondary signal path, the secondary signal path distinct from the main signal path and, when compared with the main signal path, having at least one characteristic selected from the group consisting of being slower, being less precise, having more noise and having a different working principle; and conducting a self-test of the sensor system by comparing a signal of the main signal path with a signal of the secondary signal path. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification