WIRING SUBSTRATE, FILTER DEVICE AND PORTABLE EQUIPMENT

• US 20120075038A1
• Filed: 09/30/2009
• Published: 03/29/2012
• Est. Priority Date: 05/28/2009
• Status: Abandoned Application

• Current Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Kaizaki, Yasuhiro
• Application Number:
  US13/322,686
• Publication Number:
  US 20120075038A1
• Time in Patent Office: Days
• US Class Current: 333/204
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01P 1/20345 Multilayer filters
• CPC Class Codes: H01P 1/20372 Hairpin resonators
• CPC Class Codes: H01P 3/026 Coplanar striplines [CPS]
• CPC Class Codes: H03H 7/0123 comprising distributed impedance elements together with lumped impedance elements
• CPC Class Codes: H05K 1/0245 Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
• CPC Class Codes: H05K 1/0253 Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings H05K1/0251 takes precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09263 Meander

Abstract

In a wiring substrate, a wiring layer includes a pair of differential transmission lines. A conductive layer is provided on one side of the wiring layer. The conductive layer is grounded. An insulating layer is provided between the wiring layer and the conductive layer. The conductive layer includes a region, formed by an electrically continuous conductor, within a filter region. At least part of the conductor is turned around in the region. Seen from a stacking direction, the pair of differential transmission lines intersects with at least two strip portions disposed counter to each other because of the turning-around of the electrically continuous conductor.

Claims

1. A wiring substrate comprising:

a wiring layer including a pair of differential transmission lines;

a conductive layer where an electric potential thereof is fixed; and

an insulating layer provided between the wiring layer and the conductive layer,

wherein the conductive layer has a region formed by an electrically continuous conductor, and

wherein as seen from a stacking direction, the pair of transmission lines intersects with the conductor at a plurality of positions.

2. A wiring substrate according to claim 1, wherein at least part of the conductor is turned around a plurality of times in the region, and

wherein, as seen from the stacking direction, the pair of differential transmission lines intersects with a plurality of strip portions disposed counter to each other due to the turning-around of the conductor.

3. A wiring substrate according claim 2, wherein the plurality of strip portions are formed such that a first strip portion and a second strip portion, which differs from the first strip portion in width, are formed alternately.

4. A wiring substrate according to claim 1, wherein the region has a first region formed by a first electrically continuous conductor and a second region formed by a second electrically continuous conductor differing from the first conductor in width.

5. A wiring substrate according to claim 1, wherein at least part of the conductor is formed in a helical shape in the region.

6. A wiring substrate according to claim 1, further comprising a magnetic material layer provided on a side of the conductive layer, the side being opposite to the wiring layer.

12. A portable device that mounts a wiring substrate according to claim 1.

7. A wiring substrate comprising:

a wiring layer including a pair of differential transmission lines;

a conductive layer, where an electric potential thereof is fixed, provided on one side of the wiring layer; and

an insulating layer provided between the wiring layer and the conductive layer;

another conductive layer, where an electric potential thereof is fixed, provided on the other side of the wiring layer; and

another insulating layer provided between the another conductive layer and the wiring layer,

wherein the conductive layer has a region formed by an electrically continuous conductor,

wherein as seen in a stacking direction, the pair of transmission lines intersects with the conductor at a plurality of positions,

wherein the another conductive layer has a region formed by another electrically continuous conductor, and

wherein as seen in the stacking direction, the pair of transmission lines intersects with the another conductor at a plurality of positions.

8. A wiring substrate according to claim 7, wherein the width of the conductor differs from that of the another conductor.

9. A wiring substrate according to claim 7, wherein an electric path having a starting point in the conductor and an end point in the another conductor is formed by way of a via that connects the conductor to the another conductor.

10. A wiring substrate according to claim 7, further comprising a magnetic material layer provided at least one of on a side of the conductive layer, the side being opposite to the wiring layer, and on a side of the another conductive layer, the side being opposite to the wiring layer.

11. A filter device comprising:

a wiring layer including a pair of differential transmission lines;

a conductive layer where an electric potential thereof is fixed;

an insulating layer provided between the wiring layer and the conductive layer;

a first external terminal connected to one end of one of the differential transmission line pair, the first external terminal being exposed on a surface of the filter device;

a second external terminal connected to the other end of one of the differential transmission line pair, the second external terminal being disposed on a surface of the filter device;

a third external terminal connected to one end of the other of the differential transmission line pair, the third external terminal being exposed on a surface of the filter device;

a fourth external terminal connected to the other end of the other of the differential transmission line pair, the fourth external terminal being disposed on a surface of the filter device; and

a fifth external terminal connected to the conductive layer, the fifth external terminal being exposed on a surface of the filter device,

wherein the conductive layer has a region formed by an electrically continuous conductor, and

wherein as seen in a stacking direction, the pair of transmission lines intersects with the conductor at a plurality of positions.