METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE

• US 20120077292A1
• Filed: 06/10/2011
• Published: 03/29/2012
• Est. Priority Date: 09/23/2010
• Status: Abandoned Application

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: CHANG, CHAO-HSIUNG, HU, PI-CHIANG
• Application Number:
  US13/157,318
• Publication Number:
  US 20120077292A1
• Time in Patent Office: Days
• US Class Current: 438/27
• CPC Class Codes: B29C 31/045 moving along predetermined circuits or distributing the material according to predetermined patterns
• CPC Class Codes: B29C 39/10 incorporating preformed parts or layers, e.g. casting around inserts or for coating articles coating a surface by casting in general B05D1/30, B29C39/126 takes precedence
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An exemplary method of manufacturing an LED package includes providing a base, the base having a reflecting cup with a receiving recess defined therein; an LED chip is then mounted on the base and secured in a bottom of the receiving recess; thereafter, a dispensing nozzle is used to apply an encapsulating material into the receiving recess to encapsulate the LED chip; finally, the encapsulating material is baked to form an encapsulating layer. The dispensing nozzle moves relative to the receiving recess during the application of the encapsulating material. A depth of the receiving recess is varied. Parameters of the application of the encapsulating material into the receiving recess by the dispensing nozzle vary in response to a change of the depth of the receiving recess.

Claims

1. A method of manufacturing a light emitting diode (LED) package comprising:

providing a base, the base having a reflecting cup with a receiving recess defined therein;

providing an LED chip and mounting the LED chip in a bottom of the receiving recess;

using a dispensing nozzle to apply an encapsulating material into the receiving recess to encapsulate the LED chip, the dispensing nozzle moving relative to the receiving recess during the application of the encapsulating material into the receiving recess; and

baking the encapsulating material to form an encapsulating layer.

2. The method of claim 1, wherein the dispensing nozzle moves from one side to an opposite side of the receiving recess during the application of the encapsulating material into the receiving recess.

3. The method of claim 1, wherein a depth of the receiving recess increases inward from an outer periphery thereof, and the depth of the receiving recess at a central portion thereof remains unchanged and has a maximum value.

4. The method of claim 3, wherein a moving speed of the dispensing nozzle increases as the depth of the receiving recess decreases.

5. The method of claim 4, wherein when the dispensing nozzle is located at the central portion of the receiving recess, the moving speed of the dispensing nozzle is remained at a minimum value.

6. The method of claim 3, wherein a speed of dispensation of the encapsulating material from the dispensing nozzle increases as the depth of the receiving recess increases.

7. The method of claim 6, wherein when the dispensing nozzle is located at the central portion of the receiving recess, the speed of dispensation of the encapsulating material from the dispensing nozzle is remained at a maximum value.

8. The method of claim 3, wherein a pressure of dispensation of the encapsulating material from the dispensing nozzle increases as the depth of the receiving recess increases.

9. The method of claim 8, wherein when the dispensing nozzle is located at the central portion of the receiving recess, the pressure of dispensation of the encapsulating material from the dispensing nozzle is remained at a maximum value.

10. The method of claim 3, wherein the encapsulating layer is level with a top of the reflecting cup.

11. The method of claim 1, wherein an additional dispensing nozzle is used to cooperate with the dispensing nozzle to apply the encapsulating material into the receiving recess.

12. The method of claim 11, wherein the dispensing nozzle and the additional dispensing nozzle move from a central portion of the receiving recess to an outer periphery of the receiving recess respectively.

13. A method of manufacturing an LED package comprising:

providing a base, the base defining a receiving recess with an LED chip received therein;

using at least one dispensing nozzle to apply an encapsulating material into the receiving recess to encapsulate the LED chip, the at least one dispensing nozzle moving at a horizontal plane relative to the receiving recess during the application of the encapsulating material into the receiving recess; and

baking the encapsulating material to form an encapsulating layer.

14. The method of claim 13, wherein during the application of the encapsulating material into the receiving recess, the at least one dispensing nozzle moves radially from a center portion of the receiving recess to an outer periphery of the receiving recess, straightly from one side of the receiving recess to an opposite side of the receiving recess, or spirally.

15. The method of claim 13, wherein at least one of moving speed of the at least one dispensing nozzle, dispensing speed of the encapsulating material from the at least one dispensing nozzle and dispensing pressure of the encapsulating material from the at least one dispensing nozzle varies in response to a variation of depth of the receiving recess, and the moving speed decreases, the dispensing speed and the dispensing pressure increase as the depth of the receiving recess increases.