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METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE

  • US 20120077292A1
  • Filed: 06/10/2011
  • Published: 03/29/2012
  • Est. Priority Date: 09/23/2010
  • Status: Abandoned Application
First Claim
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1. A method of manufacturing a light emitting diode (LED) package comprising:

  • providing a base, the base having a reflecting cup with a receiving recess defined therein;

    providing an LED chip and mounting the LED chip in a bottom of the receiving recess;

    using a dispensing nozzle to apply an encapsulating material into the receiving recess to encapsulate the LED chip, the dispensing nozzle moving relative to the receiving recess during the application of the encapsulating material into the receiving recess; and

    baking the encapsulating material to form an encapsulating layer.

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