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SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

  • US 20120080408A1
  • Filed: 03/18/2011
  • Published: 04/05/2012
  • Est. Priority Date: 09/30/2010
  • Status: Active Grant
First Claim
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1. A substrate processing method using a substrate processing apparatus, comprising:

  • a first step of applying a negative voltage pulse from a pulsed power supply to be included in the apparatus; and

    a second step of applying floating potential for an interval of time between the negative voltage pulse and a positive voltage pulse from the pulsed power supply subsequent to the negative voltage pulse,whereinthe apparatus includes;

    a chamber;

    a first electrode to be provided inside the chamber;

    a second electrode to be provided so that the second electrode faces the first electrode to hold a substrate;

    an RF power supply to apply an RF voltage having a frequency of 50 MHz or higher to the second electrode; and

    the pulsed power supply to repeatedly apply a voltage waveform with the RF voltage to the second electrode, the voltage waveform including a negative voltage pulse and a positive voltage pulse.

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