Light Emitting Diode Package Structure and Manufacturing Method Thereof
First Claim
1. A light emitting diode (LED) package structure, comprising:
- a fluorescent substrate having a first surface and a second surface opposite the first surface, the fluorescent substrate comprising a fluorescent material and a glass material;
a first electrically conductive pattern disposed on the first surface of the fluorescent substrate;
a second electrically conductive pattern disposed on the second surface of the fluorescent substrate;
at least one electrically conductive component connecting the first electrically conductive pattern and the second electrically conductive pattern; and
an LED chip disposed on the second surface of the fluorescent substrate, the LED chip having a light extraction surface coupled to the second electrically conductive pattern such that the LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive component.
2 Assignments
0 Petitions
Accused Products
Abstract
In one aspect, an LED package structure comprises a fluorescent substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The fluorescent substrate has a first surface and a second surface opposite the first surface. The fluorescent substrate comprises a mixture of a fluorescent material and a glass material. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The electrically conductive element passes through the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the electrically conductive element.
-
Citations
19 Claims
-
1. A light emitting diode (LED) package structure, comprising:
-
a fluorescent substrate having a first surface and a second surface opposite the first surface, the fluorescent substrate comprising a fluorescent material and a glass material; a first electrically conductive pattern disposed on the first surface of the fluorescent substrate; a second electrically conductive pattern disposed on the second surface of the fluorescent substrate; at least one electrically conductive component connecting the first electrically conductive pattern and the second electrically conductive pattern; and an LED chip disposed on the second surface of the fluorescent substrate, the LED chip having a light extraction surface coupled to the second electrically conductive pattern such that the LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A manufacturing method of a light emitting diode (LED) package structure, the method comprising:
-
providing a fluorescent substrate having a first surface and a second surface opposite the first surface, the fluorescent substrate containing therein a plurality of electrically conductive components that connect the first surface and the second surface, the fluorescent substrate comprising a mixture of at least one fluorescent material and a glass material; forming a first electrically conductive pattern on the first surface and a second electrically conductive pattern on the second surface, at least some of the electrically conductive components connecting the first electrically conductive pattern and the second electrically conductive pattern; and bonding a plurality of LED chips on the second surface of the fluorescent substrate, each of the LED chips having a respective light extraction surface coupled to the second electrically conductive pattern, each of the LED chips electrically coupled to the first electrically conductive pattern via a corresponding one of the electrically conductive components. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
-
Specification