Light Emitting Diode Package Structure and Manufacturing Method Thereof

• US 20120080703A1
• Filed: 06/29/2011
• Published: 04/05/2012
• Est. Priority Date: 09/30/2010
• Status: Active Grant

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited, Poly-Flow Engineering, LLC
• Inventors: Lin, Hsien Chia
• Granted Patent: US 8,796,713 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED package structure comprises a substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The substrate has a first surface and a second surface opposite to the first surface. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The at least one electrically conductive element traverses the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive element.

Claims

1. A light emitting diode (LED) package structure, comprising:

a substrate having a first surface and a second surface opposite to the first surface;

a first electrically conductive pattern disposed on the first surface of the substrate;

a second electrically conductive pattern disposed on the second surface of the substrate;

at least one electrically conductive component traversing the substrate and connecting the first electrically conductive pattern and the second electrically conductive pattern; and

an LED chip disposed on the second surface of the substrate, the LED chip having a light extraction surface coupled to the second electrically conductive pattern such that the LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive component.

2. The LED package structure of claim 1, wherein the substrate is a fluorescent substrate comprising a mixture of at least one fluorescent material and a transparent material.

3. The LED package structure of claim 2, wherein the at least one fluorescent material comprises a yellow phosphor.

4. The LED package structure of claim 2, wherein the at least one fluorescent material comprises phosphors of at least two different wavelengths.

5. The LED package structure of claim 4, wherein the phosphors comprise at least two of yellow phosphor, red phosphor, and green phosphor.

6. The LED package structure of claim 2, further comprising an underfill disposed between the light extraction surface of the LED chip and the second surface of the fluorescent substrate, the underfill covering at least partially the light extraction surface of the LED chip.

7. The LED package structure of claim 6, wherein the underfill covers at least partially a side surface of the LED chip.

8. The LED package structure of claim 1, wherein the LED chip comprises a sapphire substrate.

9. The LED package structure of claim 1, wherein the LED chip comprises a blue-light LED chip.

10. The LED package structure of claim 1, further comprising a circuit board, a back surface of the LED chip opposite to the light extraction surface disposed on the circuit board.

11. The LED package structure of claim 10, further comprising at least one bonding wire that electrically couples the circuit board and the first electrically conductive pattern.

12. A manufacturing method of a light emitting diode (LED) package structure, the method comprising:

providing a substrate having a first surface and a second surface opposite to the first surface, the substrate containing therein at least one electrically conductive component that connects the first surface and the second surface;

forming a first electrically conductive pattern on the first surface and a second electrically conductive pattern on the second surface such that the at least one electrically conductive component electrically couples the first electrically conductive pattern and the second electrically conductive pattern; and

bonding an LED chip on the second surface of the fluorescent substrate with a light extraction surface of the LED chip coupled to the second electrically conductive pattern, the LED chip electrically coupled to the first electrically conductive pattern via the at least one electrically conductive component.

13. The method of claim 12, wherein providing the substrate comprises providing a fluorescent substrate that comprises a mixture of at least one fluorescent material and a transparent material.

14. The method of claim 13, wherein the at least one fluorescent material comprises a yellow phosphor, phosphors of at least two different wavelengths, or at least two of yellow phosphor, red phosphor, and green phosphor.

15. The method of claim 13, further comprising:

providing at least one electrically conductive bump in a recess of a supporting substrate;

filling the recess of the supporting substrate with the at least one fluorescent material and the transparent material, the at least one fluorescent material and the glass material covering the at least one electrically conductive bump;

heating the at least one electrically conductive bump, the at least one fluorescent material, and the glass material together to form the fluorescent substrate with the at least one electrically conductive bumps embedded therein; and

polishing the fluorescent substrate and the at least one electrically conductive bump to form the at least one electrically conductive component that is flush with the first surface of the fluorescent substrate.

16. The method of claim 12, further comprising:

forming at least one through hole in the substrate, the at least one through hole connecting the first surface and the second surface of the substrate;

electroplating the at least one through hole to form at least one respective electrically conductive pillar protruding out of the first surface of the substrate; and

polishing the at least one electrically conductive pillar to provide the at least one electrically conductive component that is flush with the first surface of the substrate.

17. The method of claim 16, wherein the polishing comprises cutting the substrate with a cutting device to reduce a thickness of the substrate and to expose the at least one electrically conductive component.

18. The method of claim 12, further comprising:

forming at least one conductive line on the second surface after forming the second electrically conductive pattern, the at least one conductive line connecting the second electrically conductive pattern.

19. The method of claim 12, further comprising:

forming an underfill between the light extraction surface of the LED chip and the second surface of the substrate after bonding the LED chip on the second surface of the substrate, the underfill covering at least partially the light extraction surface of the LED chip.

20. The method of claim 19, wherein the underfill covers at least partially a side surface of the LED chip.