Light Emitting Diode Package Structure and Manufacturing Method Thereof
First Claim
1. A light emitting diode (LED) package structure, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
a first electrically conductive pattern disposed on the first surface of the substrate;
a second electrically conductive pattern disposed on the second surface of the substrate;
at least one electrically conductive component traversing the substrate and connecting the first electrically conductive pattern and the second electrically conductive pattern; and
an LED chip disposed on the second surface of the substrate, the LED chip having a light extraction surface coupled to the second electrically conductive pattern such that the LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive component.
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Accused Products
Abstract
An LED package structure comprises a substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The substrate has a first surface and a second surface opposite to the first surface. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The at least one electrically conductive element traverses the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive element.
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Citations
20 Claims
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1. A light emitting diode (LED) package structure, comprising:
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a substrate having a first surface and a second surface opposite to the first surface; a first electrically conductive pattern disposed on the first surface of the substrate; a second electrically conductive pattern disposed on the second surface of the substrate; at least one electrically conductive component traversing the substrate and connecting the first electrically conductive pattern and the second electrically conductive pattern; and an LED chip disposed on the second surface of the substrate, the LED chip having a light extraction surface coupled to the second electrically conductive pattern such that the LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A manufacturing method of a light emitting diode (LED) package structure, the method comprising:
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providing a substrate having a first surface and a second surface opposite to the first surface, the substrate containing therein at least one electrically conductive component that connects the first surface and the second surface; forming a first electrically conductive pattern on the first surface and a second electrically conductive pattern on the second surface such that the at least one electrically conductive component electrically couples the first electrically conductive pattern and the second electrically conductive pattern; and bonding an LED chip on the second surface of the fluorescent substrate with a light extraction surface of the LED chip coupled to the second electrically conductive pattern, the LED chip electrically coupled to the first electrically conductive pattern via the at least one electrically conductive component. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification