METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE
First Claim
Patent Images
1. A semiconductor component, comprising:
- a first electrically conductive structure having first and second ends and a body region between the first and second ends;
a second electrically conductive structure having first and second ends and a body region between the first and second ends, the second electrically conductive structure vertically spaced apart from the first electrically conductive structure and a first portion of the body region of the second electrically conductive structure over a first portion of the body region of the first electrically conductive structure;
a first bond wire having first and second ends, wherein the first end of the first bond wire is electrically coupled to the first end of the first electrically conductive structure; and
a second bond wire having first and second ends, wherein the first end of the second bond wire is electrically coupled to the first end of the second electrically conductive structure.
4 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
7 Citations
22 Claims
-
1. A semiconductor component, comprising:
-
a first electrically conductive structure having first and second ends and a body region between the first and second ends; a second electrically conductive structure having first and second ends and a body region between the first and second ends, the second electrically conductive structure vertically spaced apart from the first electrically conductive structure and a first portion of the body region of the second electrically conductive structure over a first portion of the body region of the first electrically conductive structure; a first bond wire having first and second ends, wherein the first end of the first bond wire is electrically coupled to the first end of the first electrically conductive structure; and a second bond wire having first and second ends, wherein the first end of the second bond wire is electrically coupled to the first end of the second electrically conductive structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A semiconductor component, comprising:
-
a first coil having a first set of coil elements comprising a first set of electrically conductive strips and a second set of coil elements comprising a first set of bond wires; and a second coil having a second set of coil elements comprising a second set of electrically conductive strips and a second set of coil elements comprising a second set of bond wires. - View Dependent Claims (10, 11, 12)
-
-
13. A semiconductor component, comprising:
-
a semiconductor material having a major surface; a first metallization system formed over the semiconductor material, the first metallization system comprising at least one electrical interconnect structure; a first dielectric structure formed over the first metallization system; a second metallization system formed over the first dielectric structure, the second metallization comprising a first set of coils; a second dielectric structure formed over the second metallization system; and a third metallization system formed over the second dielectric structure, the third metallization system comprising a second set of coils. - View Dependent Claims (14, 15, 16)
-
-
17. A method for manufacturing a semiconductor component, comprising:
-
providing a semiconductor material having a major surface; forming a first metallization system over the semiconductor material; forming a first dielectric structure over the first metallization system; forming a first template over the first dielectric structure, the template having openings that expose portions of the first dielectric structure; forming a second metallization system on the exposed portions of the first dielectric structure; forming a second dielectric structure over the second metallization system; forming a second template over the second dielectric structure, the template having openings that expose portions of the second dielectric structure; and forming a third metallization system on the exposed portions of the second dielectric structure. - View Dependent Claims (18, 19, 20, 21, 22)
-
Specification