CURRENT SENSOR
First Claim
1. A current sensor, comprisinga flat housing made of plastic having an underside, an upper side and four side walls, electrical connections and a current conductor through which the current to be measured flows, anda semiconductor chip having two magnetic field sensors, wherein the component of the magnetic field detected by the two magnetic field sensors points in opposite directions at the locations of the two magnetic field sensors, wherein the semiconductor chip is connected as flipchip to the electrical connections, whereinthe current conductor extends from one side wall to the opposite side wall of the housing, is embedded flat in the underside of the housing and is exposed on the underside of the housing,the mutually opposite ends of the current conductor substantially have the same width as the entirety of the electrical contacts that would have room at a side wall of the housing accommodating an end of the current conductor, andthe opposing surfaces of the semiconductor chip and the current conductor are separated by an electrical insulation layer.
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Accused Products
Abstract
A current sensor comprises a flat housing made of plastic having an underside and an upper side and electrical connections, a current conductor through which the current to be measured flows, and a semiconductor chip having two magnetic field sensors, wherein the component of the magnetic field detected by the two magnetic field sensors points in opposite directions at the locations of the two magnetic field sensors. The semiconductor chip is connected as flipchip to the electrical connections. The current conductor extends from one side wall to the opposite side wall of the housing, is embedded flat in the underside of the housing and is therefore exposed on the underside of the housing. The opposing surfaces of the semiconductor chip and the current conductor are separated by an electrical insulation layer.
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Citations
13 Claims
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1. A current sensor, comprising
a flat housing made of plastic having an underside, an upper side and four side walls, electrical connections and a current conductor through which the current to be measured flows, and a semiconductor chip having two magnetic field sensors, wherein the component of the magnetic field detected by the two magnetic field sensors points in opposite directions at the locations of the two magnetic field sensors, wherein the semiconductor chip is connected as flipchip to the electrical connections, wherein the current conductor extends from one side wall to the opposite side wall of the housing, is embedded flat in the underside of the housing and is exposed on the underside of the housing, the mutually opposite ends of the current conductor substantially have the same width as the entirety of the electrical contacts that would have room at a side wall of the housing accommodating an end of the current conductor, and the opposing surfaces of the semiconductor chip and the current conductor are separated by an electrical insulation layer.
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9. A device for measuring current, comprising
a printed circuit board having a conductor path, and a current sensor for measurement of the current flowing in the conductor path, wherein the current sensor comprises a flat housing made of plastic having an underside, an upper side and four side walls, electrical connections and a current conductor through which the current to be measured flows, and a semiconductor chip having two magnetic field sensors, wherein the component of the magnetic field detected by the two magnetic field sensors points in opposite directions at the locations of the two magnetic field sensors, wherein the semiconductor chip is connected as flipchip to the electrical connections, wherein the current conductor extends from one side wall to the opposite side wall of the housing, is embedded flat in the underside of the housing and is exposed on the underside of the housing, the mutually opposite ends of the current conductor substantially have the same width as the entirety of the electrical contacts that would have room at a side wall of the housing accommodating an end of the current conductor, and the opposing surfaces of the semiconductor chip and the current conductor are separated by an electrical insulation layer, and wherein the conductor path is interrupted at a predetermined point, the printed circuit board has at least one metallic, electrically free-floating surface which is either soldered to the current conductor of the current sensor and/or is connected to the conductor path.
Specification