METHOD AND SYSTEM FOR MODIFYING PHOTORESIST USING ELECTROMAGNETIC RADIATION AND ION IMPLANTATION

• US 20120082942A1
• Filed: 10/01/2010
• Published: 04/05/2012
• Est. Priority Date: 10/01/2010
• Status: Active Grant

• Current Assignee: Varian Semiconductor Equipment Associates Incorporated (Applied Materials Incorporated)
• Original Assignee: Varian Semiconductor Equipment Associates Incorporated (Applied Materials Incorporated)
• Inventors: Godet, Ludovic, Martin, Patrick M.
• Granted Patent: US 8,435,727 B2
• Time in Patent Office: Days
• US Class Current: 430/322
• CPC Class Codes: C23C 16/50 using electric discharges generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34
• CPC Class Codes: G03F 7/405 Treatment with inorganic or organometallic reagents after imagewise removal
• CPC Class Codes: G03F 7/427 using plasma means only
• CPC Class Codes: G03F 7/7045 Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
• CPC Class Codes: G03F 7/70875 Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/32412 Plasma immersion ion implantation
• CPC Class Codes: H01J 37/32422 Arrangement for selecting ions or species in the plasma
• CPC Class Codes: H01L 21/0273 characterised by the treatment of photoresist layers

Abstract

A method of reducing surface roughness of a resist feature disposed on a substrate includes generating a plasma having a plasma sheath and ions therein. A shape of the boundary between the plasma and plasma sheath is modified using a plasma sheath modifier, so that a portion of the boundary facing the substrate is not parallel to a plane defined by the substrate. During a first exposure, the resist feature is exposed to electromagnetic radiation having a desired wavelength and the ions are accelerated across the boundary having the modified shape toward the resist features over an angular range.

Claims

1. A method of reducing surface roughness of a resist feature disposed on a substrate, comprising:

generating a plasma having a plasma sheath and ions therein;

modifying a shape of a boundary defined between the plasma and the plasma sheath with a plasma sheath modifier so that a portion of the boundary facing the substrate is not parallel to a plane defined by the substrate;

exposing the resist feature to electromagnetic radiation having a desired wavelength range during a first exposure; and

accelerating the ions across the boundary having the modified shape toward the resist features over an angular range during the first exposure.

2. The method of claim 1, wherein modifying the shape of the boundary comprises providing a plasma sheath modifier that has a pair of modifier parts and that defines a gap therebetween, and Wherein the shape of the boundary about the gap is convex relative to the plane.

3. The method of claim 2, wherein the angular range is between about positive 60°

to about negative 60°

centered about an axis perpendicular to the plane defined by the substrate.

4. The method of claim 1, wherein the exposing and the accelerating occur at the same time.

5. The method of claim 1, wherein an energy of the dose of ions is about 1 keV to about 10 keV.

6. The method of claim 1, further comprising maintaining temperature of the substrate at about 30°

C. or higher during the first exposure.

7. The method of claim 1, wherein the plasma sheath modifier comprises one or more layers of semiconducting films.

8. The method of claim 1, wherein the plasma sheath modifier is configured to transmit the electromagnetic radiation having a desired wavelength range and to block electromagnetic radiation having a wavelength range outside the desired wavelength range.

9. The method of claim 8, wherein the desired wavelength range comprises an ultraviolet (UV) wavelength range.

10. The method of claim 1, wherein the plasma sheath modifier is substantially transparent to UV radiation.

11. A method of modifying roughness in a patterned resist feature provided on a substrate, the resist feature having a first roughness, comprising:

generating a plasma having a plasma sheath and ions therein;

providing a plasma sheath modifier (PSM) defining an aperture that is operable to modify a shape of a boundary between the plasma and the plasma sheath;

accelerating ions across the boundary having the modified shape toward the patterned resist feature during a first exposure; and

exposing the patterned resist feature to electromagnetic radiation having a first wavelength range during at least a portion of the first exposure, the electromagnetic radiation being emitted from the plasma, wherein the patterned resist feature exposed to the ions and the electromagnetic radiation having the first wavelength range exhibits a second roughness that is less than the first roughness.

12. The method of claim 11, wherein the first wavelength range is a UV wavelength range.

13. The method of claim 11, wherein the first wavelength range is an infra-red (IR) wavelength range.

14. The method of claim 11, wherein the plasma contains first and second species, the first species being configured to produce ions that reduce the first roughness upon impingement on the resist features, and the second species being configured to emit the electromagnetic radiation within a UV wavelength range.

15. The method of claim 11, further comprising providing an elevated substrate temperature between about 30°

C. and about 300°

C. during the first exposure.

16. The method of claim 11, wherein the plasma sheath modifier includes a material that blocks electromagnetic radiation having a second wavelength range outside the first wavelength range.

17. The method of claim 11, wherein the plasma sheath modifier comprises quartz.

18. The method of claim 11, wherein the plasma sheath modifier comprises one or more silicon thin films.

19. The method of claim 11, wherein the ions impinge upon the patterned resist feature over an angular range during the first exposure.

20. A system for processing resist features disposed on a substrate, comprising:

a plasma source configured to generate a plasma having a plasma sheath; and

a plasma sheath modifier disposed between the plasma and the substrate, the plasma sheath modifier configured to control a shape of a boundary defined between the plasma and the plasma sheath such that a portion of the shape of the boundary is not parallel to a plane defined by the substrate in front of the plasma, the plasma sheath modifier configured to transmit electromagnetic radiation having a desired wavelength range, the electromagnetic radiation being emitted from the plasma.

21. The plasma processing system of claim 20, wherein the plasma sheath modifier is configured to block an electromagnetic radiation range outside of the desired wavelength range.

22. The plasma processing system of claim 21, wherein the desired wavelength range is a UV wavelength range.

23. The plasma processing system of claim 21, wherein the desired wavelength range is an IR wavelength range.

24. A method of reducing roughness in a resist feature, comprising:

generating a plasma having a plasma sheath;

modifying a shape of a boundary defined between the plasma and the plasma sheath with a plasma sheath modifier such that a portion of the shape of the boundary is not parallel to a plane defined by the substrate facing the plasma;

maintaining temperature of the substrate from about 30°

C. to about 300°

C. during the first exposure; and

impinging ions from the plasma on the resist feature over an angular range during a first exposure so as to decrease the roughness of the resist features.