Wear-Out Detection Methods for Printed Circuit Board Assembly Components Used in Downhole Oilfield Environments

• US 20120084065A1
• Filed: 10/03/2011
• Published: 04/05/2012
• Est. Priority Date: 10/05/2010
• Status: Active Grant

• Current Assignee: Baker Hughes Incorporated (Baker Hughes Company)
• Original Assignee: Baker Hughes Incorporated (Baker Hughes Company)
• Inventors: Zhan, Sheng, Ahmad, Izhar
• Granted Patent: US 9,411,913 B2
• Time in Patent Office: Days
• US Class Current: 703/13
• CPC Class Codes: G06F 2119/04 Ageing analysis or optimisation against ageing
• CPC Class Codes: G06F 30/20 Design optimisation, verification or simulation optimisation, verification or simulation of circuit designs G06F30/30

Abstract

A method, apparatus and computer-readable medium for determining a lifespan of an electronic component in a downhole environment is disclosed. A first wear-out model is created that is related to a selected electronic component. A physical condition of the selected electronic component is examined at a selected examination time. The physical condition is generally due to the downhole environment in which the electronic component is disposed. A second wear-out model for the selected electronic component is created from the first wear-out model and the examined physical condition of the selected electronic component.

Claims

1. A method of creating a wear-out model for an electronic component in a downhole environment, comprising:

creating a first wear-out model related to a selected electronic component;

examining a physical condition of the selected electronic component due to the downhole environment at a selected examination time; and

creating a second wear-out model for the selected electronic component from the first wear-out model and the examined physical condition of the selected electronic component.

2. The method of claim 1, further comprising monitoring a stress at the selected electronic component in the downhole environment and comparing the monitored stress to the first wear-out model to select the examination time.

3. The method of claim 1, further comprising creating the first wear-out model from another electrical component similar to the selected electrical component.

4. The method of claim 3, further comprising simulating a downhole stress at the other electrical component.

5. The method of claim 4, further comprising determining a failure rate of a plurality of sensors at the other electronic component to create the first wear-out model.

6. The method of claim 1, wherein examining the physical condition of the selected electrical component further comprises nondestructively testing the selected electronic component.

7. The method of claim 1, further comprising relating the examined physical condition of the electronic component to one of:

(i) a remaining lifetime of the electronic component;

(ii) a reliability level of the electronic component; and

(iii) a point on a wear-out model of the electronic component.

8. The method of claim 1, wherein the selected electronic component is a printed circuit board assembly.

9. An apparatus for creating a wear-out model for a selected electronic component used in a downhole environment, comprising:

a processor configured to;

create a first wear-out model related to the selected electronic component,

obtain data related to a physical condition of the selected electronic component at a selected examination time, and

create a second wear-out model for the selected electronic component from the first wear-out model and the obtained physical condition data of the selected electronic component.

10. The apparatus of claim 9, further comprising one or more sensors configured to monitor a stress at the selected electronic component in the downhole environment, wherein the processor is further configured to compare the monitored stress to the first wear-out model to select the examination time.

11. The apparatus of claim 9 wherein the processor is further configured to create the first wear-out model from data obtained from another electronic component similar to the selected electronic component.

12. The apparatus of claim 11, wherein the data is obtained for the first wear-out model by applying a simulated downhole stress to the other electronic component.

13. The apparatus of claim 12, wherein the processor is further configured to determine a failure rate of a plurality of sensors at the other device to create the first wear-out model.

14. The apparatus of claim 9, wherein the data related to the physical condition of the selected electronic component further comprises nondestructive test data obtained from the selected electronic component.

15. The apparatus of claim 9, wherein the processor is further configured to relate the examined physical condition of the electronic component to one of:

(i) a remaining lifetime of the electronic component;

(ii) a reliability level of the electronic component; and

(iii) a point on a wear-out model of the electronic component.

16. The apparatus of claim 9, wherein the selected electronic component is a printed circuit board assembly.

17. A computer-readable medium include instruction therein and accessible to a processor, wherein the processor reads the instructions to perform a method for creating a wear-out model for a selected electronic component used in a downhole environment, comprising:

creating a first wear-out model related to the selected electronic component,

obtaining data related to a physical condition of the selected electronic component at a selected examination time, and

creating a second wear-out model for the selected electronic component from the first wear-out model and the obtained physical condition data of the selected electronic component.

18. The computer-readable medium of claim 17, further comprising:

(i) monitoring a stress at the selected electronic component in the downhole environment, and

(ii) comparing the monitored stress to the first wear-out model to select the examination time.

19. The computer-readable medium for claim 17, further comprising creating the first wear-out model from another electrical component similar to the selected electrical component.

20. The computer-readable medium of claim 19, further comprising simulating a downhole stress at the other electrical component and determining a failure rate of a plurality of sensors at the other electronic component to create the first wear-out model.