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PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

  • US 20120086126A1
  • Filed: 10/08/2010
  • Published: 04/12/2012
  • Est. Priority Date: 10/08/2010
  • Status: Active Grant
First Claim
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1. A package system comprising:

  • a first substrate;

    a second substrate electrically coupled with the first substrate, the second substrate comprising at least one first opening; and

    at least one electrical bonding material disposed between the first substrate and the second substrate, wherein a first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.

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