PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
First Claim
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1. A package system comprising:
- a first substrate;
a second substrate electrically coupled with the first substrate, the second substrate comprising at least one first opening; and
at least one electrical bonding material disposed between the first substrate and the second substrate, wherein a first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.
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Abstract
A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.
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Citations
20 Claims
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1. A package system comprising:
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a first substrate; a second substrate electrically coupled with the first substrate, the second substrate comprising at least one first opening; and at least one electrical bonding material disposed between the first substrate and the second substrate, wherein a first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A package system comprising:
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a first substrate comprising a semiconductor pad; a second substrate comprising a metallic pad electrically coupled with the semiconductor pad, wherein at least one of the first and second substrates comprises at least one opening in which a portion of a material of the metallic pad is at least partially filled. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method of forming a package system, the method comprising:
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providing a first substrate; bonding the first substrate and a second substrate through at least one electrical bonding material between the first and second substrate, the second substrate comprising at least one first opening, wherein the bonding process pushes a first portion of the at least one electrical bonding material at least partially filling in the at least one first opening. - View Dependent Claims (17, 18, 19, 20)
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Specification