MICROSCALE HEAT TRANSFER SYSTEMS

• US 20120087088A1
• Filed: 03/01/2010
• Published: 04/12/2012
• Est. Priority Date: 08/05/2008
• Status: Abandoned Application

• Current Assignee: KES Systems Inc.
• Original Assignee: Pipeline Micro Inc.
• Inventors: Determan, Matthew, Lee, Scott W.C.H., Killion, Jesse David, Lee, Seri, Ho, Abel Manual Siu
• Application Number:
  US13/203,635
• Publication Number:
  US 20120087088A1
• Time in Patent Office: Days
• US Class Current: 361/697
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28D 2021/0031 Radiators for recooling a coolant of cooling systems
• CPC Class Codes: F28F 13/08 by varying the cross-section of the flow channels
• CPC Class Codes: F28F 2250/04 Communication passages between channels
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: F28F 2270/00 Thermal insulation; Thermal decoupling
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This disclosure concerns micro-scale heat transfer systems. Some systems relate to electronics cooling. As one example a microscale heat transfer system can comprise a microchannel heat exchanger defining a plurality of flow microchannels fluidicly coupled to each other by a plurality of cross-connect channels. The cross-connect channels can be spaced apart along a streamwise flow direction defined by the flow microchannels. Such a configuration of flow microchannels and cross-connect channels can enable the microchannel heat exchanger to stably vaporize a portion of a working fluid when the microchannel heat exchanger is thermally coupled to a heat source. Microscale heat transfer systems can also comprise a condenser fluidicly coupled to the microchannel heat exchanger and configured to condense the vaporized portion of the working fluid. A pump can circulate the working fluid between the microchannel heat exchanger and the condenser.

Claims

1. A microscale heat transfer system comprising:

a microchannel heat exchanger defining a plurality of flow microchannels fluidicly coupled to each other by a plurality of cross-connect channels spaced apart along a streamwise flow direction defined by the flow microchannels such that the microchannel heat exchanger is configured to stably vaporize a portion of a working fluid when the microchannel heat exchanger is thermally coupled to a heat source;

a condenser fluidicly coupled to the microchannel heat exchanger and configured to condense the vaporized portion of the working fluid; and

a pump so fluidicly coupled to the condenser and the microchannel heat exchanger as to be configured to circulate the working fluid between the microchannel heat exchanger and the condenser.

2. The microscale heat transfer system of claim 1, wherein the microchannel heat exchanger and the condenser comprise portions of an integrated subassembly comprising:

a first plate defining opposed internal and external major surfaces, wherein the internal major surface of the first plate defines a heat sink region configured to receive the microchannel heat exchanger; and

a second plate defining opposed internal and external major surfaces, wherein the internal major surface of the second plate defines a lid region and a condenser region,

wherein the first plate and the second plate are fixedly secured together in opposing alignment such that the respective internal major surfaces face each other, and wherein the microchannel heat exchanger is disposed between the first plate and the second plate.

3. The microscale heat transfer system of claim 2, wherein the microchannel heat exchanger is thermally coupled to the heat sink region, and wherein the lid region so overlies the plurality of flow microchannels as to define a flow boundary of the flow microchannels.

4. The microscale heat transfer system of claim 3, wherein the condenser region of the second plate and a corresponding, opposed region of the first plate define at least one condenser flow channel.

5. The microscale heat transfer system of claim 4, wherein the condenser region of the second plate defines a plurality of fins extending from the internal major surface of the second plate and being spaced from each other along a streamwise flow direction defined the at least one condenser flow channel.

6. The microscale heat transfer system of claim 5, wherein at least one of the plurality of extended surfaces is soldered to a corresponding portion of the internal surface of the first plate.

7. The microscale heat transfer system of claim 2, wherein the integrated subassembly further comprises a plurality of fins extending from the external major surface of the first plate, the second plate, or both.

8. The microscale heat transfer system of claim 2, wherein the external major surface of the first plate defines a raised surface positioned substantially opposite the heat sink region defined by the internal major surface of the first plate.

9. The microscale heat transfer system of claim 2, wherein the microchannel heat exchanger comprises a first microchannel heat exchanger and a second microchannel heat exchanger, and wherein the heat sink region comprises a first heat sink region and a second heat sink region, wherein the first heat sink region is configured to receive the first microchannel heat sink and the second heat sink region is configured to receive the second microchannel heat sink.

10. The microscale heat transfer system of claim 9, wherein the lid region comprises a first lid region and a second lid region, wherein the first lid region overlies the first heat exchanger and the second lid region overlies the second microchannel heat exchanger.

11. The microscale heat transfer system of claim 9, wherein the condenser region comprises a first condenser region and a second condenser region.

12. The microscale heat transfer system of claim 11, wherein the first microchannel heat sink and the first condenser region are fluidicly coupled to the second microchannel heat sink and the second condenser region in series.

13. The microscale heat transfer system of claim 11, wherein the first microchannel heat sink and the first condenser region are fluidicly coupled to the second microchannel heat sink and the second condenser region in parallel.

14. The microscale heat transfer system of claim 2, further comprising a pump housing manifold defining an internal chamber configured to receive the pump, an inlet opening and an outlet opening, wherein the pump is positioned at least partially within the internal chamber of the pump housing manifold.

15. The microscale heat transfer system of claim 14, wherein the pump defines a pump inlet and a pump outlet, wherein the pump inlet is fluidicly coupled to the inlet opening of the pump housing manifold and the pump outlet is fluidicly coupled to the outlet opening of the pump housing manifold.

16. The microscale heat transfer system of claim 1, wherein a flow cross-section of one or more of the flow microchannels defines an aspect ratio greater than about 10:

1.

17. An add-in card for a computer system, the add-in card comprising:

a substrate comprising a plurality of circuit portions;

at least one integrated circuit component electrically coupled to at least one of the circuit portions, wherein the integrated circuit component dissipates heat when operating;

a working fluid;

an evaporator positioned adjacent and thermally coupled to the integrated circuit component, wherein the evaporator defines a plurality of cross-connected microchannels configured to stably vaporize a portion of the working fluid in response to heat dissipated by the component;

a condenser fluidicly coupled to the evaporator, wherein the condenser is supported, at least in part, by the substrate;

a pump so fluidicly coupled to the evaporator and to the condenser as to be operable to circulate the working fluid between the evaporator and the condenser

18. The add-in card of claim 17, wherein the condenser and the evaporator comprise portions of an integrated subassembly comprising opposing first and second plates, wherein the evaporator comprises a microchannel heat sink disposed between the first and second plates.

19. The add-in card of claim 18, wherein the integrated subassembly further comprises a plurality of fins extending outwardly of the first plate, the second plate, or both.

20. The add-in card of claim 18, wherein the evaporator comprises a first evaporator and a second evaporator.

23. The add-in card of claim 17, wherein the condenser further comprises a plurality of fins extending outwardly thereof, wherein the add-in card further comprises a shroud overlying the fins and a blower configured to deliver air over the fins, wherein the evaporator, the condenser, the pump, the fins and the blower fit within a 10½

inch, by 1⅜

inch, by 3¾

inch volume, when the evaporator, the condenser, the pump the fins and the blower are operatively positioned relative to each other and the integrated circuit component.

25. The add-in card of claim 17, further comprising a chassis member overlying and engaging at least a portion of the substrate, wherein the condenser is fixedly attached to the chassis member such that the chassis supports the condenser, whereby the condenser is at least partially supported by the substrate.

21-22. -22. (canceled)

24. (canceled)

26-31. -31. (canceled)