DEVICE FOR COUPLING MODULE CIRCUIT BOARD AND FRAME AND BACKLIGHT USING THE SAME

• US 20120087110A1
• Filed: 04/13/2010
• Published: 04/12/2012
• Est. Priority Date: 06/24/2009
• Status: Abandoned Application

• Current Assignee: Point Co., Ltd.
• Original Assignee: Point Co., Ltd.
• Inventors: Lee, Jong Eun
• Application Number:
  US13/376,889
• Publication Number:
  US 20120087110A1
• Time in Patent Office: Days
• US Class Current: 362/97.3
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02B 6/009 of the light source in the package G02B6/0021 takes precedence

Abstract

A device for coupling a module circuit board and a frame includes: a module circuit board on which light emitting diodes (LEDs) are installed to have a certain pattern; and a frame coupled with the module circuit board by a coupling unit, wherein the coupling unit includes coupling recesses formed on a rear surface of the module circuit board and coupling members formed on the frame and coupled with the coupling recesses.

Claims

1. A device for coupling a module circuit board and a frame, comprising:

a module circuit board on which light emitting diodes (LEDs) are installed to have a certain pattern; and

a frame coupled with the module circuit board by a coupling unit,

wherein the coupling unit comprises coupling recesses formed on a rear surface of the module circuit board and coupling members formed on the frame and coupled with the coupling recesses.

2. The device for coupling a module circuit board and a frame of claim 1, wherein the coupling member comprises a protrusion protruded from the frame and a coupling projection formed on at least one side of the protrusion, and

the coupling recess installed on the module circuit board comprises an insertion portion into which the coupling member is inserted and a stopping recess portion extending from the insertion portion in one direction and allowing the protrusion to be caught therein.

3. The device for coupling a module circuit board and a frame of claim 2, wherein a section of the mutually coupled coupling member and coupling recess has any one shape among a dovetail shape, a frustotriangular shape, a circular shape, a T shape, a lozenge shape, and a trapezoid shape.

4. The device for coupling a module circuit board and a frame of claim 2, wherein the coupling recess does not penetrate the module circuit board.

5. The device for coupling a module circuit board and a frame of claim 2, wherein the coupling recess is not formed on a side surface or a front surface of the module circuit board.

6. The device for coupling a module circuit board and a frame of claim 2, wherein the coupling member and the coupling recess are-discontinuously formed.

7. The device for coupling a module circuit board and a frame of claim 2, wherein the insertion portion of the coupling recess is formed from the side surface of the module circuit board at a right angle direction with respect to a lengthwise direction of the module circuit board, and the coupling recess portion is formed in the lengthwise direction.

8. The device for coupling a module circuit board and a frame of claim 1, wherein the frame comprises a heat dissipation fin.

9. The device for coupling a module circuit board and a frame of claim 1, wherein the frame comprises a heat pipe for dissipating heat discharged from the LEDs.

10. The device for coupling a module circuit board and a frame of claim 2, wherein the width of an upper face of the coupling projection belongs to a range of inner widths of the coupling recess and corresponds to one of the inner widths of the coupling recess.

25. The device for coupling a module circuit board and a frame of claim 1, wherein a section of the coupling member has a dovetail shape,

the coupling recess comprises an insertion portion and a coupling recess portion, an inner face of the coupling recess portion is tapered to correspond to the coupling member, and the insertion portion has a size allowing the coupling member to be inserted therein,

the coupling recess is formed on a rear surface of the module circuit board without penetrating the module circuit board, and is not formed on the side surface or the rear surface, and

the coupling member and the coupling recess are discontinuously formed.

11. A device for coupling a module circuit board and a frame, the device comprising:

a module circuit board including light emitting diodes (LEDs) formed to have a certain pattern and a frame coupled with the circuit board by a coupling unit,

wherein the module circuit board comprises a board unit on which the LEDs are installed and a heat dissipation unit including heat dissipation fins formed on a rear surface of the board unit, the board unit and the heat dissipation unit being integrally formed, and

the coupling unit comprises coupling recesses formed on a side surface of the module circuit board and coupling members formed on the frame and coupled with the coupling recesses.

12. A device for coupling a module circuit board and a frame comprising:

a module circuit board having a bar-like shape and having light emitting diodes (LEEDs) installed to have a certain pattern; and

a frame coupled with the module circuit board by a coupling unit,

wherein the coupling unit comprises lead-in recesses for a coupling and formed on both side surface portions in a lengthwise direction of the module circuit board and coupling hooks provided on the frame corresponding to the lead-in recesses and inserted in the lead-in recesses to allow a side edge of the module circuit board to be caught therein when the module circuit board is moved.

13. The device for coupling a module circuit board and a frame of claim 12, wherein a stopper is provided on the frame to fix the coupling position of the module circuit board.

14. The device for coupling a module circuit board and a frame of claim 12, wherein the coupling hooks comprise a stopping protrusion formed at a mutually corresponding inner side, and

the lead-in recess formed on the side face portion of the module circuit board may comprise an insertion portion in which the coupling hook is inserted and a stopping recess extending from the insertion portion in one direction and allowing the stopping protrusion to be insertedly caught therein.

15. The device for coupling a module circuit board and a frame of claim 12, wherein a heat dissipation fin or a heat pipe is installed on the frame in order to dissipate heat generated from the LEDs.

16. A backlight using a device for coupling a module circuit board and a frame, the backlight comprising:

a frame for supporting a liquid crystal display panel;

a module circuit board coupled with the frame and including a plurality of light emitting diodes (LEDs) to irradiate light to the liquid crystal display panel;

a coupling unit for coupling the module circuit board and the frame;

and a light guide plate unit irradiating light emitted from the LEDs of the module circuit board, toward the liquid crystal display panel,

wherein the coupling unit comprises coupling recesses formed on a rear surface of the circuit board and coupling members formed on the frame and coupled with the coupling recesses.

17. The backlight using a device for coupling a module circuit board and a frame of claim 16, wherein the coupling member comprises a protrusion protruded from the frame and a coupling projection formed on at least one side of the protrusion, and

the coupling recess installed on the module circuit board comprises an insertion portion into which the coupling member is inserted and a stopping recess portion extending from the insertion portion in one direction and allowing the protrusion to be caught therein.

18. The backlight using a device for coupling a module circuit board and a frame of claim 17,

wherein a section of the mutually coupled coupling member and coupling recess has any one shape among a dovetail shape, a frustotriangular shape, a circular shape, a T shape, a lozenge shape, and a trapezoid shape.

19. The backlight using a device for coupling a module circuit board and a frame of claim 18, wherein the coupling recess does not penetrate the module circuit board.

20. The backlight using a device for coupling a module circuit board and a frame of claim 18, wherein the coupling recess is not formed on a side surface or a front surface of the module circuit board.

21. The backlight using a device for coupling a module circuit board and a frame of claim 18, wherein the coupling member and the coupling recess are discontinuously formed.

22. The backlight using a device for coupling a module circuit board and a frame of claim 18, wherein the width of an upper face of the coupling projection belongs to the range of inner widths of the coupling recess and corresponds to one of the inner widths of the coupling recess.

26. A backlight of claim 16, wherein a section of the coupling member has a dovetail shape,

the coupling recess comprises an insertion portion and a coupling recess portion, an inner face of the coupling recess portion is tapered to correspond to the coupling member, and the insertion portion has a size allowing the coupling member to be inserted therein,

the coupling recess is formed on a rear surface of the module circuit board without penetrating the module circuit board, and is not formed on the side surface or the rear surface, and

the coupling member and the coupling recess are discontinuously formed.

23. A light comprising:

a frame;

a module circuit board coupled with the frame and including a plurality of light emitting diodes (LEDs) irradiating light to the outside; and

a coupling unit coupling the module circuit board and the frame,

wherein the coupling unit comprises coupling recesses formed on a rear surface of the circuit board and coupling members formed on the frame and coupled with the coupling recesses.

24. The light of claim 23, wherein a section of the coupling member has a dovetail shape,

the coupling recess comprises an insertion portion and a coupling recess portion, an inner face of the coupling recess portion is tapered to correspond to the coupling member, and the insertion portion has a size allowing the coupling member to be inserted therein,

the coupling recess is formed on a rear surface of the module circuit board without penetrating the module circuit board, and is not formed on the side surface or the rear surface, and

the coupling member and the coupling recess are discontinuously formed.