Microphone Package with Embedded ASIC

• US 20120087521A1
• Filed: 10/12/2011
• Published: 04/12/2012
• Est. Priority Date: 10/12/2010
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Analog Devices, Inc.
• Inventors: Delaus, Michael D., Goida, Thomas M., O'Donnell, Kathy
• Granted Patent: US 9,407,997 B2
• Time in Patent Office: Days
• US Class Current: 381/174
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 1/00309 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 2203/0785 Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence

Abstract

A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base. Apertures in the base and integrated circuit are aligned to form an aperture from the exterior of the package to the interior.

Claims

1. A microphone carrier comprising:

a substrate comprising a first substrate side and a second substrate side, and a substrate aperture between the first substrate side and the second substrate side;

an integrated circuit comprising a first IC side and a second IC side, and an IC aperture between the first IC side and the second IC side;

the integrated circuit embedded in the substrate, with IC aperture aligned with the substrate aperture.

2. A microphone carrier according to claim 1, wherein the substrate aperture is coaxially aligned with the IC aperture.

3. A microphone carrier according to claim 1, further comprising a microphone mounted on the substrate.

4. A microphone carrier according to claim 3, wherein the microphone comprises a planar diaphragm, and is mounted astride the substrate aperture such that the plane of the diaphragm is parallel to the substrate.

5. A microphone carrier according to claim 1, wherein the substrate is a laminate.

6. A microphone carrier according to claim 1, further comprising a cap mounted to the substrate and forming an interior volume, the cap covering the substrate aperture.

7. A microphone carrier according to claim 1, the IC aperture further comprising a filter.

8. A microphone carrier according to claim 7, the filter comprising a grid structure.

9. A microphone system comprising:

a substrate comprising a first side and a second side;

a lid coupled to the first side, the substrate and the lid defining an interior volume;

a microphone having microphone bond pads, the microphone coupled to the first side and within the interior volume;

an integrated circuit comprising a surface, with IC bond pads on the surface, the integrated circuit embedded in the substrate; and

wire bonds extending from the microphone bond pads to the IC bond pads.

10. A microphone system according to claim 9, further comprising an aperture in the lid.

11. A microphone system according to claim 9, further comprising an aperture in the substrate.

12. A microphone system according to claim 9, wherein the integrated circuit is embedded in the substrate below the microphone.

13. A microphone system according to claim 9, wherein the integrated circuit is embedded in the substrate and spaced laterally from the microphone.

14. A microphone system according to claim 9, wherein the lid is conductive, and the lid and substrate form an electromagnetic shield around the microphone and integrated circuit.

15. A method of fabricating a microphone system, the method comprising:

providing a substrate having a first substrate side and a second substrate side, the substrate having a void between the first substrate side and the second substrate side, and a substrate aperture extending between the first substrate side and the second substrate side, and intersecting the void;

providing an integrated circuit having a first IC side and second IC side, the integrated circuit having an IC aperture extending between the first IC side and the second IC side;

placing the integrated circuit within the void, such that the integrated circuit is completely between the first substrate side and the second substrate side; and

providing a microphone on the first substrate side, the microphone having a diaphragm, and the diaphragm at least partially aligned with the substrate aperture.

16. The method of claim 15, wherein the substrate comprises a laminate.

17. The method of claim 15, wherein the diaphragm is coaxially aligned with the substrate aperture.

18. The method of claim 15, further comprising providing a lid mounted to the first substrate side, wherein the lid and the first substrate side form an interior volume, and wherein the microphone resides within the interior volume.

19. The method of claim 15, wherein the second substrate side includes at least one substrate electrical contact, and the integrated circuit includes at least one IC electrical contact, and wherein the method further comprises coupling the at least one substrate electrical contact to the at least one IC electrical contact.

20. The method of claim 15, wherein the first substrate side includes at least one substrate electrical contact, and the integrated circuit includes at least one IC electrical contact, and wherein the method further comprises coupling the at least one substrate electrical contact to the at least one IC electrical contact.