HOUSING AND METHOD FOR MAKING THE SAME

• US 20120090868A1
• Filed: 04/27/2011
• Published: 04/19/2012
• Est. Priority Date: 10/14/2010
• Status: Abandoned Application

• Current Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Inventors: CHANG, HSIN-PEI, CHEN, WEN-RONG, CHIANG, HUANN-WU, CHEN, CHENG-SHI, WANG, YING-YING
• Application Number:
  US13/094,994
• Publication Number:
  US 20120090868A1
• Time in Patent Office: Days
• US Class Current: 174/50
• CPC Class Codes: C23C 14/022 by means of bombardment with energetic particles or radiation
• CPC Class Codes: C23C 14/086 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: C23C 14/345 using substrate bias
• CPC Class Codes: C23C 14/3464 using more than one target C23C14/56 takes precedence
• CPC Class Codes: C23C 14/505 for rotation of the substrates
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

A housing for an electronic device includes a metal substrate and a luminous layer formed on the metal substrate, the luminous layer mainly comprises ZnO mixed with In. The disclosure also described a method to make the housing.

Claims

1. A housing of electronic device, comprising:

a metal substrate; and

a luminous layer formed on the metal substrate, the luminous layer substantially comprising ZnO mixed with a little In.

2. The housing of electronic device as claimed in claim 1, wherein the luminous layer further includes at least one rare-earth element.

3. The housing of electronic device as claimed in claim 1, wherein a thickness of the luminous layer is less than about 500 nanometer(nm).

4. The housing of electronic device as claimed in claim 1, wherein the metal substrate is one of stainless steel, copper, titanium, titanium alloy, aluminum, or aluminum alloy.

5. A method for making a housing of electronic device, comprising:

providing a metal substrate; and

forming a luminous layer on the surface of the metal substrate, the luminous layer substantially comprising ZnO mixed with a little In.

6. The method for making a housing of electronic device as claimed in claim 5, wherein further comprising cleaning the metal substrate by organic solution to clean grease before forming the luminous layer.

7. The method for making a housing of electronic device as claimed in claim 5, wherein further comprising plasma cleaning to remove any oxides before forming the luminous layer.

8. The method for making a housing of electronic device as claimed in claim 5, wherein during plasma cleaning, placing the substrate into a chamber of a coating machine, floating argon(Ar) into the chamber, exerting a voltage on the substrate, the Ar particles striking the surface of the substrate to remove any oxides.

9. The method for making a housing of electronic device as claimed in claim 8, wherein during forming the coating, feeding Ar and Oxygen into the chamber and turning on the first targets to sputter ZnO particles to the substrate, then turning off Oxygen and the first targets, turning on the second targets and sputtering In particles combining with ZnO to form the luminous layer.

10. The method for making a housing of electronic device as claimed in claim 9, wherein the first target is made of Zn or Zn alloy.

11. The method for making a housing of electronic device as claimed in claim 9, wherein the Zn alloy is Zn mixed with at least one rare-earth elements.

12. The method for making a housing of electronic device as claimed in claim 9, wherein the second target is made of In.