FORMATION OF EMBEDDED MICRO-LENS
First Claim
1. A semiconductor device, comprising:
- a radiation-sensing element formed in a substrate;
a transparent layer formed over the substrate; and
a micro-lens embedded in the transparent layer, wherein the micro-lens has a pointy tip portion.
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Accused Products
Abstract
Provided is an image sensor device. The image sensor device includes a pixel formed in a substrate. The image sensor device includes a first micro-lens embedded in a transparent layer over the substrate. The first micro-lens has a first upper surface that has an angular tip. The image sensor device includes a color filter that is located over the transparent layer. The image sensor device includes a second micro-lens that is formed over the color filter. The second micro-lens has a second upper surface that has an approximately rounded profile. The pixel, the first micro-lens, the color filter, and the second micro-lens are all at least partially aligned with one another in a vertical direction.
21 Citations
20 Claims
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1. A semiconductor device, comprising:
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a radiation-sensing element formed in a substrate; a transparent layer formed over the substrate; and a micro-lens embedded in the transparent layer, wherein the micro-lens has a pointy tip portion. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An image sensor device, comprising:
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a pixel located in a substrate; a first micro-lens embedded in a layer over the substrate, a first upper surface of the first micro-lens having an angular tip; a color filter located over the layer; and a second micro-lens located over the color filter, a second upper surface of the second micro-lens having an approximately rounded profile; wherein the pixel, the first micro-lens, the color filter, and the second micro-lens are all at least partially aligned with one another. - View Dependent Claims (9, 10, 11)
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12. A method, comprising:
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forming a radiation-sensing element in a substrate; forming a patterned dielectric layer over the substrate, the patterned dielectric layer including a plurality of dielectric portions separated by a plurality of openings; and performing a laser annealing process on the patterned dielectric layer in a manner such that each of the dielectric portions are melted and re-shaped, the re-shaped dielectric portions each having a pointy tip. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification