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SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR PACKAGE

  • US 20120091572A1
  • Filed: 06/22/2009
  • Published: 04/19/2012
  • Est. Priority Date: 06/22/2009
  • Status: Abandoned Application
First Claim
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1. A semiconductor package comprising:

  • a package wiring board which has an element housing recessed portion on a top surface thereof for housing a semiconductor element;

    a plurality of side electrodes which are arranged on outer side surfaces of the package wiring board and soldered to a plurality of motherboard electrodes arranged on a motherboard;

    a semiconductor element which is fixed onto a bottom surface of the element housing recessed portion; and

    an element electrode arranged on the bottom surface of the element housing recessed portion and electrically connected to the semiconductor element and the side electrodes, whereinthe package wiring board has a multilayered structure in which woven fabric and a resin adhesive layer are alternately laminated; and

    the resin adhesive layer is formed of a resin adhesive that contains inorganic filler particles.

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