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Method of Producing a Chip Package, and Chip Package

  • US 20120091594A1
  • Filed: 10/18/2011
  • Published: 04/19/2012
  • Est. Priority Date: 10/18/2010
  • Status: Active Grant
First Claim
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1. Method of producing a chip package, comprising:

  • providing a substrate comprising a recess having a recess bottom and recess side walls in a first surfaceintroducing a chip, which has a chip backside, into the recess such that the chip does not protrude from the recess and that a gap remains between the recess side walls and the chip, the chip backside being attached to the recess bottom; and

    filling the gap with a filler material,wherein the substrate comprises a flexible one-layer or multi-layer film-roll substrate, wherein the chip comprises a flexible semiconductor chip having a thickness which ranges from 10 μ

    m to 50 μ

    m, and wherein the method is performed in a roll-to-roll method.

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