HANDLING LAYER FOR TRANSPARENT SUBSTRATE
First Claim
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1. A device, comprising:
- a transparent wafer;
an opaque layer disposed on the transparent wafer; and
a conductive layer disposed on the opaque layer, wherein the conductive layer includes a non-metal layer.
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Abstract
A device is provided which includes a transparent substrate. An opaque layer is disposed on the transparent substrate. A conductive layer disposed on the opaque layer. The opaque layer and the conductive layer form a handling layer, which may be used to detect and/or align the transparent wafer during fabrication processes. In an embodiment, the conductive layer includes a highly-doped silicon layer. In an embodiment, the opaque layer includes a metal. In embodiment, the device may include a MEMs device.
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Citations
20 Claims
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1. A device, comprising:
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a transparent wafer; an opaque layer disposed on the transparent wafer; and a conductive layer disposed on the opaque layer, wherein the conductive layer includes a non-metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A device, comprising:
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a transparent substrate having a first surface and a second surface opposing the first surface, wherein at least one MEMs device is formed on the first surface; and a handling layer disposed on the second surface of the transparent substrate, wherein the handling layer includes; an opaque layer disposed on the second surface of the transparent substrate, wherein the opaque layer includes metal; and a conductive layer disposed on the opaque layer, wherein the conductive layer is a non-metal layer. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method of fabricating a wafer, the method comprising:
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providing a transparent wafer; forming an opaque layer on the transparent wafer; and depositing a conductive layer on the opaque layer using chemical vapor deposition. - View Dependent Claims (18, 19, 20)
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Specification