Lighting Module

• US 20120092868A1
• Filed: 10/20/2009
• Published: 04/19/2012
• Est. Priority Date: 10/31/2008
• Status: Active Grant

• Current Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Block, Steffen, Huber, Rainer
• Granted Patent: US 9,322,514 B2
• Time in Patent Office: Days
• US Class Current: 362/249.01
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/87 Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2105/00 Planar light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A luminous module comprising a plurality of radiation-emitting semiconductor components (2), a connection carrier (3), on which the radiation-emitting semiconductor components (2) are arranged, and a cooling body (6), which, on its front-side surface, is connected to the connection carrier (3) and has a basic body (4) and also a means (5), which is designed to locally alter the thermal resistance of the cooling body (6), wherein the average thermal resistance of the cooling body (6) decreases along a main extension direction of the luminous module (1).

Claims

1. A luminous module comprising:

a plurality of radiation-emitting semiconductor components;

a connection carrier, on which the radiation-emitting semiconductor components are arranged; and

a cooling body, which, on its front-side surface, is connected to the connection carrier and comprises a basic body and also a means (5), which is designed to locally alter the thermal resistance of the cooling body (6), wherein the average thermal resistance of the cooling body decreases along a main extension direction of the luminous module.

2. The luminous module according to claim 1, wherein the radiation-emitting semiconductor components are distributed uniformly on the connection carrier.

3. The luminous module according to claim 1, wherein the basic body of the cooling body contains a metal or consists of a metal.

4. The luminous module (1) according to claim 1, wherein the means is distributed non-uniformly in the cooling body.

5. The luminous module according to claim 14, wherein the means comprises at least one thermally insulating element having a greater thermal resistance than the basic body of the cooling body.

6. The luminous module according to claim 5, wherein the number of thermally insulating elements per unit area decreases along the main extension direction.

7. The luminous module according to claim 5, which comprises, on a rear-side surface or on at least one side area of the cooling body, a plurality of thermally insulating elements, the number of which per unit area decreases along the main extension direction.

8. The luminous module according to claim 5, wherein the thermally insulating element is formed from a plastics material.

9. The luminous module according to claim 5, wherein the thermally insulating element is a cutout in the basic body of the cooling body, said cutout being filled with a material having a higher thermal resistance than the basic body.

10. The luminous module according to claim 9, wherein the cooling body comprises a plurality of cutouts arranged in regions that are not covered by the radiation-emitting semiconductor components.

11. The luminous module according to claim 1, wherein the means comprises at least one thermally conductive element having a thermal resistance that is less than or equal to the thermal resistance of the basic body.

12. The luminous module according to claim 11, wherein the number of thermally conductive elements per unit area increases along the main extension direction.

13. The luminous module according to claim 11, wherein the at least one thermally conductive element is arranged on the front-side surface, the rear-side surface or at least one side area of the cooling body.

14. The luminous module according to claim 13, wherein the at least one thermally conductive element contains a metal or consists of a metal.

15. The luminous module according to claim 1, wherein the means is at least partly a fixing means.