DEVICE FOR MEASURING PRESSURE, AND METHOD FOR MANUFACTURING SAME

• US 20120096944A1
• Filed: 07/05/2010
• Published: 04/26/2012
• Est. Priority Date: 07/06/2009
• Status: Abandoned Application

• Current Assignee: Tronic's Microsystems
• Original Assignee: Tronic's Microsystems
• Inventors: Leclerc, Jacques
• Application Number:
  US13/379,399
• Publication Number:
  US 20120096944A1
• Time in Patent Office: Days
• US Class Current: 73/718
• CPC Class Codes: G01L 9/0072 using variations in capacitance
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm

Abstract

Device for measuring pressure through the capacitive effect between two electrodes including at least one sensitive electrode spaced apart from and opposite a stationary electrode so as to define a cavity in which a reference pressure (Pref) exists. The device in accordance with the invention further includes a protective housing for insulating at least the stationary electrode from the ambient environment in which the pressure to be measured exists, the housing having at least one solid portion forming a recess for containing at least the stationary electrode, and a thinned portion forming the sensitive electrode.

Claims

1-18. -18. (canceled)

19. A device for measuring pressure through a capacitive effect between two electrodes, the device comprising:

a stationary electrode;

at least one sensitive electrode having a first thinned portion, the at least one sensitive electrode being spaced apart from and opposite the stationary electrode so as to define a cavity in which a reference pressure exists;

a housing configured to insulate at least the stationary electrode from the ambient environment in which the pressure to be measured exists, the housing having at least one solid portion forming a recess configured to contain at least the stationary electrode and the first thinned portion.

20. The device of claim 19, wherein the housing is composed of a metal material.

21. The device of claim 19, further comprising one of a grid and a perforated wall each configured to protect the sensitive electrode.

22. The device of claim 21, wherein the housing includes an intermediate portion forming a junction between the sensitive electrode and the recess, and having a profile configured to mechanically decouple the sensitive electrode from the recess.

23. The device of claim 22, wherein the profile of the junction has a thickness decreasing in a direction of the sensitive electrode.

24. The device of claim 22, wherein the profile of the junction has a second thinned portion its entire length of which is placed with the first thinned portion of the sensitive electrode.

25. The device of claim 19, further comprising a sealing frame surrounds the stationary electrode and is spaced apart from the stationary electrode so as to define an interstice configured to accommodate a connection frame, wherein the connection frame is configured to provide a mechanical connection and a mechanical decoupling between the stationary electrode and the sealing frame.

26. The device of claim 25, wherein the connection frame surrounds the stationary electrode and has at least one first projection secured to the sealing frame and a second projection secured to the stationary electrode.

27. The device of claim 19, further comprising a reference electrode which is configured to be insensitive to variations in pressure.

28. A method for manufacturing at least one pressure measuring device for measuring pressure through a capacitive effect between two electrodes, the method comprising:

producing at least one stationary electrode by etching a substrate;

producing at least one thinned portion forming a sensitive electrode on a plate composed of material compatible with the ambient environment in which the pressure to be measured exists;

sealing under a reference pressure the plate on the substrate by interposing at least one sealing joint, such that the sensitive electrode is spaced apart from and opposite the stationary electrode so as to define a cavity the depth of which is defined by the thickness of the at least one sealing joint; and

then

sealing with the plate a part made of material compatible with the ambient environment forming a recess, to form a housing configured to insulate at least the stationary electrode from the ambient environment, the housing having at least one solid portion forming the recess, and the thinned portion which forms the sensitive electrode.

29. The method of claim 28, further comprising producing an intermediate portion forming a junction between the solid portion and the thinned portion, the intermediate portion having a profile with a thickness which decreases in a direction of the sensitive electrode.

30. The method of claim 28, further comprising producing an intermediate portion forming a junction between the solid portion and the thinned portion, the intermediate portion having a profile with at least one thinned portion its entire length of which is placed with the thinned portion which forms the sensitive electrode.

31. The method of claim 28, wherein the comprises a dielectric layer interposed between two semiconductor layers.

32. The method of claim 31, wherein producing the stationary electrode comprises:

etching one of the two semiconductor layers to produce at least one sealing frame, a connection frame and the stationary electrode, the sealing frame being configured to be spaced apart from and surround the stationary electrode so as to define an interstice configured to accommodate the connection frame, the connection frame being configured to surround the stationary electrode and having at least one first projection secured to the sealing frame and a second projection secured to the stationary electrode; and

then

removing a portion of the dielectric layer opposite the stationary electrode, the connection frame and a portion of the sealing frame.

33. The method of claim 32, wherein the sealing further comprises:

producing a first metal layer on an internal portion of the solid portion forming the recess intended to be opposite the sealing frame;

producing a second metal layer on a portion of the sealing frame; and

then

sealing the first and second metal layers by thereto-compression.

34. The method of claim 28, further comprising:

producing a plurality of stationary electrodes by etching a substrate;

producing a plurality of thinned portions configured to form sensitive electrodes on a plate composed of material compatible with the ambient environment in which the pressure to be measured exists;

sealing, under a reference pressure the plate on the substrate by interposing a plurality of sealing joints so as to form a plurality of cavities, each of the cavities being defined by one of the sensitive electrodes spaced apart from and opposite one of the stationary electrodes and having a depth defined by the thickness of the associated sealing joint;

forming a plurality of elementary modules by cutting between two adjacent sealing joints, each elementary module including at least one of the cavities;

for each elementary module, sealing with a recess composed of material compatible with the ambient environment, to thereby form a housing configured to insulate at least the stationary electrode of the elementary module from the ambient environment, the housing having at least one solid portion forming a recess and a thinned portion forming the sensitive electrode.

35. The method of claim 34, further comprising:

for each sensitive electrode, producing an intermediate portion on the plate to form a junction between the recess and the sensitive electrode, the profile of which has a thickness which decreases in a direction of the sensitive electrode.

36. The method of claim 35, wherein:

the substrate comprises a dielectric layer interposed between two semiconductor layers; and

producing the stationary electrode comprises;

etching in one of the two semiconductor layers in order to produce, for each of the stationary electrodes, a sealing frame surrounding at a distance the stationary electrode so as to define an interstice configured to accommodate a connection frame having at least one projection secured to the sealing frame and another projection secured to the stationary electrode; and

then

removing portions of the dielectric layer opposite at least the stationary electrodes and the connection frames.

37. The method of claim 34, further comprising:

for each sensitive electrode, producing an intermediate portion on the plate to form a junction between the recess and the sensitive electrode, the profile of which has at least one thinned portion its entire length of which is placed with the thinned portion which forms the sensitive electrode.

38. The method of claim 36, wherein:

the substrate comprises a dielectric layer interposed between two semiconductor layers; and

producing the stationary electrode comprises;

etching in one of the two semiconductor layers in order to produce, for each of the stationary electrodes, a sealing frame surrounding at a distance the stationary electrode so as to define an interstice configured to accommodate a connection frame having at least one projection secured to the sealing frame and another projection secured to the stationary electrode; and

then

removing portions of the dielectric layer opposite at least the stationary electrodes and the connection frames.