DUAL DELIVERY CHAMBER DESIGN
First Claim
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1. An apparatus comprising:
- a thermal chamber having a gas box in communication with an internal volume of the thermal chamber and a spacer ring coupled to the gas box;
a showerhead having an upper surface and a lower surface, the showerhead having a first array of holes that extend from the upper surface to the lower surface, the showerhead is adjacent to the thermal chamber and the upper surface of showerhead is a lower surface of the thermal chamber;
a processing chamber, the lower surface of the showerhead is an upper surface of the processing chamber; and
a pedestal within the processing chamber for supporting a substrate adjacent to the lower surface of the showerhead.
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Abstract
A substrate processing system includes a thermal processor or a plasma generator adjacent to a processing chamber. A first processing gas enters the thermal processor or plasma generator. The first processing gas then flows directly through a showerhead into the processing chamber. A second processing gas flows through a second flow path through the showerhead. The first and second processing gases are mixed below the showerhead and a layer of material is deposited on a substrate under the showerhead.
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Citations
22 Claims
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1. An apparatus comprising:
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a thermal chamber having a gas box in communication with an internal volume of the thermal chamber and a spacer ring coupled to the gas box; a showerhead having an upper surface and a lower surface, the showerhead having a first array of holes that extend from the upper surface to the lower surface, the showerhead is adjacent to the thermal chamber and the upper surface of showerhead is a lower surface of the thermal chamber; a processing chamber, the lower surface of the showerhead is an upper surface of the processing chamber; and a pedestal within the processing chamber for supporting a substrate adjacent to the lower surface of the showerhead. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An apparatus comprising:
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a plasma generating chamber; a showerhead adjacent to the plasma generating chamber, the showerhead having an upper surface and a lower surface, the showerhead having a first array of holes that extend from the upper surface to the lower surface, the upper surface of the showerhead is the lower electrode of the plasma generating chamber; a processing chamber, the lower surface of the showerhead is an upper surface of the processing chamber; and a pedestal within the processing chamber for supporting a substrate adjacent to the lower surface of the showerhead. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification