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MULTICHIP PACKAGE STRUCTURE USING A CONSTANT VOLTAGE POWER SUPPLY

  • US 20120097997A1
  • Filed: 12/27/2010
  • Published: 04/26/2012
  • Est. Priority Date: 10/22/2010
  • Status: Active Grant
First Claim
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1. A multichip package structure, comprising:

  • a substrate unit including a substrate body having a first chip-placing region and a second chip-placing region formed on the top surface of the substrate body;

    a light-emitting unit including a plurality of light-emitting chips electrically connected to and disposed on the first chip-placing region;

    a current-limiting unit including at least one current-limiting chip electrically connected to and disposed on the second chip-placing region, wherein the current-limiting chip is electrically connected to the light-emitting unit;

    a frame unit including a first annular colloid frame and a second annular colloid frame surroundingly formed on the top surface of the substrate body, wherein the first annular colloid frame surrounds the light-emitting chips to form a first colloid position limiting space corresponding to the first chip-placing region, and the second annular colloid frame surrounds the current-limiting chip to form a second colloid position limiting space corresponding to the second chip-placing region; and

    a package unit including a first package colloid body filled into the first colloid position limiting space to cover the light-emitting chips and a second package colloid body filled into the second colloid position limiting space to cover the current-limiting chip.

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