MULTICHIP PACKAGE STRUCTURE USING A CONSTANT VOLTAGE POWER SUPPLY
First Claim
1. A multichip package structure, comprising:
- a substrate unit including a substrate body having a first chip-placing region and a second chip-placing region formed on the top surface of the substrate body;
a light-emitting unit including a plurality of light-emitting chips electrically connected to and disposed on the first chip-placing region;
a current-limiting unit including at least one current-limiting chip electrically connected to and disposed on the second chip-placing region, wherein the current-limiting chip is electrically connected to the light-emitting unit;
a frame unit including a first annular colloid frame and a second annular colloid frame surroundingly formed on the top surface of the substrate body, wherein the first annular colloid frame surrounds the light-emitting chips to form a first colloid position limiting space corresponding to the first chip-placing region, and the second annular colloid frame surrounds the current-limiting chip to form a second colloid position limiting space corresponding to the second chip-placing region; and
a package unit including a first package colloid body filled into the first colloid position limiting space to cover the light-emitting chips and a second package colloid body filled into the second colloid position limiting space to cover the current-limiting chip.
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Accused Products
Abstract
A multichip package structure includes a substrate unit, a light-emitting unit, a current-limiting unit, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The current-limiting unit includes at least one current-limiting chip electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting chip. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting chip.
18 Citations
10 Claims
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1. A multichip package structure, comprising:
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a substrate unit including a substrate body having a first chip-placing region and a second chip-placing region formed on the top surface of the substrate body; a light-emitting unit including a plurality of light-emitting chips electrically connected to and disposed on the first chip-placing region; a current-limiting unit including at least one current-limiting chip electrically connected to and disposed on the second chip-placing region, wherein the current-limiting chip is electrically connected to the light-emitting unit; a frame unit including a first annular colloid frame and a second annular colloid frame surroundingly formed on the top surface of the substrate body, wherein the first annular colloid frame surrounds the light-emitting chips to form a first colloid position limiting space corresponding to the first chip-placing region, and the second annular colloid frame surrounds the current-limiting chip to form a second colloid position limiting space corresponding to the second chip-placing region; and a package unit including a first package colloid body filled into the first colloid position limiting space to cover the light-emitting chips and a second package colloid body filled into the second colloid position limiting space to cover the current-limiting chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A multichip package structure, comprising:
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a substrate unit including a substrate body having two first chip-placing regions and a second chip-placing region formed on the top surface of the substrate body; a light-emitting unit including at least one first light-emitting module for generating first color temperature and at least one second light-emitting module for generating second color temperature, wherein the first light-emitting module includes a plurality of first light-emitting chips electrically connected to and disposed on one of the first chip-placing regions, and the second light-emitting module includes a plurality of second light-emitting chips electrically connected to and disposed on the other first chip-placing region; a current-limiting unit including at least one current-limiting chip electrically connected to and disposed on the second chip-placing region, wherein the current-limiting chip is electrically connected to the light-emitting unit; a frame unit including two first annular colloid frames and a second annular colloid frame surroundingly formed on the top surface of the substrate body, wherein the two first annular colloid frames respectively surround the first light-emitting module and the second light-emitting module to respectively form two first colloid position limiting spaces corresponding to the two first chip-placing regions, and the second annular colloid frame surrounds the current-limiting chip to form a second colloid position limiting space corresponding to the second chip-placing region; and a package unit including two first package colloid bodies and a second package colloid body, wherein the two first package colloid bodies are respectively filled into the two first colloid position limiting spaces to respectively cover the first light-emitting module and the second light-emitting module, and the second package colloid body is filled into the second colloid position limiting space to cover the current-limiting chip.
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10. A multichip package structure, comprising:
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a substrate unit including a substrate body having two first chip-placing regions and a second chip-placing region formed on the top surface of the substrate body; a light-emitting unit including at least one first light-emitting module for generating first color temperature and at least one second light-emitting module for generating second color temperature, wherein the first light-emitting module includes a plurality of first light-emitting chips electrically connected to and disposed on one of the first chip-placing regions, and the second light-emitting module includes a plurality of second light-emitting chips electrically connected to and disposed on the other first chip-placing region; a current-limiting unit including at least one current-limiting chip electrically connected to and disposed on the second chip-placing region, wherein the current-limiting chip is electrically connected to the light-emitting unit; a frame unit including two first annular colloid frames and a second annular colloid frame surroundingly formed on the top surface of the substrate body, wherein one of the first annular colloid frames surrounds the other first annular colloid frame, the two first annular colloid frames respectively surround the first light-emitting module and the second light-emitting module to respectively form two first colloid position limiting spaces corresponding to the two first chip-placing regions, the second light-emitting module is disposed between the two first annular colloid frames, and the second annular colloid frame surrounds the current-limiting chip to form a second colloid position limiting space corresponding to the second chip-placing region; and a package unit including two first package colloid bodies and a second package colloid body, wherein the two first package colloid bodies are respectively filled into the two first colloid position limiting spaces to respectively cover the first light-emitting module and the second light-emitting module, and the second package colloid body is filled into the second colloid position limiting space to cover the current-limiting chip.
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Specification