HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE

• US 20120103571A1
• Filed: 12/30/2010
• Published: 05/03/2012
• Est. Priority Date: 10/29/2010
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chiang, Hsu Cheng, Wu, Hsi Sheng, Hung, Kuo Shu, Lin, Neng Tan
• Granted Patent: US 8,305,754 B2
• Time in Patent Office: Days
• US Class Current: 165/104.26
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 2225/04 for conduits
• CPC Class Codes: H05K 7/20781 within cabinets for removing heat from server blades
• CPC Class Codes: H05K 7/20809 within server blades for removing heat from heat source

Abstract

A structure of heat dissipation of an electronic device includes at least one heat pipe and a cooler. The heat pipe has a condensation end and an evaporation end opposite to each other, and the evaporation end is disposed on a heat generating element of the electronic device. The cooler is disposed on a rack and has a chamber therein, and the chamber has an inner shell having a cooling fluid therein. When the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooler and positioned into the inner shell. The evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.

Claims

1. A heat dissipation structure of an electronic device, for dissipating heat energy of a heat generating element of at least one electronic device removably disposed in a rack, comprising:

at least one heat pipe, having a condensation end and an evaporation end opposite to each other, wherein the evaporation end is disposed on the heat generating element; and

a cooler, disposed on the rack, and comprising;

a shell, having a chamber therein;

an inner shell, disposed in the chamber, and having a cooling chamber;

a cooling fluid, disposed in the cooling chamber;

a combining hole, disposed on the shell, and communicating with the chamber; and

a through hole, disposed on the inner shell, and communicating with the cooling chamber, wherein when the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooling chamber sequentially through the combining hole and the through hole;

wherein, the evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.

2. The heat dissipation structure of the electronic device according to claim 1, further comprising a cold plate, disposed on the heat generating element, and connected to the evaporation end of the heat pipe.

3. The heat dissipation structure of the electronic device according to claim 1, further comprising a first protection gasket, wherein the first protection gasket is an elastic ring disposed in the combining hole, and the condensation end of the heat pipe extends through the first protection gasket.

4. The heat dissipation structure of the electronic device according to claim 1, further comprising a first one-way valve, disposed in the chamber, and optionally covering the combining hole.

5. The heat dissipation structure of the electronic device according to claim 1, wherein the heat pipe further has a rigid reinforcement member disposed on the heat pipe.

6. The heat dissipation structure of the electronic device according to claim 1, wherein the shell further has a water outlet communicating with the chamber.

7. The heat dissipation structure of the electronic device according to claim 1, further comprising a second protection gasket, wherein the second protection gasket is an elastic ring disposed in the through hole, and the condensation end of the heat pipe extends through the second protection gasket.

8. The heat dissipation structure of the electronic device according to claim 1, further comprising a second one-way valve, disposed in the cooling chamber, and optionally covering the through hole.

9. The heat dissipation structure of the electronic device according to claim 1, further comprising a sheath, disposed in the cooling chamber, and connected to the through hole.

10. The heat dissipation structure of the electronic device according to claim 1, wherein the cooling fluid is water, a coolant, or other cooling fluids.

11. The heat dissipation structure of the electronic device according to claim 1, wherein the heat pipe is a loop heat pipe (LHP), and the condensation end of the LHP is formed of a plurality of pipes communicating with one another.

12. The heat dissipation structure of the electronic device according to claim 1, wherein the shell and the inner shell are round pipe-shaped, rectangular pipe-shaped, or triangular pipe-shaped.

13. A heat dissipation structure of an electronic device, for dissipating heat energy of a heat generating element of at least one electronic device removably disposed in a rack, comprising:

at least one heat pipe, having a condensation end and an evaporation end opposite to each other, wherein the evaporation end is disposed on the heat generating element; and

a cooler, disposed on the rack, and comprising;

a shell, having a chamber therein;

a cooling fluid, disposed in the chamber; and

a combining hole, disposed on the shell, and communicating with the chamber, wherein when the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the chamber through the combining hole;

wherein the evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.

14. The heat dissipation structure of the electronic device according to claim 13, further comprising a cold plate, disposed on the heat generating element, and connected to the evaporation end of the heat pipe.

15. The heat dissipation structure of the electronic device according to claim 13, further comprising a first protection gasket, wherein the first protection gasket is an elastic ring disposed in the combining hole, and the condensation end of the heat pipe extends through the first protection gasket.

16. The heat dissipation structure of the electronic device according to claim 13, further comprising a first one-way valve, disposed in the chamber, and optionally covering the combining hole.

17. The heat dissipation structure of the electronic device according to claim 13, wherein the heat pipe further has a rigid reinforcement member disposed on the heat pipe.

18. The heat dissipation structure of the electronic device according to claim 13, further comprising a sheath, disposed in the chamber, and connected to the combining hole.

19. The heat dissipation structure of the electronic device according to claim 13, wherein the cooling fluid is water, a coolant, or other cooling fluids.

20. The heat dissipation structure of the electronic device according to claim 13, wherein the heat pipe is a loop heat pipe (LHP), and the condensation end of the LHP is formed of a plurality of pipes communicating with one another.

21. The heat dissipation structure of the electronic device according to claim 13, wherein the shell is round pipe-shaped, rectangular pipe-shaped, or triangular pipe-shaped.

22. A heat dissipation structure of an electronic device, for dissipating heat energy of a heat generating element of at least one electronic device removably disposed in a rack, comprising:

at least one heat pipe, having a condensation end and an evaporation end opposite to each other, wherein the evaporation end is disposed on the heat generating element; and

a cooler, disposed on the rack, and comprising;

a shell, having a chamber therein, wherein the chamber has a wall that divides the chamber into a cooling chamber and an isolation chamber;

a cooling fluid, disposed in the cooling chamber;

a combining hole, disposed on the shell, and communicating with the isolation chamber; and

a through hole, disposed on the wall, and communicating with the cooling chamber, wherein when the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooling chamber sequentially through the combining hole and the through hole;

wherein, the evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.

23. The heat dissipation structure of the electronic device according to claim 22, further comprising a cold plate, disposed on the heat generating element, and connected to the evaporation end of the heat pipe.

24. The heat dissipation structure of the electronic device according to claim 22, wherein the shell further has a water outlet communicating with the isolation chamber.

25. The heat dissipation structure of the electronic device according to claim 22, further comprising a first protection gasket, wherein the first protection gasket is an elastic ring disposed in the combining hole, and the condensation end of the heat pipe extends through the first protection gasket.

26. The heat dissipation structure of the electronic device according to claim 22, further comprising a first one-way valve, disposed in the chamber, and optionally covering the combining hole.

27. The heat dissipation structure of the electronic device according to claim 22, wherein the heat pipe further has a rigid reinforcement member disposed on the heat pipe.

28. The heat dissipation structure of the electronic device according to claim 22, further comprising a second protection gasket, wherein the second protection gasket is an elastic ring disposed in the through hole, and the condensation end of the heat pipe extends through the second protection gasket.

29. The heat dissipation structure of the electronic device according to claim 22, further comprising a second one-way valve, disposed in the cooling chamber, and optionally covering the through hole.

30. The heat dissipation structure of the electronic device according to claim 22, wherein the cooling fluid is water, a coolant, or other cooling fluids.

31. The heat dissipation structure of the electronic device according to claim 22, wherein the heat pipe is a loop heat pipe (LHP), and the condensation end of the LHP is formed of a plurality of pipes communicating with one another.

32. The heat dissipation structure of the electronic device according to claim 22, wherein the shell is round pipe-shaped, rectangular pipe-shaped, or triangular pipe-shaped.