INTEGRATED PCB UHF RFID MATCHING NETWORK/ANTENNA

• US 20120104103A1
• Filed: 10/29/2010
• Published: 05/03/2012
• Est. Priority Date: 10/29/2010
• Status: Abandoned Application

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: MANZI, Giuliano
• Application Number:
  US12/916,268
• Publication Number:
  US 20120104103A1
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/065 Microstrip dipole antennas patch antenna H01Q9/0407
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: H05K 1/025 Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

A matching network is integrated into a multilayer printed circuit board containing an RFID integrated circuit to provide both an antenna and a matching network for the RFID integrated circuit in the ultra high frequency regime.

Claims

1. An integrated PCB RFID integrated circuit comprising:

an RFID integrated circuit electrically coupled to a multilayered printed circuit board having a first plurality of traces that are distributed over the multilayered printed circuit board to form a multilayer inductive coil for the RFID integrated circuit.

2. The integrated PCB RFID integrated circuit of claim 1 wherein the multilayer inductive coil is adapted for UHF frequencies.

3. The integrated PCB RFID integrated circuit of claim 1 wherein the plurality of traces comprise aluminum.

4. The integrated PCB RFID integrated circuit of claim 1 wherein the multilayer inductive coil is electrically coupled to the midpoint of a trace forming a dipole antenna that is attached onto the multilayered printed circuit.

5. The integrated PCB RFID integrated circuit of claim 1 wherein the multilayer inductive coil is magnetically coupled to a trace forming a dipole antenna that is attached onto the multilayered printed circuit board.

6. The integrated PCB RFID integrated circuit of claim 1 wherein the RFID integrated circuit is electrically coupled to a ground plane of the multilayered printed circuit board using resonating slots.

7. The integrated PCB RFID integrated circuit of claim 1 wherein the multilayered printed circuit board has two layers.

8. The integrated PCB RFID integrated circuit of claim 1 wherein the multilayer inductive coil is adapted to provide impedance matching for the RFID integrated circuit.

9. The integrated PCB RFID integrated circuit of claim 1 adapted to receive power from an interrogator.

10. The integrated PCB RFID integrated circuit of claim 1 wherein the plurality of traces are electrically coupled together using metallized vias.

11. A method for making an PCB RFID integrated circuit comprising:

providing an RFID integrated circuit;

electrically coupling the RFID circuit to a multilayered printed circuit board;

forming a plurality of traces that are distributed over the multilayered printed circuit board; and

forming a multilayer inductive coil for the RFID integrated circuit from the plurality of traces.

12. The method of claim 11 wherein the multilayer inductive coil is magnetically coupled to a trace forming a dipole antenna that is attached onto the multilayered printed circuit board.

13. The method of claim 11 wherein the RFID integrated circuit is electrically coupled to a ground plane of the multilayered printed circuit board using resonating slots.

14. The method of claim 11 wherein the multilayer inductive coil is adapted for UHF frequencies.

15. The method of claim 11 wherein the multilayer inductive coil is adapted to provide impedance matching for the RFID integrated circuit.