LEADFRAME PACKAGE WITH RECESSED CAVITY FOR LED
First Claim
1. A light emitting diode (LED) package comprising:
- a metal die pad having a bottom planar surface, an upper surface, and a centrally located recessed cavity, the recessed cavity having a planar chip attach surface between the bottom planar surface and the upper surface, the recessed cavity also having sidewalls that extend from the recessed planar chip attach surface to the upper surface;
first and second metal leads arranged on opposing sides of the die pad, the first and second metal leads having a bottom planar surface that is coextensive with the bottom planar surface of the die pad and an upper planar surface that is coextensive with the upper surface of the die pad;
an LED chip attached to the chip attach surface within the recessed cavity, the LED chip having first and second bonding pads located on an upper surface thereof;
first and second conductors that electrically connect the first and second bonding pads to the first and second metal leads, respectively; and
a package body comprising an encapsulant, wherein the encapsulant fills space between the metal die pad and first and second metal leads forms a bottom encapsulant surface that is coextensive with the bottom planar surfaces of the die pad and the bottom planar surface of the first and second metal leads.
1 Assignment
0 Petitions
Accused Products
Abstract
An LED package includes a die pad having a bottom surface, an upper surface and a centrally located recessed cavity. The recessed cavity has a chip attach surface between the bottom surface and upper surface and sidewalls that extend from the recessed chip attach surface to the upper surface. The package additionally has leads arranged on opposing sides of the die pad. The leads have a bottom surface that is coextensive with the bottom surface of the die pad and an upper surface coextensive with the upper surface of the die pad. An LED chip is attached to the chip attach surface. The package further includes a package body having an encapsulant which fills space between the die pad and leads forming a bottom encapsulant surface that is coextensive with the bottom surfaces of the die pad and leads.
16 Citations
20 Claims
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1. A light emitting diode (LED) package comprising:
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a metal die pad having a bottom planar surface, an upper surface, and a centrally located recessed cavity, the recessed cavity having a planar chip attach surface between the bottom planar surface and the upper surface, the recessed cavity also having sidewalls that extend from the recessed planar chip attach surface to the upper surface; first and second metal leads arranged on opposing sides of the die pad, the first and second metal leads having a bottom planar surface that is coextensive with the bottom planar surface of the die pad and an upper planar surface that is coextensive with the upper surface of the die pad; an LED chip attached to the chip attach surface within the recessed cavity, the LED chip having first and second bonding pads located on an upper surface thereof; first and second conductors that electrically connect the first and second bonding pads to the first and second metal leads, respectively; and a package body comprising an encapsulant, wherein the encapsulant fills space between the metal die pad and first and second metal leads forms a bottom encapsulant surface that is coextensive with the bottom planar surfaces of the die pad and the bottom planar surface of the first and second metal leads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A leadframe for use in making light emitting diode (LED) packages, the leadframe comprising:
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a rectangular outer metal frame having an upper planar surface and a lower planar surface; a plurality of inner frames arranged in a matrix pattern within the outer metal frame, each of the inner frames comprising a chip containing area and first and second leads arranged on opposing sides of the chip containing area; wherein the chip containing area and first and second leads have a bottom surface coextensive with the lower planar surface and have an upper surface coextensive with the upper planar surface, the chip containing area further comprising a centrally located recessed cavity having a recessed planar surface between the upper and lower planar surfaces of the leadframe and having sidewalls that extend from the recessed planar surface to the upper surface. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20-26. -26. (canceled)
Specification