PACKAGE STRUCTURE WITH MICRO-ELECTROMECHANICAL ELEMENT AND MANUFACTURING METHOD THEREOF

• US 20120104517A1
• Filed: 12/03/2010
• Published: 05/03/2012
• Est. Priority Date: 11/01/2010
• Status: Active Grant

• Current Assignee: Siliconware Precision Industries Co., Ltd.
• Original Assignee: Siliconware Precision Industries Co., Ltd.
• Inventors: Huang, Chun-An, Liao, Hsin-Yi, Chiu, Shih-Kuang
• Granted Patent: US 8,610,272 B2
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A package structure includes a micro-electromechanical element having a plurality of electrical contacts; a package layer enclosing the micro-electromechanical element and the electrical contacts, with a bottom surface of the micro-electromechanical element exposed from a lower surface of the package layer; a plurality of bonding wires embedded in the package layer, each of the bonding wires having one end connected to one of the electrical contacts, and the other end exposed from the lower surface of the package layer; and a build-up layer structure provided on the lower surface of the package layer, the build-up layer including at least one dielectric layer and a plurality of conductive blind vias formed in the dielectric layer and electrically connected to one ends of the bonding wires. The package structure is easier to accurately control the location of an external electrical contact, and the compatibility of the manufacturing procedures is high.

Claims

1. A package structure, comprising:

a micro-electromechanical element having a plurality of electrical contacts;

a package layer enclosing the micro-electromechanical element and the electrical contacts, with a bottom surface of the micro-electromechanical element exposed from a lower surface of the package layer;

a plurality of bonding wires embedded in the package layer, each of the bonding wires having one end connected to one of the electrical contacts of the micro-electromechanical element, and the other end exposed from the lower surface of the package layer; and

a build-up layer structure provided on the lower surface of the package layer, the build-up layer including at least one dielectric layer and a plurality of conductive blind vias formed in the dielectric layer and electrically connected to the other ends of the bonding wires.

2. The package structure of claim 1, further comprising a solder resist layer having a plurality of solder resist openings provided on the build-up layer structure to expose a portion of the surface of the conductive blind vias from the solder resist openings.

3. The package structure of claim 2, further comprising a solder ball provided on the exposed conductive blind via in each of the solder resist openings.

4. The package structure of claim 1, wherein the build-up layer structure further includes a trace layer on the at least one dielectric layer, and the conductive blind vias electrically connect the trace layer and the bonding wires.

5. The package structure of claim 4, further comprising a solder resist layer having a plurality of solder resist openings provided on the build-up layer structure to expose a portion of the surface of the trace layer from the solder resist openings.

6. The package structure of claim 5, further comprising a solder ball provided on the exposed trace layer in each of the solder resist openings.

7. The package structure of claim 1, wherein the micro-electromechanical element is a gyroscope, an accelerometer, or an RF MEMS element.

8. A method for manufacturing a package structure having a micro-electromechanical element, comprising:

preparing a carrier board having a first surface and a second surface opposing the first surface;

providing a plurality of micro-electromechanical elements on the first surface of the carrier board, each of the micro-electromechanical elements having a plurality of electrical contacts;

connecting the electrical contacts and the first surface of the carrier board by a plurality of bonding wires;

forming a package layer on the first surface of the carrier board to enclose the micro-electromechanical element, the electrical contacts, and the bonding wires;

removing the carrier board to expose one end of each of the bonding wires; and

forming a build-up layer structure on the surface of the package layer that exposes the bonding wires, the build-up layer including at least one dielectric layer and a plurality of conductive blind vias formed in the dielectric layer and electrically connected to one ends of the bonding wires.

9. The method of claim 8, wherein the carrier board further includes a substrate and an adhesive layer attached thereon, the exposed surface of the adhesive layer is the first surface, and the exposed surface of the substrate is the second surface.

10. The method of claim 9, wherein the substrate is a material containing silicon.

11. The method of claim 8, further comprising forming a solder resist layer having a plurality of solder resist openings on the build-up layer structure to expose a portion of the surface of the conductive blind vias from the solder resist openings.

12. The method of claim 11, further comprising forming a solder ball on the exposed conductive blind via in each of the solder resist openings.

13. The method of claim 12, further comprising performing singulation to obtain a plurality of package structures each with the micro-electromechanical element.

14. The method of claim 8, wherein the build-up layer structure further includes a trace layer on the at least one dielectric layer, and the conductive blind vias electrically connect the trace layer and one ends of the bonding wires.

15. The method of claim 14, further comprising forming a solder resist layer having a plurality of solder resist openings on the build-up layer structure to expose a portion of the surface of the trace layer from the solder resist openings.

16. The method of claim 15, further comprising forming a solder ball provided on the exposed trace layer in each of the solder resist openings.

17. The method of claim 16, further comprising performing singulation to obtain a plurality of package structures each with the micro-electromechanical element.

18. The method of claim 8, wherein the material of the carrier board is aluminum.

19. The method of claim 8, wherein removing the carrier board includes irradiation, heating, etching, or lapping

20. The method of claim 8, wherein the micro-electromechanical element is a gyroscope, an accelerometer, or an RF MEMS element.