SUBSTRATE PROCESSING SYSTEM

• US 20120109355A1
• Filed: 10/02/2009
• Published: 05/03/2012
• Est. Priority Date: 07/03/2009
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Baccini, Andrea, Galiazzo, Marco, Vercesi, Tommaso
• Application Number:
  US13/382,043
• Publication Number:
  US 20120109355A1
• Time in Patent Office: Days
• US Class Current: 700/108
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67225 comprising at least one lithography chamber lithographic apparatuses G03F7/00
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

Embodiments of the present invention provide an apparatus and method for processing substrates in a processing system that has an increased system throughput, improved system uptime, and improved device yield performance, while maintaining a repeatable and accurate substrate processing. The system may include multiple processing nests laterally positionable by use of a planar motor via multiple planar movers controlled by a system controller. A substrate supported by each processing nest may be angularly positionable by a rotary actuator. The system may be used in screen printing, ink jet printing, thermal processing, device testing, and material removal processes, among others.

Claims

1. An apparatus for processing a substrate, comprising:

a planar stator;

a first mover positioned on the planar stator;

a second mover positioned on the planar stator, wherein the first and second movers are configured to move laterally and longitudinally over the planar stator in a horizontal plane independently of one another;

a first substrate support coupled to the first mover and positionable to receive a substrate in a substrate loading position;

a second substrate support coupled to the second mover and positionable to receive a substrate in the substrate loading position; and

a processing head configured to process a substrate positioned on the first substrate support when the first substrate support is in a first substrate processing position, wherein the processing head is further configured to process a substrate positioned on the second substrate support when the second substrate support is in a second substrate processing position.

2. The Apparatus as in claim 1, wherein said processing comprises one or the other between screen printing, ink jet printing, laser ablation or laser etching.

3. The apparatus of claim 1, further comprising an inspection system configured to capture data regarding the position and orientation of a substrate disposed on the first substrate support when the first substrate support is in the substrate loading position.

4. The apparatus of claim 3, wherein the apparatus is configured to move the first substrate support from the substrate support loading position to the first substrate processing position at least partially based on the data captured by the inspection system via the planar stator and the first mover.

5. The apparatus of claim 4, wherein the processing head is configured to deposit a patterned layer on the first and second substrates.

6. The apparatus of claim 5, wherein the processing head further comprises one or more actuators configured to adjust components in the processing head laterally, longitudinally, and angularly based on the data captured by the inspection system.

7. The apparatus of claim 5, wherein the processing head further comprises one or more actuators configured to adjust components in the processing head angularly based on the data captured by the inspection system.

8. The apparatus of claim 5, wherein the first substrate support further comprises an actuator configured to angularly adjust the first substrate support based on the data captured by the inspection system.

9. The apparatus of claim 8, wherein the inspection system is further configured to capture data regarding the position and orientation of a substrate disposed on the second substrate support when the second substrate support is in the substrate loading position.

10. The apparatus of claim 9, wherein the apparatus is configured to move the second substrate support from the substrate loading position to the second substrate processing position at least partially based on the data captured by the inspection system via the planar stator and the second mover.

11. The apparatus of claim 10, wherein the second substrate support further comprises an actuator configured to angularly adjust the second substrate support based on the data captured by the inspection system.

12. The apparatus of claim 11, wherein each of the first and second substrate supports further comprises a continuous conveyor configured to assist in loading and unloading a substrate.

13. An apparatus for processing a substrate, comprising:

a planar stator;

a first mover positioned on the planar stator;

a second mover positioned on the planar stator, wherein the first and second movers are configured to move laterally and longitudinally over the planar stator in a horizontal plane independently of one another;

a first substrate support coupled to the first mover and positioned to receive a substrate in a first substrate loading position;

a second substrate support coupled to the second mover and positioned to receive a substrate in a second substrate loading position;

a first processing head configured to process a substrate positioned on the first substrate support when the first substrate support is in a first substrate processing position; and

a second processing head configured to process a substrate positioned on the second substrate support when the second substrate support is in a second substrate processing position.

14. The apparatus of claim 13, further comprising:

a first inspection system configured to capture data regarding the position and orientation of a substrate disposed on the first substrate support when the first substrate support is in the first substrate loading position; and

a second inspection system configured to capture data regarding the position and orientation of a substrate disposed on the second substrate support when the second substrate support is in the second substrate loading position.

15. The apparatus of claim 14, wherein the apparatus is configured to move the first substrate support from the first substrate loading position to the first substrate processing position at least partially based on the data captured by the first inspection system via the planar stator and the first mover, and wherein the apparatus is configured to move the second substrate support from the second substrate loading position to the second substrate processing position at least partially based on the data captured by the second inspection system via the planar stator and the second mover.

16. The apparatus of claim 15, wherein the first processing head is configured to deposit a patterned layer on a first substrate positioned on the first substrate support when the first substrate support is in the first substrate processing position, and wherein the second processing head is configured to deposit a patterned layer on a substrate positioned on the second substrate support when the second substrate support is in the second substrate processing position.

17. The apparatus of claim 15, wherein the apparatus further comprises:

a third mover positioned on the planar stator;

a fourth mover positioned on the planar stator, wherein the first, second, third, and fourth movers are configured to mover laterally and longitudinally over the planar stator in a horizontal plane independently of one another;

a third substrate support coupled to the third mover and positionable to receive a substrate in the first substrate loading position; and

a fourth substrate support coupled to the fourth mover and positionable to receive a substrate in the second substrate loading position.

18. The apparatus of claim 17, wherein the first processing head is configured to deposit a patterned layer on a substrate positioned on the third substrate support when the third substrate support is in a third substrate processing position, and wherein the second processing head is configured to deposit a patterned layer on a substrate positioned on the fourth substrate support when the fourth substrate support is in a fourth substrate processing position.

19. The apparatus of claim 18, wherein the first inspection system is further configured to capture data regarding the position and orientation of a substrate disposed on the third substrate support when the third substrate support is in the first substrate loading position, and wherein the second inspection system is further configured to capture data regarding the position and orientation of a substrate disposed on the fourth substrate support when the fourth substrate support is in the second substrate loading position.

20. The apparatus of claim 19, wherein the apparatus is configured to move the third substrate support from the first substrate loading position to the third substrate processing position at least partially based on the data captured by the first inspection system via the planar stator and the third mover, and wherein the apparatus is configured to move the fourth substrate support from the second substrate loading position to the fourth substrate processing position at least partially based on the data captured by the second inspection system via the planar stator and the fourth mover.

21. The apparatus of claim 20, wherein the first processing head comprises one or more actuators configured to angularly position components in the first processing head based on data captured by the first inspection system, and wherein the second processing head comprises one or more actuators configured to angularly position components in the second processing head based on data captured by the second inspection system.

22. The apparatus of claim 21, wherein each of the first and third substrate supports further comprise an actuator configured to angularly adjust the first or third substrate support based on data captured by the first inspection system, and wherein each of the second and fourth substrate supports further comprise an actuator configured to angularly adjust the second or fourth substrate support based on data captured by the second inspection system.

23. A method for processing a substrate, comprising:

orienting a first substrate support in a first substrate loading position via a planar stator and a first mover attached to the first substrate support;

orienting a second substrate support in a second substrate loading position via the planar stator and a second mover attached to the second substrate support;

receiving a first substrate on the first substrate support;

capturing data via a first inspection system regarding the position and orientation of the first substrate on the first substrate support;

receiving a second substrate on the second substrate support;

capturing data via a second inspection system regarding the position and orientation of the second substrate on the second substrate support;

moving the first substrate support from the first substrate loading position to a first substrate processing position at least partially based on the data captured by the first inspection system via the planar stator and the first mover;

processing the first substrate via a first processing head;

moving the second substrate support from the second substrate loading position to a second substrate processing position at least partially based on the data captured by the first inspection system via the planar stator and the second mover; and

processing the second substrate via a second processing head.

24. The process of claim 23, further comprising:

angularly orienting components in the first processing head based on data captured by the first inspection system prior to processing the first substrate; and

angularly orienting components in the second processing head based on data captured by the second inspection system prior to processing the second substrate.

25. The process of claim 23, further comprising:

angularly orienting the first substrate support via an actuator coupled to the first substrate support prior to processing the first substrate; and

angularly orienting the second substrate support via an actuator coupled to the second substrate support prior to processing the second substrate.