COPPER FOIL WITH RESISTANCE LAYER, METHOD OF PRODUCTION OF THE SAME AND LAMINATED BOARD
First Claim
1. A copper foil with a resistance layer comprising a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles.
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Abstract
A copper foil with a resistance layer is provided, wherein the variation value is small when it is made into a resistance element, the adhesion with the resin substrate to be laminated with is able to be sufficiently maintained, which has an excellent characteristics as a resistance element for a rigid and a flexible substrate. A copper foil with a resistance layer of the present invention comprises a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles. A method of production of a copper foil with a resistance layer of the present invention comprises: forming a resistance layer of phosphorus-containing nickel on a matte surface of an electrodeposited copper foil having crystals comprised of columnar crystal grains wherein a foundation of the matte surface is within a range of 2.5 to 6.5 μm in terms of Rz value prescribed in JIS-B-0601; and performing roughening treatment to a surface of the resistance layer with nickel particles wherein a roughness is within a range of 4.5 to 8.5 μm in terms of Rz value prescribed in JIS-B-0601. The alloy layer is for example formed from phosphorus-containing nickel.
28 Citations
12 Claims
- 1. A copper foil with a resistance layer comprising a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles.
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2. A copper foil with a resistance layer comprising a copper foil on one surface of which a metal layer or alloy layer is formed form which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles, the surface subjected to the roughening treatment being plated by capsule plating.
- 3. A copper foil with a resistance layer comprising a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles, on the surface subjected to the roughening treatment a chromate rust prevention layer being formed.
- 4. A copper foil with a resistance layer comprising a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles, on the surface subjected to the roughening treatment a chromate rust prevention layer being formed, and on the surface of the rust prevention layer a thin film layer of a silane coupling agent being formed.
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10. A method of production of a copper foil with a resistance layer comprising:
- forming a resistance layer of phosphorus-containing nickel on a matte surface of an electrodeposited copper foil having crystals comprised of columnar crystal grains wherein a foundation of the matte surface is within a range of 2.5 to 6.5 μ
m in terms of Rz value prescribed in JIS-B-0601; and
performing roughening treatment to a surface of the resistance layer with nickel particles wherein a roughness is within a range of 4.5 to 8.5 μ
m in terms of Rz value prescribed in JIS-B-0601. - View Dependent Claims (11)
- forming a resistance layer of phosphorus-containing nickel on a matte surface of an electrodeposited copper foil having crystals comprised of columnar crystal grains wherein a foundation of the matte surface is within a range of 2.5 to 6.5 μ
Specification