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WIRE BONDING APPARATUS AND METHOD USING THE SAME

  • US 20120111923A1
  • Filed: 09/20/2011
  • Published: 05/10/2012
  • Est. Priority Date: 11/05/2010
  • Status: Active Grant
First Claim
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1. A wire bonding apparatus comprising:

  • a heater block for supporting a chip mounting frame disposed thereon, the chip mounting frame having a plurality of chips stacked thereon, and the heater block configured to supply first heat to heat lower portions of the plurality of chips;

    a chip heating unit configured to be disposed above the chip mounting frame and to supply second heat to heat upper portions of the plurality of chips;

    a first temperature sensing unit for determining a first temperature of an arbitrary first chip among the plurality of chips;

    a second temperature sensing unit for determining a second temperature of a second chip disposed farther from the heater block than the first chip; and

    a temperature adjusting unit configured to compare the first temperature with the second temperature and adjust the magnitude of the second heat generated by the chip heating unit according to the comparison result.

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