WIRE BONDING APPARATUS AND METHOD USING THE SAME

• US 20120111923A1
• Filed: 09/20/2011
• Published: 05/10/2012
• Est. Priority Date: 11/05/2010
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Yong-Je, Ha, Seung-Weon, Han, Won-Gil
• Granted Patent: US 8,245,902 B2
• Time in Patent Office: Days
• US Class Current: 228/9
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/78251 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85048 Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/859 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06562 at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

Provided are a wire bonding apparatus and a method wire bonding and manufacturing a semiconductor device using the same. The wire bonding apparatus includes a heater block configured to support a stack including a chip mounting frame and a plurality of chips stacked on the chip mounting frame. The heater block is configured to supply heat to a first portion of the stack. The apparatus further includes a chip heating unit disposed at a different height from the heater block. The chip heating unit is configured to supply heat to a second portion of the stack at a different height from the first portion. The apparatus further includes a first temperature sensing unit positioned to be located at a first height and to determine a first temperature at the first portion of the stack, a second temperature sensing unit positioned to be located at a second height and to determine a second temperature at the second portion of the stack, and a temperature adjusting unit configured to compare the first temperature to the second temperature and to adjust the magnitude of the heat supplied by at least one of the heater block and the chip heating unit according to a result of the comparison.

Claims

1. A wire bonding apparatus comprising:

a heater block for supporting a chip mounting frame disposed thereon, the chip mounting frame having a plurality of chips stacked thereon, and the heater block configured to supply first heat to heat lower portions of the plurality of chips;

a chip heating unit configured to be disposed above the chip mounting frame and to supply second heat to heat upper portions of the plurality of chips;

a first temperature sensing unit for determining a first temperature of an arbitrary first chip among the plurality of chips;

a second temperature sensing unit for determining a second temperature of a second chip disposed farther from the heater block than the first chip; and

a temperature adjusting unit configured to compare the first temperature with the second temperature and adjust the magnitude of the second heat generated by the chip heating unit according to the comparison result.

2. The wire bonding apparatus of claim 1, wherein the plurality of chips include chips stacked vertically, wherein adjacent chips of the stack are connected to each other by an adhesive layer.

3. The wire bonding apparatus of claim 1, wherein the temperature adjusting unit is configured to compare a temperature difference between the first temperature and the second temperature with a reference value, and increase the magnitude of the second heat when the temperature difference is greater than the reference value, or maintain the magnitude of the second heat when the temperature difference is equal to or smaller than the reference value.

4. The wire bonding apparatus of claim 3, wherein the temperature adjusting unit is configured to compare the first temperature with a first reference temperature and based on the comparison adjust the magnitude of the first heat generated by the heater block.

5. The wire bonding apparatus of claim 1, further comprising a temperature determining unit configured to determine an initial second heat initially generated by the chip heating unit according to the number of the plurality of chips stacked on the chip mounting frame.

6. The wire bonding apparatus of claim 1, further comprising:

a product information supply unit disposed on the chip mounting frame and configured to supply information on characteristics of the plurality of chips; and

a product recognizing unit configured to recognize characteristics of the plurality of chips from the product information supply unit when the chip mounting frame moves into the wire bonding apparatus,

wherein the chip mounting frame further comprises a temperature determining unit configured to determine an initial second heat initially generated by the chip heating unit according to the characteristics of the plurality of chips recognized by the product recognizing unit.

7. The wire bonding apparatus of claim 6, wherein the temperature determining unit includes a library in which information on the initial second heat corresponding to the characteristics of the plurality of chips is stored.

8. The wire bonding apparatus of claim 6, wherein the characteristics of the plurality of chips include a heat transfer rate of the first heat from a bottommost chip of the plurality of chips to the topmost chip of the plurality of chips.

9. The wire bonding apparatus of claim 1, wherein a temperature sensed by the first temperature sensing unit is used to estimate the first temperature using the characteristics of the plurality of chips.

10. The wire bonding apparatus of claim 1, wherein the chip heating unit is configured to supply heat wind having the second heat to upper portions of the plurality of chips.

11. The wire bonding apparatus of claim 1, wherein the chip heating unit is configured to supply infrared rays having the second heat to upper portions of the plurality of chips.

12-30. -30. (canceled)

31. A wire bonding apparatus comprising:

a heater block configured to support a stack including a chip mounting frame and a plurality of chips stacked on the chip mounting frame, wherein the heater block is configured to supply heat to a first portion of the stack;

a chip heating unit disposed at a different height from the heater block, wherein the chip heating unit is configured to supply heat to a second portion of the stack at a different height from the first portion;

a first temperature sensing unit positioned to be located at a first height and to determine a first temperature at the first portion of the stack;

a second temperature sensing unit positioned to be located at a second height and to determine a second temperature at the second portion of the stack; and

a temperature adjusting unit configured to compare the first temperature to the second temperature and to adjust the magnitude of the heat supplied by at least one of the heater block and the chip heating unit according to a result of the comparison.

32. The wire bonding apparatus of claim 31, wherein:

the first portion of the stack is a portion that includes the chip mounting frame and a lower set of chips; and

the second portion of the stack is a portion that includes an upper set of chips.

33. The wire bonding apparatus of claim 32, wherein:

the heater block is disposed below the stack and the chip heating unit is disposed above the stack;

the second height is a height above the top of the stack; and

the first height is a height closer to the bottom of the stack than the second height.

34. The wire bonding apparatus of claim 33, wherein:

the first height is a height below the bottom of the stack.

35. The wire bonding apparatus of claim 31, wherein:

the temperature adjusting unit is configured to adjust the heat supplied by the chip heating unit based on a result of the comparison.

36. The wire bonding apparatus of claim 35, wherein the temperature adjusting unit is configured to compare a temperature difference between the first temperature and the second temperature with a reference value, and increase the magnitude of the heat supplied by the chip heating unit when the temperature difference is greater than the reference value, or maintain the magnitude of the heat supplied by the chip heating unit when the temperature difference is equal to or smaller than the reference value.

37. The wire bonding apparatus of claim 31, further comprising a temperature determining unit configured to determine an initial heat initially to generate by the chip heating unit according to the number of the plurality of chips stacked on the chip mounting frame.

38. The wire bonding apparatus of claim 31, wherein:

the first temperature sensing unit is a sensor configured to sense a temperature of a lower chip in the stack of chips or of the heater block; and

the second temperature sensing unit is a sensor configured to sense a temperature of an upper chip in the stack of chips higher in the stack than the lower chip.

39. The wire-bonding apparatus of claim 31, further comprising:

a capillary configured to connect bonding wires to chip pads of the chips.

40-48. -48. (canceled)