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MEMS SENSOR PACKAGE

  • US 20120112368A1
  • Filed: 01/11/2012
  • Published: 05/10/2012
  • Est. Priority Date: 08/11/2009
  • Status: Abandoned Application
First Claim
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1. An MEMS sensor package comprising:

  • an MEMS sensor and a driving IC that controls driving of the MEMS sensor, which are fixed to the same mounting surface made of a given package material,wherein an MEMS sensor mounting area and a driving IC mounting area are set on the mounting surface,a die attach metalized layer is formed on a package material of the driving IC mounting area, andthe driving IC is mounted on the die attach metalized layer, and the MEMS sensor is mounted on a package material of the MEMS sensor mounting area.

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