MEMS SENSOR PACKAGE
First Claim
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1. An MEMS sensor package comprising:
- an MEMS sensor and a driving IC that controls driving of the MEMS sensor, which are fixed to the same mounting surface made of a given package material,wherein an MEMS sensor mounting area and a driving IC mounting area are set on the mounting surface,a die attach metalized layer is formed on a package material of the driving IC mounting area, andthe driving IC is mounted on the die attach metalized layer, and the MEMS sensor is mounted on a package material of the MEMS sensor mounting area.
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Abstract
An MEMS sensor package includes an MEMS sensor and a driving IC that controls driving of the MEMS sensor, which are fixed onto the same mounting surface made of a given package material, wherein an MEMS sensor mounting area and a driving IC mounting area are set on the mounting surface, a die attach metalized layer is formed on a package material of the driving IC mounting area, the driving IC is mounted on the die attach metalized layer, and the MEMS sensor is mounted on a package material of the MEMS sensor mounting area.
21 Citations
3 Claims
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1. An MEMS sensor package comprising:
- an MEMS sensor and a driving IC that controls driving of the MEMS sensor, which are fixed to the same mounting surface made of a given package material,
wherein an MEMS sensor mounting area and a driving IC mounting area are set on the mounting surface, a die attach metalized layer is formed on a package material of the driving IC mounting area, and the driving IC is mounted on the die attach metalized layer, and the MEMS sensor is mounted on a package material of the MEMS sensor mounting area. - View Dependent Claims (2, 3)
- an MEMS sensor and a driving IC that controls driving of the MEMS sensor, which are fixed to the same mounting surface made of a given package material,
Specification