METHOD OF MAKING A FINGER SENSOR PACKAGE AND ASSOCIATED DEVICES

• US 20120112764A1
• Filed: 11/05/2010
• Published: 05/10/2012
• Est. Priority Date: 11/05/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Authentec Incorporated State of Incorporation Delaware
• Inventors: Rao, Yang, Goldenberg, Michael P., Schenk, Roger, Spletter, Phil
• Granted Patent: US 8,701,267 B2
• Time in Patent Office: Days
• US Class Current: 324/629
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

A method of making finger sensor packages may include advancing a flexible circuit tape along a predetermined path of travel. The flexible circuit tape may include a flexible layer and conductive traces thereon defining individual flexible circuits. The method may include, as the flexible circuit tape is advanced along the path of travel, securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define finger sensor packages, and stamping out the finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.

Claims

1. A method of making a plurality of finger sensor packages comprising:

advancing a flexible circuit tape along a predetermined path of travel, the flexible circuit tape comprising a flexible layer and conductive traces thereon defining a plurality of individual flexible circuits; and

performing the following steps as the flexible circuit tape is advanced along the path of travel

securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each individual flexible circuit,

applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define a plurality of finger sensor packages, and

stamping out the plurality of finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.

2. The method according to claim 1 wherein each individual flexible circuit comprises an extension portion extending outwardly from the corresponding sensor package frame.

3. The method according to claim 2 wherein performing the following steps further comprises securing a respective stiffener member on a distal end of the extension portion of the corresponding individual flexible circuit.

4. The method according to claim 1 wherein the at least one flush common edge comprises three flush common edges.

5. The method according to claim 1 wherein the at least one fluid fill material comprises at least one curable fluid fill material;

and further comprising curing the at least one curable fluid fill material prior to stamping.

6. The method according to claim 1 wherein the at least one fluid fill material comprises:

an underfill fluid material applied between the individual flexible circuit and adjacent portions of each finger sensing IC; and

a backfill fluid material applied between each sensor package frame and adjacent portions of the corresponding finger sensing IC.

7. The method according to claim 1 wherein securing the sensor package frame comprises securing using an adhesive.

8. The method according to claim 1 wherein each finger sensing IC comprises a plurality of finger sensing pixels opposing adjacent portions of the corresponding individual flexible circuit.

9. The method according to claim 1 wherein each sensor package frame has a rectangular shape.

10. The method according to claim 1 wherein each finger sensing IC comprises a plurality of bond pads connected to corresponding ones of the plurality of conductive traces.

11. A method of making a finger sensor package comprising:

securing a finger sensing integrated circuit (IC) to a flexible circuit, the flexible circuit comprising a flexible layer and a plurality of conductive traces thereon;

securing a sensor package frame to the flexible circuit and surrounding the finger sensing IC;

applying at least one fluid fill material adjacent the finger sensor IC while using the sensor package frame as a dam; and

trimming at least one edge of the flexible circuit and sensor package frame to make the finger sensor package having at least one flush common edge between the sensor package frame and flexible circuit.

12. The method according to claim 11 wherein the flexible circuit comprises an extension portion extending outwardly from the sensor package frame.

13. The method according to claim 12 further comprising securing a respective stiffener member on a distal end of the extension portion of the flexible circuit.

14. The method according to claim 11 wherein the at least one flush common edge comprises three flush common edges.

15. The method according to claim 11 wherein the at least one fluid fill material comprises at least one curable fluid fill material;

and further comprising curing the at least one curable fluid fill material prior to trimming.

16. The method according to claim 11 wherein the at least one fluid fill material comprises:

an underfill fluid material applied between the flexible circuit and adjacent portions of the finger sensing IC; and

a backfill fluid material applied between the sensor package frame and adjacent portions of the finger sensing IC.

17. The method according to claim 11 wherein securing the sensor package frame comprises securing using an adhesive.

18. The method according to claim 11 wherein the finger sensing IC comprises a plurality of finger sensing pixels opposing adjacent portions of the flexible circuit.

19. The method according to claim 11 wherein the sensor package frame has a rectangular shape.

20. The method according to claim 11 wherein the finger sensing IC comprises a plurality of bond pads connected to corresponding ones of the plurality of conductive traces.

21. A finger sensor package comprising:

a finger sensing integrated circuit (IC);

a flexible circuit secured to said finger sensing IC, said flexible circuit comprising a flexible layer and a plurality of conductive traces thereon;

a sensor package frame secured to said flexible circuit and surrounding said finger sensing IC; and

at least one fill material adjacent said finger sensing IC;

at least one edge of said flexible circuit and said sensor package frame having at least one flush common edge therebetween.

22. The finger sensor package according to claim 21 wherein said flexible circuit comprises an extension portion extending outwardly from said sensor package frame.

23. The finger sensor package according to claim 22 further comprising a respective stiffener member on a distal end of said extension portion of said flexible circuit.

24. The finger sensor package according to claim 21 wherein the at least one flush common edge comprises three flush common edges.

25. The finger sensor package according to claim 21 wherein said at least one fill material comprises at least one curable fill material.

26. The finger sensor package according to claim 21 wherein said at least one fill material comprises:

an underfill material between said flexible circuit and adjacent portions of said finger sensing IC; and

a backfill material between said sensor package frame and adjacent portions of said finger sensing IC.

27. The finger sensor package according to claim 21 further comprising an adhesive securing said sensor package frame to said flexible circuit.

28. The finger sensor package according to claim 21 wherein said finger sensing IC comprises a plurality of finger sensing pixels opposing adjacent portions of said flexible circuit.

29. The finger sensor package according to claim 21 wherein said sensor package frame has a rectangular shape.

30. The finger sensor package according to claim 21 wherein said finger sensing IC comprises a plurality of bond pads connected to corresponding ones of the plurality of conductive traces.