METHOD OF MAKING A FINGER SENSOR PACKAGE AND ASSOCIATED DEVICES
First Claim
1. A method of making a plurality of finger sensor packages comprising:
- advancing a flexible circuit tape along a predetermined path of travel, the flexible circuit tape comprising a flexible layer and conductive traces thereon defining a plurality of individual flexible circuits; and
performing the following steps as the flexible circuit tape is advanced along the path of travelsecuring a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each individual flexible circuit,applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define a plurality of finger sensor packages, andstamping out the plurality of finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.
2 Assignments
0 Petitions
Accused Products
Abstract
A method of making finger sensor packages may include advancing a flexible circuit tape along a predetermined path of travel. The flexible circuit tape may include a flexible layer and conductive traces thereon defining individual flexible circuits. The method may include, as the flexible circuit tape is advanced along the path of travel, securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define finger sensor packages, and stamping out the finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.
-
Citations
30 Claims
-
1. A method of making a plurality of finger sensor packages comprising:
-
advancing a flexible circuit tape along a predetermined path of travel, the flexible circuit tape comprising a flexible layer and conductive traces thereon defining a plurality of individual flexible circuits; and performing the following steps as the flexible circuit tape is advanced along the path of travel securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each individual flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define a plurality of finger sensor packages, and stamping out the plurality of finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method of making a finger sensor package comprising:
-
securing a finger sensing integrated circuit (IC) to a flexible circuit, the flexible circuit comprising a flexible layer and a plurality of conductive traces thereon; securing a sensor package frame to the flexible circuit and surrounding the finger sensing IC; applying at least one fluid fill material adjacent the finger sensor IC while using the sensor package frame as a dam; and trimming at least one edge of the flexible circuit and sensor package frame to make the finger sensor package having at least one flush common edge between the sensor package frame and flexible circuit. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
-
-
21. A finger sensor package comprising:
-
a finger sensing integrated circuit (IC); a flexible circuit secured to said finger sensing IC, said flexible circuit comprising a flexible layer and a plurality of conductive traces thereon; a sensor package frame secured to said flexible circuit and surrounding said finger sensing IC; and at least one fill material adjacent said finger sensing IC; at least one edge of said flexible circuit and said sensor package frame having at least one flush common edge therebetween. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30)
-
Specification