PROTECTIVE DEVICE

• US 20120112871A1
• Filed: 11/08/2011
• Published: 05/10/2012
• Est. Priority Date: 11/08/2010
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: CHEN, Kuo-Shu, WANG, Chung-Hsiung
• Granted Patent: US 8,976,001 B2
• Time in Patent Office: Days
• US Class Current: 337/297
• CPC Class Codes: H01H 69/02 Manufacture of fuses
• CPC Class Codes: H01H 69/022 of printed circuit fuses
• CPC Class Codes: H01H 85/0241 Structural association of a fuse and another component or apparatus switches with built-in fuses H01H9/10, spark-gap arresters H01H85/44, transformers and inductances H01F27/402, capacitors H01G2/14, lamps H01K1/66, semiconductors H01L23/5256 or H01L23/62
• CPC Class Codes: H01H 85/0411 Miniature fuses
• CPC Class Codes: H01H 85/044 General constructions or structure of low voltage fuses, i.e. below 1000 V, or of fuses where the applicable voltage is not specified H01H85/046 - H01H85/048 take precedence
• CPC Class Codes: H01H 85/046 Fuses formed as printed circuits
• CPC Class Codes: H01H 85/055 Fusible members
• CPC Class Codes: H01H 85/463 with printed circuit fuse

Abstract

A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.

Claims

1. A protective device, comprising:

a substrate;

two first electrodes respectively arranged at two opposite sides of the substrate;

a low-melting point metal layer arranged over the two first electrodes; and

an assisting layer formed on the low-melting point metal layer,

wherein the liquidus temperature of the assisting layer is below the liquidus temperature of the low-melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature, the predetermined temperature is below the maximum working temperature of reflow soldering process by 25 degrees.

2. The protective device as claim 1, wherein the liquidus temperature of the assisting layer is not below the maximum working temperature of reflow soldering process.

3. The protective device as claim 1, wherein the assisting layer comprises tin.

4. The protective device as claim 1, further comprising a third electrode between the two first electrodes and under the low melting point metal layer.

5. The protective device as claim 4, further comprising a bridging structure on the third electrode and crossing the low melting point metal layer.

6. The protective device as claim 5, wherein the assisting layer is formed by applying a liquid material between the bridging structure and the low melting point metal layer and solidifying the liquid material.

7. The protective device as claim 1, further comprising a heating member on the substrate and two second electrodes respectively arranged at another two opposite sides of the substrate, wherein the two second electrodes are electrically connected to the heating member.

8. The protective device as claim 4, further comprising a heating member located on the substrate, and two second electrodes respectively arranged at another two opposite sides of the substrate, wherein the two second electrodes are electrically connected to the heating member and one of the second electrodes is electrically connected to the third electrode.

9. The protective device as claim 1, wherein the substrate is made of an inorganic material.

10. The protective device as claim 1, wherein the assisting layer is made of material comprising tin, silver, copper or an alloy thereof.

11. A protective device, comprising:

a substrate;

a low-melting point metal layer arranged over the substrate;

an assisting layer formed on the low-melting point metal layer;

a bridging structure crossing the low melting point metal layer; and

a heating member arranged on the substrate,

wherein the liquidus temperature of the assisting layer is below the liquidus temperature of the low-melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature, the predetermined temperature is below the maximum working temperature of reflow soldering process by 25 degrees.

12. The protective device as claim 11, wherein the liquidus temperature of the assisting layer is not below the maximum working temperature of reflow soldering process.

13. The protective device as claim 11, wherein the assisting layer comprises tin.

14. The protective device as claim 11, further comprising two first electrodes respectively arranged at two opposite sides of the substrate and electrically connected to the low-melting point metal layer, and a third electrode between the two first electrodes and under the low melting point metal layer.

15. The protective device as claim 14, wherein the bridging structure is on the third electrode.

16. The protective device as claim 14, further comprising two second electrodes respectively arranged at another two opposite sides of the substrate, wherein the two second electrodes are electrically connected to the heating member and one of the second electrodes is electrically connected to the third electrode.

17. The protective device as claim 14, further comprising an insulating layer located between the heating member and the third electrode, and two second electrodes respectively arranged at another two opposite sides of the substrate, wherein the two second electrodes are electrically connected to the heating member and one of the second electrodes is electrically connected to the third electrode.

18. The protective device as claim 11, wherein the assisting layer is made of material comprising tin, silver, copper or an alloy thereof.