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PROTECTIVE DEVICE

  • US 20120112871A1
  • Filed: 11/08/2011
  • Published: 05/10/2012
  • Est. Priority Date: 11/08/2010
  • Status: Active Grant
First Claim
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1. A protective device, comprising:

  • a substrate;

    two first electrodes respectively arranged at two opposite sides of the substrate;

    a low-melting point metal layer arranged over the two first electrodes; and

    an assisting layer formed on the low-melting point metal layer,wherein the liquidus temperature of the assisting layer is below the liquidus temperature of the low-melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature, the predetermined temperature is below the maximum working temperature of reflow soldering process by 25 degrees.

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